JP7188568B2 - 電子部品および実装構造体 - Google Patents
電子部品および実装構造体 Download PDFInfo
- Publication number
- JP7188568B2 JP7188568B2 JP2021516090A JP2021516090A JP7188568B2 JP 7188568 B2 JP7188568 B2 JP 7188568B2 JP 2021516090 A JP2021516090 A JP 2021516090A JP 2021516090 A JP2021516090 A JP 2021516090A JP 7188568 B2 JP7188568 B2 JP 7188568B2
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- JP
- Japan
- Prior art keywords
- metal
- alloy
- external electrode
- concentration
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910045601 alloy Inorganic materials 0.000 claims description 256
- 239000000956 alloy Substances 0.000 claims description 256
- 229910052751 metal Inorganic materials 0.000 claims description 237
- 239000002184 metal Substances 0.000 claims description 236
- 229910003271 Ni-Fe Inorganic materials 0.000 claims description 89
- 229910000679 solder Inorganic materials 0.000 claims description 63
- 239000000758 substrate Substances 0.000 claims description 46
- 150000002739 metals Chemical class 0.000 claims description 35
- 230000007423 decrease Effects 0.000 claims description 29
- 229910052759 nickel Inorganic materials 0.000 claims description 20
- 238000002844 melting Methods 0.000 claims description 17
- 230000008018 melting Effects 0.000 claims description 17
- 229910052742 iron Inorganic materials 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 229910000765 intermetallic Inorganic materials 0.000 claims description 10
- 229910052763 palladium Inorganic materials 0.000 claims description 10
- 230000000737 periodic effect Effects 0.000 claims description 10
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 9
- 229910005382 FeSn Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 229910052721 tungsten Inorganic materials 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 229910052758 niobium Inorganic materials 0.000 claims description 6
- 229910052741 iridium Inorganic materials 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 229910052702 rhenium Inorganic materials 0.000 claims description 5
- 229910052703 rhodium Inorganic materials 0.000 claims description 5
- 229910052707 ruthenium Inorganic materials 0.000 claims description 5
- 229910001080 W alloy Inorganic materials 0.000 claims description 2
- 229910001252 Pd alloy Inorganic materials 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 106
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 57
- 238000000034 method Methods 0.000 description 52
- 238000007747 plating Methods 0.000 description 43
- 238000012360 testing method Methods 0.000 description 27
- 125000004429 atom Chemical group 0.000 description 19
- 238000004458 analytical method Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 150000002505 iron Chemical class 0.000 description 8
- 239000000654 additive Substances 0.000 description 7
- 230000000996 additive effect Effects 0.000 description 7
- 239000002131 composite material Substances 0.000 description 7
- SURQXAFEQWPFPV-UHFFFAOYSA-L iron(2+) sulfate heptahydrate Chemical compound O.O.O.O.O.O.O.[Fe+2].[O-]S([O-])(=O)=O SURQXAFEQWPFPV-UHFFFAOYSA-L 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 230000003628 erosive effect Effects 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000008139 complexing agent Substances 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- -1 for example Inorganic materials 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- 239000004327 boric acid Substances 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000013507 mapping Methods 0.000 description 3
- 150000002815 nickel Chemical class 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- 229910020888 Sn-Cu Inorganic materials 0.000 description 2
- 229910019204 Sn—Cu Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 2
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 2
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 2
