JP7178541B2 - 発光部品実装装置および発光部品実装方法 - Google Patents

発光部品実装装置および発光部品実装方法 Download PDF

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Publication number
JP7178541B2
JP7178541B2 JP2018019714A JP2018019714A JP7178541B2 JP 7178541 B2 JP7178541 B2 JP 7178541B2 JP 2018019714 A JP2018019714 A JP 2018019714A JP 2018019714 A JP2018019714 A JP 2018019714A JP 7178541 B2 JP7178541 B2 JP 7178541B2
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Japan
Prior art keywords
light
emitting component
unit
emitting
component
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JP2018019714A
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Japanese (ja)
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JP2019140160A (ja
JP2019140160A5 (enExample
Inventor
秀明 加藤
浩二 桜井
政典 池田
直樹 東
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2018019714A priority Critical patent/JP7178541B2/ja
Priority to US16/247,748 priority patent/US11293626B2/en
Priority to CN201910102817.2A priority patent/CN110121255B/zh
Priority to DE102019201289.2A priority patent/DE102019201289A1/de
Publication of JP2019140160A publication Critical patent/JP2019140160A/ja
Publication of JP2019140160A5 publication Critical patent/JP2019140160A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V14/00—Controlling the distribution of the light emitted by adjustment of elements
    • F21V14/02—Controlling the distribution of the light emitted by adjustment of elements by movement of light sources
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2018019714A 2018-02-07 2018-02-07 発光部品実装装置および発光部品実装方法 Active JP7178541B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018019714A JP7178541B2 (ja) 2018-02-07 2018-02-07 発光部品実装装置および発光部品実装方法
US16/247,748 US11293626B2 (en) 2018-02-07 2019-01-15 Light emitting component mounting method
CN201910102817.2A CN110121255B (zh) 2018-02-07 2019-01-31 发光部件安装装置以及发光部件安装方法
DE102019201289.2A DE102019201289A1 (de) 2018-02-07 2019-02-01 Halter für ein lichtemittierendes Bauteil und Verfahren zur Befestigung eines lichtemittierenden Bauteils

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018019714A JP7178541B2 (ja) 2018-02-07 2018-02-07 発光部品実装装置および発光部品実装方法

Publications (3)

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JP2019140160A JP2019140160A (ja) 2019-08-22
JP2019140160A5 JP2019140160A5 (enExample) 2021-05-20
JP7178541B2 true JP7178541B2 (ja) 2022-11-28

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JP2018019714A Active JP7178541B2 (ja) 2018-02-07 2018-02-07 発光部品実装装置および発光部品実装方法

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US (1) US11293626B2 (enExample)
JP (1) JP7178541B2 (enExample)
CN (1) CN110121255B (enExample)
DE (1) DE102019201289A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7426555B2 (ja) * 2019-10-29 2024-02-02 パナソニックＩｐマネジメント株式会社 部品実装装置および実装基板の製造方法
CN113242688B (zh) * 2021-06-15 2022-09-20 重庆睿博光电股份有限公司 内饰小灯全自动装配线

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000286452A (ja) 1999-03-29 2000-10-13 Fuji Photo Film Co Ltd 発光素子の発光中心検出方法
JP2015159285A (ja) 2014-02-14 2015-09-03 エーエスエム・アセンブリー・システムズ・ゲーエムベーハー・ウント・コ・カーゲー 対向面に存在する構造的特徴を有する部品の光学的測定
JP2015233121A (ja) 2014-06-09 2015-12-24 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 光源モジュールの不良検査方法及び光源モジュールの製造方法
JP2016100379A (ja) 2014-11-19 2016-05-30 パナソニックＩｐマネジメント株式会社 部品搭載装置および部品搭載方法ならびに部品搭載システム
JP2017139388A (ja) 2016-02-04 2017-08-10 富士機械製造株式会社 実装装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2983804B2 (ja) * 1993-08-02 1999-11-29 シャープ株式会社 発光素子の発光点検出方法および位置決め装置
JP3448960B2 (ja) * 1994-06-27 2003-09-22 ソニー株式会社 発光デバイスの組立装置及びその組立方法
EP1003212A3 (en) * 1998-11-18 2003-11-19 Fuji Photo Film Co., Ltd. Method of and apparatus for bonding light-emitting element
JP2000150970A (ja) * 1998-11-18 2000-05-30 Fuji Photo Film Co Ltd 発光素子のボンディング方法および装置
DE60321350D1 (de) * 2002-08-08 2008-07-10 Matsushita Electric Industrial Co Ltd Vorrichtung und verfahren zum ermitteln ob ein bauelemententräger gut ist, und maschine und verfahren zur montage eines elektronischen bauteils
JP2005003385A (ja) * 2003-06-09 2005-01-06 Mitsutoyo Corp 画像測定方法、および画像測定装置
JP2007065414A (ja) * 2005-08-31 2007-03-15 Sharp Corp バックライト製造方法
US7967652B2 (en) * 2009-02-19 2011-06-28 Cree, Inc. Methods for combining light emitting devices in a package and packages including combined light emitting devices
JP5338773B2 (ja) * 2010-08-26 2013-11-13 パナソニック株式会社 部品実装用装置および撮像用の照明装置ならびに照明方法
JP2013152207A (ja) * 2011-12-31 2013-08-08 Shibaura Mechatronics Corp 検査装置及び検査方法
JP6259274B2 (ja) * 2012-12-11 2018-01-10 ヤマハ発動機株式会社 部品装着装置
JP6450923B2 (ja) 2013-12-20 2019-01-16 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法ならびに電子部品実装装置
CN106537615B (zh) * 2014-08-04 2019-08-20 株式会社富士 安装装置
JP6398082B2 (ja) * 2015-02-26 2018-10-03 パナソニックＩｐマネジメント株式会社 部品実装方法および部品実装装置
CN109983859B (zh) * 2016-12-07 2020-08-25 雅马哈发动机株式会社 表面安装机、元件识别装置、元件识别方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000286452A (ja) 1999-03-29 2000-10-13 Fuji Photo Film Co Ltd 発光素子の発光中心検出方法
JP2015159285A (ja) 2014-02-14 2015-09-03 エーエスエム・アセンブリー・システムズ・ゲーエムベーハー・ウント・コ・カーゲー 対向面に存在する構造的特徴を有する部品の光学的測定
JP2015233121A (ja) 2014-06-09 2015-12-24 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 光源モジュールの不良検査方法及び光源モジュールの製造方法
JP2016100379A (ja) 2014-11-19 2016-05-30 パナソニックＩｐマネジメント株式会社 部品搭載装置および部品搭載方法ならびに部品搭載システム
JP2017139388A (ja) 2016-02-04 2017-08-10 富士機械製造株式会社 実装装置

Also Published As

Publication number Publication date
US20190242558A1 (en) 2019-08-08
DE102019201289A1 (de) 2019-08-08
CN110121255A (zh) 2019-08-13
JP2019140160A (ja) 2019-08-22
CN110121255B (zh) 2022-03-15
US11293626B2 (en) 2022-04-05

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