JP7173799B2 - 半導体装置の製造方法およびエッチングガス - Google Patents
半導体装置の製造方法およびエッチングガス Download PDFInfo
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- JP7173799B2 JP7173799B2 JP2018169983A JP2018169983A JP7173799B2 JP 7173799 B2 JP7173799 B2 JP 7173799B2 JP 2018169983 A JP2018169983 A JP 2018169983A JP 2018169983 A JP2018169983 A JP 2018169983A JP 7173799 B2 JP7173799 B2 JP 7173799B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Non-Volatile Memory (AREA)
Description
図1は、第1実施形態の半導体装置の製造方法を示す断面図である。本実施形態の半導体装置については、3次元メモリを一例として説明する。
2c:第2絶縁膜、3:犠牲層、3’:電極層、4:絶縁層、
5:上部層、5a:カバー絶縁膜、5b:ドレイン側導電層、
5c:第1層間絶縁膜、5d:第2層間絶縁膜、6:マスク層、7:保護膜、
11:ブロック絶縁膜、12:電荷蓄積層、13:トンネル絶縁膜、
14:チャネル半導体層、15:コア絶縁膜、16:コンタクトプラグ
Claims (2)
- CxHyFz(Cは炭素、Hは水素、Fはフッ素を表し、xは3以上の整数を表し、かつ、yおよびzはそれぞれ1以上の整数を表す)で示される鎖状炭化水素化合物を含み、
前記CxHyFzの炭素鎖上の各末端の炭素原子は、水素原子およびフッ素原子のうちのフッ素原子のみと結合している鎖状炭化水素化合物であり、
前記CxHyFzは、C4H3F7、C4H2F8 、C5H6F6、C5H5F7、C5H4F8、C5H3F9、C5H2F10、およびC5HF11の少なくともいずれかを含む、エッチングガス。 - さらに、酸素ガス、希ガス、およびCaFbで示されるフッ化炭素化合物ガス(aおよびbはそれぞれ1以上の整数を表す)のうちの少なくともいずれかを含むエッチングガスである、請求項1に記載のエッチングガス。
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018169983A JP7173799B2 (ja) | 2018-09-11 | 2018-09-11 | 半導体装置の製造方法およびエッチングガス |
CN201980059146.4A CN112673459A (zh) | 2018-09-11 | 2019-07-10 | 半导体装置的制造方法和蚀刻气体 |
KR1020237021037A KR102657842B1 (ko) | 2018-09-11 | 2019-07-10 | 반도체 장치의 제조 방법 및 에칭 가스 |
PCT/JP2019/027316 WO2020054200A1 (ja) | 2018-09-11 | 2019-07-10 | 半導体装置の製造方法およびエッチングガス |
KR1020217007286A KR102587426B1 (ko) | 2018-09-11 | 2019-07-10 | 반도체 장치의 제조 방법 및 에칭 가스 |
EP19858978.0A EP3852131A4 (en) | 2018-09-11 | 2019-07-10 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE AND ETCHING GAS |
TW108125426A TWI724465B (zh) | 2018-09-11 | 2019-07-18 | 半導體裝置之製造方法及蝕刻氣體 |
US17/197,544 US20210193475A1 (en) | 2018-09-11 | 2021-03-10 | Method of manufacturing semiconductor device, and etching gas |
JP2022174854A JP7400058B2 (ja) | 2018-09-11 | 2022-10-31 | 半導体装置の製造方法およびエッチング方法 |
US18/325,640 US20230307244A1 (en) | 2018-09-11 | 2023-05-30 | Method of manufacturing semiconductor device, and etching gas |
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JP2018169983A JP7173799B2 (ja) | 2018-09-11 | 2018-09-11 | 半導体装置の製造方法およびエッチングガス |
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JP2020043239A JP2020043239A (ja) | 2020-03-19 |
JP7173799B2 true JP7173799B2 (ja) | 2022-11-16 |
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JP2022174854A Active JP7400058B2 (ja) | 2018-09-11 | 2022-10-31 | 半導体装置の製造方法およびエッチング方法 |
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US (2) | US20210193475A1 (ja) |
EP (1) | EP3852131A4 (ja) |
JP (2) | JP7173799B2 (ja) |
KR (2) | KR102587426B1 (ja) |
CN (1) | CN112673459A (ja) |
TW (1) | TWI724465B (ja) |
WO (1) | WO2020054200A1 (ja) |
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CN117936454A (zh) * | 2022-10-11 | 2024-04-26 | 长鑫存储技术有限公司 | 半导体结构的制作方法及半导体结构 |
Citations (6)
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JP2010189338A (ja) | 2009-02-19 | 2010-09-02 | Nippon Zeon Co Ltd | ハロゲン化化合物を脱ハロゲン化水素する方法 |
WO2013015033A1 (ja) | 2011-07-27 | 2013-01-31 | セントラル硝子株式会社 | ドライエッチング剤 |
WO2014104290A1 (ja) | 2012-12-27 | 2014-07-03 | 日本ゼオン株式会社 | ドライエッチング方法 |
WO2016117463A1 (ja) | 2015-01-22 | 2016-07-28 | 日本ゼオン株式会社 | フッ素化炭化水素化合物の精製方法 |
