JPWO2020218218A1 - - Google Patents

Info

Publication number
JPWO2020218218A1
JPWO2020218218A1 JP2021516090A JP2021516090A JPWO2020218218A1 JP WO2020218218 A1 JPWO2020218218 A1 JP WO2020218218A1 JP 2021516090 A JP2021516090 A JP 2021516090A JP 2021516090 A JP2021516090 A JP 2021516090A JP WO2020218218 A1 JPWO2020218218 A1 JP WO2020218218A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021516090A
Other languages
Japanese (ja)
Other versions
JP7188568B2 (ja
JPWO2020218218A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020218218A1 publication Critical patent/JPWO2020218218A1/ja
Publication of JPWO2020218218A5 publication Critical patent/JPWO2020218218A5/ja
Application granted granted Critical
Publication of JP7188568B2 publication Critical patent/JP7188568B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Ceramic Capacitors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2021516090A 2019-04-26 2020-04-17 電子部品および実装構造体 Active JP7188568B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019086480 2019-04-26
JP2019086480 2019-04-26
JP2019181340 2019-10-01
JP2019181340 2019-10-01
PCT/JP2020/016963 WO2020218218A1 (ja) 2019-04-26 2020-04-17 電子部品および実装構造体

Publications (3)

Publication Number Publication Date
JPWO2020218218A1 true JPWO2020218218A1 (https=) 2020-10-29
JPWO2020218218A5 JPWO2020218218A5 (https=) 2022-01-18
JP7188568B2 JP7188568B2 (ja) 2022-12-13

Family

ID=72942716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021516090A Active JP7188568B2 (ja) 2019-04-26 2020-04-17 電子部品および実装構造体

Country Status (4)

Country Link
US (1) US11776754B2 (https=)
JP (1) JP7188568B2 (https=)
CN (1) CN113728406B (https=)
WO (1) WO2020218218A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240105956A (ko) * 2022-12-29 2024-07-08 삼성전기주식회사 적층형 전자 부품

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04334007A (ja) * 1991-05-09 1992-11-20 Mitsubishi Materials Corp セラミックコンデンサ
JP2004083955A (ja) * 2002-08-23 2004-03-18 Murata Mfg Co Ltd セラミック電子部品のめっき方法、及びセラミック電子部品
WO2013132965A1 (ja) * 2012-03-05 2013-09-12 株式会社村田製作所 電子部品
JP2016076582A (ja) * 2014-10-06 2016-05-12 Tdk株式会社 セラミック電子部品

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06196351A (ja) 1992-12-24 1994-07-15 Kyocera Corp 積層セラミックコンデンサの製造方法
JP4423707B2 (ja) * 1999-07-22 2010-03-03 Ｔｄｋ株式会社 積層セラミック電子部品の製造方法
EP1518841A1 (en) * 2003-09-24 2005-03-30 Yageo Corporation Ultralow firing temperature compensating ceramic composition for pure silver eletrode, sintering flux and laminated ceramic element obtained therefrom
JP4747604B2 (ja) * 2005-02-18 2011-08-17 Ｔｄｋ株式会社 セラミック電子部品
JP6061104B2 (ja) * 2012-03-05 2017-01-18 株式会社村田製作所 電子部品および電子部品と接合対象物との接合構造体の形成方法
JP5943066B2 (ja) * 2012-03-05 2016-06-29 株式会社村田製作所 接合方法および接合構造体の製造方法
JP2014229869A (ja) * 2013-05-27 2014-12-08 株式会社村田製作所 セラミック電子部品
JP6112060B2 (ja) * 2013-06-19 2017-04-12 株式会社村田製作所 セラミック電子部品およびその製造方法
JP2018142609A (ja) * 2017-02-27 2018-09-13 株式会社村田製作所 表面実装型電子部品
JP2018160596A (ja) * 2017-03-23 2018-10-11 Tdk株式会社 外部電極及び外部電極の製造方法
US10971302B2 (en) * 2018-06-19 2021-04-06 Taiyo Yuden Co., Ltd. Multilayer ceramic capacitor and manufacturing method of the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04334007A (ja) * 1991-05-09 1992-11-20 Mitsubishi Materials Corp セラミックコンデンサ
JP2004083955A (ja) * 2002-08-23 2004-03-18 Murata Mfg Co Ltd セラミック電子部品のめっき方法、及びセラミック電子部品
WO2013132965A1 (ja) * 2012-03-05 2013-09-12 株式会社村田製作所 電子部品
JP2016076582A (ja) * 2014-10-06 2016-05-12 Tdk株式会社 セラミック電子部品

Also Published As

Publication number Publication date
CN113728406A (zh) 2021-11-30
US11776754B2 (en) 2023-10-03
JP7188568B2 (ja) 2022-12-13
CN113728406B (zh) 2023-05-23
US20220044873A1 (en) 2022-02-10
WO2020218218A1 (ja) 2020-10-29

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