CN110121255B - 发光部件安装装置以及发光部件安装方法 - Google Patents

发光部件安装装置以及发光部件安装方法 Download PDF

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Publication number
CN110121255B
CN110121255B CN201910102817.2A CN201910102817A CN110121255B CN 110121255 B CN110121255 B CN 110121255B CN 201910102817 A CN201910102817 A CN 201910102817A CN 110121255 B CN110121255 B CN 110121255B
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China
Prior art keywords
light
light emitting
luminance distribution
component
emitting component
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CN201910102817.2A
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English (en)
Chinese (zh)
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CN110121255A (zh
Inventor
加藤秀明
樱井浩二
池田政典
东直树
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V14/00—Controlling the distribution of the light emitted by adjustment of elements
    • F21V14/02—Controlling the distribution of the light emitted by adjustment of elements by movement of light sources
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN201910102817.2A 2018-02-07 2019-01-31 发光部件安装装置以及发光部件安装方法 Active CN110121255B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018019714A JP7178541B2 (ja) 2018-02-07 2018-02-07 発光部品実装装置および発光部品実装方法
JP2018-019714 2018-02-07

Publications (2)

Publication Number Publication Date
CN110121255A CN110121255A (zh) 2019-08-13
CN110121255B true CN110121255B (zh) 2022-03-15

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Country Status (4)

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US (1) US11293626B2 (enExample)
JP (1) JP7178541B2 (enExample)
CN (1) CN110121255B (enExample)
DE (1) DE102019201289A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7426555B2 (ja) * 2019-10-29 2024-02-02 パナソニックＩｐマネジメント株式会社 部品実装装置および実装基板の製造方法
CN113242688B (zh) * 2021-06-15 2022-09-20 重庆睿博光电股份有限公司 内饰小灯全自动装配线

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0743112A (ja) * 1993-08-02 1995-02-10 Sharp Corp 発光素子の発光点検出方法および位置決め装置
EP1003212A2 (en) * 1998-11-18 2000-05-24 Fuji Photo Film Co., Ltd. Method of and apparatus for bonding light-emitting element
CN103874406A (zh) * 2012-12-11 2014-06-18 株式会社日立高新技术仪器 部件安装装置
CN105934145A (zh) * 2015-02-26 2016-09-07 松下知识产权经营株式会社 部件安装方法以及部件安装装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3448960B2 (ja) * 1994-06-27 2003-09-22 ソニー株式会社 発光デバイスの組立装置及びその組立方法
JP2000150970A (ja) * 1998-11-18 2000-05-30 Fuji Photo Film Co Ltd 発光素子のボンディング方法および装置
JP2000286452A (ja) * 1999-03-29 2000-10-13 Fuji Photo Film Co Ltd 発光素子の発光中心検出方法
DE60321350D1 (de) * 2002-08-08 2008-07-10 Matsushita Electric Industrial Co Ltd Vorrichtung und verfahren zum ermitteln ob ein bauelemententräger gut ist, und maschine und verfahren zur montage eines elektronischen bauteils
JP2005003385A (ja) * 2003-06-09 2005-01-06 Mitsutoyo Corp 画像測定方法、および画像測定装置
JP2007065414A (ja) * 2005-08-31 2007-03-15 Sharp Corp バックライト製造方法
US7967652B2 (en) * 2009-02-19 2011-06-28 Cree, Inc. Methods for combining light emitting devices in a package and packages including combined light emitting devices
JP5338773B2 (ja) * 2010-08-26 2013-11-13 パナソニック株式会社 部品実装用装置および撮像用の照明装置ならびに照明方法
JP2013152207A (ja) * 2011-12-31 2013-08-08 Shibaura Mechatronics Corp 検査装置及び検査方法
JP6450923B2 (ja) 2013-12-20 2019-01-16 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法ならびに電子部品実装装置
DE102014101901B4 (de) * 2014-02-14 2015-10-15 Asm Assembly Systems Gmbh & Co. Kg Optisches Vermessen eines Bauelementes mit an gegenüberliegenden Seiten vorhandenen strukturellen Merkmalen
KR102192572B1 (ko) * 2014-06-09 2020-12-18 삼성전자주식회사 광원 모듈의 불량 검사방법, 광원 모듈의 제조 방법 및 광원 모듈 검사장치
CN106537615B (zh) * 2014-08-04 2019-08-20 株式会社富士 安装装置
JP2016100379A (ja) * 2014-11-19 2016-05-30 パナソニックＩｐマネジメント株式会社 部品搭載装置および部品搭載方法ならびに部品搭載システム
JP6828223B2 (ja) * 2016-02-04 2021-02-10 株式会社Ｆｕｊｉ 実装装置
CN109983859B (zh) * 2016-12-07 2020-08-25 雅马哈发动机株式会社 表面安装机、元件识别装置、元件识别方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0743112A (ja) * 1993-08-02 1995-02-10 Sharp Corp 発光素子の発光点検出方法および位置決め装置
EP1003212A2 (en) * 1998-11-18 2000-05-24 Fuji Photo Film Co., Ltd. Method of and apparatus for bonding light-emitting element
CN103874406A (zh) * 2012-12-11 2014-06-18 株式会社日立高新技术仪器 部件安装装置
CN105934145A (zh) * 2015-02-26 2016-09-07 松下知识产权经营株式会社 部件安装方法以及部件安装装置

Also Published As

Publication number Publication date
US20190242558A1 (en) 2019-08-08
DE102019201289A1 (de) 2019-08-08
CN110121255A (zh) 2019-08-13
JP2019140160A (ja) 2019-08-22
JP7178541B2 (ja) 2022-11-28
US11293626B2 (en) 2022-04-05

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