JP2016139782A (ja) | 2015-01-23 | 2016-08-04 | セントラル硝子株式会社 | ドライエッチング方法 |
JP2017163032A (ja) | 2016-03-10 | 2017-09-14 | 東芝メモリ株式会社 | 半導体装置の製造方法 |
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US5935877A (en) * | 1995-09-01 | 1999-08-10 | Applied Materials, Inc. | Etch process for forming contacts over titanium silicide |
US5876664A (en) * | 1996-06-14 | 1999-03-02 | American Sterilizer Company | Continuous-operation, closed loop decontamination system and method |
JPH10199865A (ja) * | 1996-10-30 | 1998-07-31 | Agency Of Ind Science & Technol | ドライエッチング用ガス組成物およびドライエッチング方法 |
JP5569353B2 (ja) | 2000-04-28 | 2014-08-13 | ダイキン工業株式会社 | ドライエッチングガスおよびドライエッチング方法 |
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JP2007537602A (ja) * | 2004-05-11 | 2007-12-20 | アプライド マテリアルズ インコーポレイテッド | フルオロカーボン化学エッチングにおけるh2添加物を使用しての炭素ドープ酸化ケイ素エッチング |
JP2006128245A (ja) | 2004-10-27 | 2006-05-18 | Sony Corp | 絶縁膜の加工方法 |
JP2006156539A (ja) | 2004-11-26 | 2006-06-15 | National Institute Of Advanced Industrial & Technology | プラズマ反応用ガス |
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2018
- 2018-09-11 JP JP2018169983A patent/JP7173799B2/ja active Active
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2019
- 2019-07-10 KR KR1020217007286A patent/KR102587426B1/ko active IP Right Grant
- 2019-07-10 EP EP19858978.0A patent/EP3852131A4/en active Pending
- 2019-07-10 CN CN201980059146.4A patent/CN112673459A/zh active Pending
- 2019-07-10 WO PCT/JP2019/027316 patent/WO2020054200A1/ja unknown
- 2019-07-10 KR KR1020237021037A patent/KR102657842B1/ko active IP Right Grant
- 2019-07-18 TW TW108125426A patent/TWI724465B/zh active
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2021
- 2021-03-10 US US17/197,544 patent/US20210193475A1/en not_active Abandoned
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2022
- 2022-10-31 JP JP2022174854A patent/JP7400058B2/ja active Active
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- 2023-05-30 US US18/325,640 patent/US20230307244A1/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010189338A (ja) | 2009-02-19 | 2010-09-02 | Nippon Zeon Co Ltd | ハロゲン化化合物を脱ハロゲン化水素する方法 |
WO2013015033A1 (ja) | 2011-07-27 | 2013-01-31 | セントラル硝子株式会社 | ドライエッチング剤 |
WO2014104290A1 (ja) | 2012-12-27 | 2014-07-03 | 日本ゼオン株式会社 | ドライエッチング方法 |
WO2016117463A1 (ja) | 2015-01-22 | 2016-07-28 | 日本ゼオン株式会社 | フッ素化炭化水素化合物の精製方法 |
JP2016139782A (ja) | 2015-01-23 | 2016-08-04 | セントラル硝子株式会社 | ドライエッチング方法 |
JP2017163032A (ja) | 2016-03-10 | 2017-09-14 | 東芝メモリ株式会社 | 半導体装置の製造方法 |
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Publication number | Publication date |
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TW202010869A (zh) | 2020-03-16 |
US20210193475A1 (en) | 2021-06-24 |
WO2020054200A1 (ja) | 2020-03-19 |
CN112673459A (zh) | 2021-04-16 |
KR20230097221A (ko) | 2023-06-30 |
JP7400058B2 (ja) | 2023-12-18 |
TWI724465B (zh) | 2021-04-11 |
US20230307244A1 (en) | 2023-09-28 |
EP3852131A4 (en) | 2022-05-25 |
KR102587426B1 (ko) | 2023-10-11 |
JP2020043239A (ja) | 2020-03-19 |
JP2023002798A (ja) | 2023-01-10 |
KR102657842B1 (ko) | 2024-04-17 |
KR20210053905A (ko) | 2021-05-12 |
EP3852131A1 (en) | 2021-07-21 |
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