- 229940049703 saccharin sodium dihydrate Drugs 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 101000993059 Homo sapiens Hereditary hemochromatosis protein Proteins 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910001245 Sb alloy Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 229910009071 Sn—Zn—Bi Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 229960002089 ferrous chloride Drugs 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229940053662 nickel sulfate Drugs 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Coils Or Transformers For Communication (AREA)
- Ceramic Capacitors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019086480 | 2019-04-26 | ||
| JP2019086480 | 2019-04-26 | ||
| JP2019181340 | 2019-10-01 | ||
| JP2019181340 | 2019-10-01 | ||
| PCT/JP2020/016963 WO2020218218A1 (ja) | 2019-04-26 | 2020-04-17 | 電子部品および実装構造体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020218218A1 JPWO2020218218A1 (https=) | 2020-10-29 |
| JPWO2020218218A5 JPWO2020218218A5 (https=) | 2022-01-18 |
| JP7188568B2 true JP7188568B2 (ja) | 2022-12-13 |
Family
ID=72942716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021516090A Active JP7188568B2 (ja) | 2019-04-26 | 2020-04-17 | 電子部品および実装構造体 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11776754B2 (https=) |
| JP (1) | JP7188568B2 (https=) |
| CN (1) | CN113728406B (https=) |
| WO (1) | WO2020218218A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240105956A (ko) * | 2022-12-29 | 2024-07-08 | 삼성전기주식회사 | 적층형 전자 부품 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004083955A (ja) | 2002-08-23 | 2004-03-18 | Murata Mfg Co Ltd | セラミック電子部品のめっき方法、及びセラミック電子部品 |
| WO2013132965A1 (ja) | 2012-03-05 | 2013-09-12 | 株式会社村田製作所 | 電子部品 |
| JP2016076582A (ja) | 2014-10-06 | 2016-05-12 | Tdk株式会社 | セラミック電子部品 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0656825B2 (ja) * | 1991-05-09 | 1994-07-27 | 三菱マテリアル株式会社 | セラミックコンデンサ |
| JPH06196351A (ja) | 1992-12-24 | 1994-07-15 | Kyocera Corp | 積層セラミックコンデンサの製造方法 |
| JP4423707B2 (ja) * | 1999-07-22 | 2010-03-03 | Ｔｄｋ株式会社 | 積層セラミック電子部品の製造方法 |
| EP1518841A1 (en) * | 2003-09-24 | 2005-03-30 | Yageo Corporation | Ultralow firing temperature compensating ceramic composition for pure silver eletrode, sintering flux and laminated ceramic element obtained therefrom |
| JP4747604B2 (ja) * | 2005-02-18 | 2011-08-17 | Ｔｄｋ株式会社 | セラミック電子部品 |
| JP6061104B2 (ja) * | 2012-03-05 | 2017-01-18 | 株式会社村田製作所 | 電子部品および電子部品と接合対象物との接合構造体の形成方法 |
| JP5943066B2 (ja) * | 2012-03-05 | 2016-06-29 | 株式会社村田製作所 | 接合方法および接合構造体の製造方法 |
| JP2014229869A (ja) * | 2013-05-27 | 2014-12-08 | 株式会社村田製作所 | セラミック電子部品 |
| JP6112060B2 (ja) * | 2013-06-19 | 2017-04-12 | 株式会社村田製作所 | セラミック電子部品およびその製造方法 |
| JP2018142609A (ja) * | 2017-02-27 | 2018-09-13 | 株式会社村田製作所 | 表面実装型電子部品 |
| JP2018160596A (ja) * | 2017-03-23 | 2018-10-11 | Tdk株式会社 | 外部電極及び外部電極の製造方法 |
| US10971302B2 (en) * | 2018-06-19 | 2021-04-06 | Taiyo Yuden Co., Ltd. | Multilayer ceramic capacitor and manufacturing method of the same |
-
2020
- 2020-04-17 WO PCT/JP2020/016963 patent/WO2020218218A1/ja not_active Ceased
- 2020-04-17 JP JP2021516090A patent/JP7188568B2/ja active Active
- 2020-04-17 CN CN202080031542.9A patent/CN113728406B/zh active Active
-
2021
- 2021-10-26 US US17/510,549 patent/US11776754B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004083955A (ja) | 2002-08-23 | 2004-03-18 | Murata Mfg Co Ltd | セラミック電子部品のめっき方法、及びセラミック電子部品 |
| WO2013132965A1 (ja) | 2012-03-05 | 2013-09-12 | 株式会社村田製作所 | 電子部品 |
| JP2016076582A (ja) | 2014-10-06 | 2016-05-12 | Tdk株式会社 | セラミック電子部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2020218218A1 (https=) | 2020-10-29 |
| CN113728406A (zh) | 2021-11-30 |
| US11776754B2 (en) | 2023-10-03 |
| CN113728406B (zh) | 2023-05-23 |
| US20220044873A1 (en) | 2022-02-10 |
| WO2020218218A1 (ja) | 2020-10-29 |
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