CN113728406B - 电子部件和安装结构体 - Google Patents

电子部件和安装结构体 Download PDF

Info

Publication number
CN113728406B
CN113728406B CN202080031542.9A CN202080031542A CN113728406B CN 113728406 B CN113728406 B CN 113728406B CN 202080031542 A CN202080031542 A CN 202080031542A CN 113728406 B CN113728406 B CN 113728406B
Authority
CN
China
Prior art keywords
metal
alloy
layer
concentration
external electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080031542.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN113728406A (zh
Inventor
黑田茂之
荒川裕介
山本千秋
大谷慎士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN113728406A publication Critical patent/CN113728406A/zh
Application granted granted Critical
Publication of CN113728406B publication Critical patent/CN113728406B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Ceramic Capacitors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN202080031542.9A 2019-04-26 2020-04-17 电子部件和安装结构体 Active CN113728406B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019-086480 2019-04-26
JP2019086480 2019-04-26
JP2019-181340 2019-10-01
JP2019181340 2019-10-01
PCT/JP2020/016963 WO2020218218A1 (ja) 2019-04-26 2020-04-17 電子部品および実装構造体

Publications (2)

Publication Number Publication Date
CN113728406A CN113728406A (zh) 2021-11-30
CN113728406B true CN113728406B (zh) 2023-05-23

Family

ID=72942716

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080031542.9A Active CN113728406B (zh) 2019-04-26 2020-04-17 电子部件和安装结构体

Country Status (4)

Country Link
US (1) US11776754B2 (https=)
JP (1) JP7188568B2 (https=)
CN (1) CN113728406B (https=)
WO (1) WO2020218218A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240105956A (ko) * 2022-12-29 2024-07-08 삼성전기주식회사 적층형 전자 부품

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1822263A (zh) * 2005-02-18 2006-08-23 Tdk株式会社 陶瓷电子部件和层叠电容器
WO2013132965A1 (ja) * 2012-03-05 2013-09-12 株式会社村田製作所 電子部品
CN104144764A (zh) * 2012-03-05 2014-11-12 株式会社村田制作所 接合方法、接合结构体及其制造方法
CN104160463A (zh) * 2012-03-05 2014-11-19 株式会社村田制作所 电子部件及电子部件与接合对象物的接合结构体的形成方法
JP2014229869A (ja) * 2013-05-27 2014-12-08 株式会社村田製作所 セラミック電子部品
JP2018160596A (ja) * 2017-03-23 2018-10-11 Tdk株式会社 外部電極及び外部電極の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0656825B2 (ja) * 1991-05-09 1994-07-27 三菱マテリアル株式会社 セラミックコンデンサ
JPH06196351A (ja) 1992-12-24 1994-07-15 Kyocera Corp 積層セラミックコンデンサの製造方法
JP4423707B2 (ja) * 1999-07-22 2010-03-03 Ｔｄｋ株式会社 積層セラミック電子部品の製造方法
JP2004083955A (ja) * 2002-08-23 2004-03-18 Murata Mfg Co Ltd セラミック電子部品のめっき方法、及びセラミック電子部品
EP1518841A1 (en) * 2003-09-24 2005-03-30 Yageo Corporation Ultralow firing temperature compensating ceramic composition for pure silver eletrode, sintering flux and laminated ceramic element obtained therefrom
JP6112060B2 (ja) * 2013-06-19 2017-04-12 株式会社村田製作所 セラミック電子部品およびその製造方法
JP2016076582A (ja) * 2014-10-06 2016-05-12 Tdk株式会社 セラミック電子部品
JP2018142609A (ja) * 2017-02-27 2018-09-13 株式会社村田製作所 表面実装型電子部品
US10971302B2 (en) * 2018-06-19 2021-04-06 Taiyo Yuden Co., Ltd. Multilayer ceramic capacitor and manufacturing method of the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1822263A (zh) * 2005-02-18 2006-08-23 Tdk株式会社 陶瓷电子部件和层叠电容器
WO2013132965A1 (ja) * 2012-03-05 2013-09-12 株式会社村田製作所 電子部品
CN104144764A (zh) * 2012-03-05 2014-11-12 株式会社村田制作所 接合方法、接合结构体及其制造方法
CN104160463A (zh) * 2012-03-05 2014-11-19 株式会社村田制作所 电子部件及电子部件与接合对象物的接合结构体的形成方法
JP2014229869A (ja) * 2013-05-27 2014-12-08 株式会社村田製作所 セラミック電子部品
JP2018160596A (ja) * 2017-03-23 2018-10-11 Tdk株式会社 外部電極及び外部電極の製造方法

Also Published As

Publication number Publication date
JPWO2020218218A1 (https=) 2020-10-29
CN113728406A (zh) 2021-11-30
US11776754B2 (en) 2023-10-03
JP7188568B2 (ja) 2022-12-13
US20220044873A1 (en) 2022-02-10
WO2020218218A1 (ja) 2020-10-29

Similar Documents

Publication Publication Date Title
US10615327B2 (en) Monolithic ceramic electronic component
TWI592960B (zh) A method of forming a bonded structure of an electronic component, an electronic component, and an object to be bonded
US9165714B2 (en) Electronic component
TWI618798B (zh) 無鉛焊合金
US20020185716A1 (en) Metal article coated with multilayer finish inhibiting whisker growth
US8717739B2 (en) Ceramic electronic component
CN104145317B (zh) 电子部件
US20250357050A1 (en) Multi-layer ceramic electronic component, and circuit board
US20140041930A1 (en) Electronic component
JP2018098475A (ja) 積層セラミックコンデンサ
US9320146B2 (en) Electronic circuit module component
JP2009141292A (ja) 外部端子電極具備電子部品、その搭載電子用品及び外部端子電極具備電子部品の製造方法
JP2012237033A (ja) 電子部品
JP2021019008A (ja) 電子部品
JP2019117899A (ja) 積層電子部品
CN113728406B (zh) 电子部件和安装结构体
EP1774065A1 (en) Electronic component having tin rich deposit layer and the process for depositing the same
KR102906491B1 (ko) 적층 세라믹 전자부품
JP4895827B2 (ja) めっき部材およびその製造方法
JP2019117900A (ja) 積層電子部品
US20260024702A1 (en) Mounting structure of electronic component
CN114424413A (zh) 销端子、连接器、带连接器线束以及控制单元
TW200307362A (en) Electronic component and method of manufacturing same
JP2021027196A (ja) 電子部品および実装構造体
WO2023037747A1 (ja) 実装構造体

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant