JP7168648B2 - 硬化性シリコーン光学的透明接着剤およびその使用 - Google Patents
硬化性シリコーン光学的透明接着剤およびその使用 Download PDFInfo
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- JP7168648B2 JP7168648B2 JP2020505409A JP2020505409A JP7168648B2 JP 7168648 B2 JP7168648 B2 JP 7168648B2 JP 2020505409 A JP2020505409 A JP 2020505409A JP 2020505409 A JP2020505409 A JP 2020505409A JP 7168648 B2 JP7168648 B2 JP 7168648B2
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- Prior art keywords
- hydroxy
- optically clear
- siloxane polymer
- clear adhesive
- curable silicone
- Prior art date
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- 230000001070 adhesive effect Effects 0.000 title claims description 91
- 239000000853 adhesive Substances 0.000 title claims description 87
- 229920001296 polysiloxane Polymers 0.000 title claims description 66
- 229920000642 polymer Polymers 0.000 claims description 89
- -1 polydimethylsiloxane Polymers 0.000 claims description 64
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 61
- 239000003054 catalyst Substances 0.000 claims description 56
- 239000000203 mixture Substances 0.000 claims description 54
- 229920002050 silicone resin Polymers 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 25
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 23
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 21
- 239000007795 chemical reaction product Substances 0.000 claims description 20
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 18
- 229920001187 thermosetting polymer Polymers 0.000 claims description 17
- 229910000077 silane Inorganic materials 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- 150000004678 hydrides Chemical class 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 9
- 125000000524 functional group Chemical group 0.000 claims description 8
- 238000013007 heat curing Methods 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- 125000001979 organolithium group Chemical group 0.000 claims description 6
- 229920002799 BoPET Polymers 0.000 claims description 5
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 5
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 claims description 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 239000003153 chemical reaction reagent Substances 0.000 claims description 4
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 4
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 claims description 2
- NUFVQEIPPHHQCK-UHFFFAOYSA-N ethenyl-methoxy-dimethylsilane Chemical compound CO[Si](C)(C)C=C NUFVQEIPPHHQCK-UHFFFAOYSA-N 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 150000004795 grignard reagents Chemical class 0.000 claims description 2
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 2
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 claims 2
- 229910002621 H2PtCl6 Inorganic materials 0.000 claims 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 claims 1
- 239000010408 film Substances 0.000 description 49
- 239000000758 substrate Substances 0.000 description 30
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 18
- 239000002313 adhesive film Substances 0.000 description 16
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 16
- 238000001723 curing Methods 0.000 description 15
- 239000002585 base Substances 0.000 description 14
- 239000011572 manganese Substances 0.000 description 14
- 238000012360 testing method Methods 0.000 description 13
- 125000003118 aryl group Chemical group 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 239000002904 solvent Substances 0.000 description 12
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 10
- 125000000217 alkyl group Chemical group 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 238000013008 moisture curing Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 230000005855 radiation Effects 0.000 description 10
- 239000002318 adhesion promoter Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000006482 condensation reaction Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 150000004756 silanes Chemical class 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000008393 encapsulating agent Substances 0.000 description 6
- 239000004615 ingredient Substances 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 239000000376 reactant Substances 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000011541 reaction mixture Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000013500 performance material Substances 0.000 description 4
- 239000003504 photosensitizing agent Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 4
- XAASNKQYFKTYTR-UHFFFAOYSA-N tris(trimethylsilyloxy)silicon Chemical compound C[Si](C)(C)O[Si](O[Si](C)(C)C)O[Si](C)(C)C XAASNKQYFKTYTR-UHFFFAOYSA-N 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 125000005370 alkoxysilyl group Chemical group 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000004203 carnauba wax Substances 0.000 description 3
- 238000006555 catalytic reaction Methods 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 238000004073 vulcanization Methods 0.000 description 3
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 2
- LXOFYPKXCSULTL-UHFFFAOYSA-N 2,4,7,9-tetramethyldec-5-yne-4,7-diol Chemical compound CC(C)CC(C)(O)C#CC(C)(O)CC(C)C LXOFYPKXCSULTL-UHFFFAOYSA-N 0.000 description 2
- KUQVFOOAIOMQOT-UHFFFAOYSA-N 2-methylpropyltin Chemical compound CC(C)C[Sn] KUQVFOOAIOMQOT-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229920004482 WACKER® Polymers 0.000 description 2
- ZGGGFLCIYHJOBB-UHFFFAOYSA-N [Sn].C(CCCCCC(C)(C)C)(=O)OC.C(CCCCCC(C)(C)C)(=O)OC Chemical group [Sn].C(CCCCCC(C)(C)C)(=O)OC.C(CCCCCC(C)(C)C)(=O)OC ZGGGFLCIYHJOBB-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- PGQPMLCDSAVZNJ-BGSQTJHASA-L [dimethyl-[(z)-octadec-9-enoyl]oxystannyl] (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)O[Sn](C)(C)OC(=O)CCCCCCC\C=C/CCCCCCCC PGQPMLCDSAVZNJ-BGSQTJHASA-L 0.000 description 2
- NNVDGGDSRRQJMV-UHFFFAOYSA-L [dioctyl(2,2,5,5-tetramethylhexanoyloxy)stannyl] 2,2,5,5-tetramethylhexanoate Chemical compound CCCCCCCC[Sn](OC(=O)C(C)(C)CCC(C)(C)C)(OC(=O)C(C)(C)CCC(C)(C)C)CCCCCCCC NNVDGGDSRRQJMV-UHFFFAOYSA-L 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 125000000392 cycloalkenyl group Chemical group 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 2
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- GAURFLBIDLSLQU-UHFFFAOYSA-N diethoxy(methyl)silicon Chemical compound CCO[Si](C)OCC GAURFLBIDLSLQU-UHFFFAOYSA-N 0.000 description 2
- HGQSXVKHVMGQRG-UHFFFAOYSA-N dioctyltin Chemical compound CCCCCCCC[Sn]CCCCCCCC HGQSXVKHVMGQRG-UHFFFAOYSA-N 0.000 description 2
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- 150000002739 metals Chemical class 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- SWGZAKPJNWCPRY-UHFFFAOYSA-N methyl-bis(trimethylsilyloxy)silicon Chemical compound C[Si](C)(C)O[Si](C)O[Si](C)(C)C SWGZAKPJNWCPRY-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 2
- CBFCDTFDPHXCNY-UHFFFAOYSA-N octyldodecane Natural products CCCCCCCCCCCCCCCCCCCC CBFCDTFDPHXCNY-UHFFFAOYSA-N 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
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- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
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- 239000005361 soda-lime glass Substances 0.000 description 2
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- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
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- 239000008096 xylene Substances 0.000 description 2
- QMTFKWDCWOTPGJ-KVVVOXFISA-N (z)-octadec-9-enoic acid;tin Chemical compound [Sn].CCCCCCCC\C=C/CCCCCCCC(O)=O QMTFKWDCWOTPGJ-KVVVOXFISA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- DRQBTGVUPGPKCN-UHFFFAOYSA-N 2,7-dimethyl-3,6-di(propan-2-yl)oct-4-yne-3,6-diol Chemical compound CC(C)C(O)(C(C)C)C#CC(O)(C(C)C)C(C)C DRQBTGVUPGPKCN-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical class OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- NUYADIDKTLPDGG-UHFFFAOYSA-N 3,6-dimethyloct-4-yne-3,6-diol Chemical compound CCC(C)(O)C#CC(C)(O)CC NUYADIDKTLPDGG-UHFFFAOYSA-N 0.000 description 1
- BRUFYILNWNCKJT-UHFFFAOYSA-N 3-acetylpentane-2,4-dione;dibutyltin Chemical compound CCCC[Sn]CCCC.CC(=O)C(C(C)=O)C(C)=O BRUFYILNWNCKJT-UHFFFAOYSA-N 0.000 description 1
- ZLAOXGYWRBSWOY-UHFFFAOYSA-N 3-chloropropyl(methoxy)silane Chemical class CO[SiH2]CCCCl ZLAOXGYWRBSWOY-UHFFFAOYSA-N 0.000 description 1
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- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- HCKFFIBKYQSDRD-UHFFFAOYSA-N 4,7-dimethyldec-5-yne-4,7-diol Chemical compound CCCC(C)(O)C#CC(C)(O)CCC HCKFFIBKYQSDRD-UHFFFAOYSA-N 0.000 description 1
- QJVYQDHSUBERCN-UHFFFAOYSA-N C(CC)[Si](OC)(CC1=CC=CC=C1)C=C Chemical compound C(CC)[Si](OC)(CC1=CC=CC=C1)C=C QJVYQDHSUBERCN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
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- 125000005631 S-sulfonamido group Chemical group 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
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- 239000007983 Tris buffer Substances 0.000 description 1
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- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- XKSLFMSMRRTJKN-UHFFFAOYSA-L [2,2-dimethyloctanoyloxy(dimethyl)stannyl] 2,2-dimethyloctanoate Chemical compound CCCCCCC(C)(C)C(=O)O[Sn](C)(C)OC(=O)C(C)(C)CCCCCC XKSLFMSMRRTJKN-UHFFFAOYSA-L 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- FGPCETMNRYMFJR-UHFFFAOYSA-L [7,7-dimethyloctanoyloxy(dimethyl)stannyl] 7,7-dimethyloctanoate Chemical compound CC(C)(C)CCCCCC(=O)O[Sn](C)(C)OC(=O)CCCCCC(C)(C)C FGPCETMNRYMFJR-UHFFFAOYSA-L 0.000 description 1
- QVYYOKWPCQYKEY-UHFFFAOYSA-N [Fe].[Co] Chemical compound [Fe].[Co] QVYYOKWPCQYKEY-UHFFFAOYSA-N 0.000 description 1
- LHFURYICKMKJHJ-UHFFFAOYSA-L [benzoyloxy(dibutyl)stannyl] benzoate Chemical compound CCCC[Sn+2]CCCC.[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 LHFURYICKMKJHJ-UHFFFAOYSA-L 0.000 description 1
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Images
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Description
(i)約1~約30%の約50,000g/molより大きい数平均分子量を有するヒドロキシ末端シロキサンポリマー;
(ii)約10~約50%の約30,000g/mol未満の数平均分子量を有するヒドロキシ末端シロキサンポリマー
(iii)約10~約50%の反応性シリコーン樹脂
(iv)約0.1~約10%のビニルアルコキシ官能性シラン
(v)約0.001~約1%の(v1)-6以下のpKa値を有する酸または(v2)15以上のpKa値を有する塩基触媒の反応生成物:
(b)約0.1~約10%のヒドリド官能性シロキサンポリマー、および;
(c)約0.001~約5%の熱硬化触媒を含む熱硬化性シリコーン光学的透明接着剤に関する。
(1)約60~約150℃の有機溶媒中で混合することにより
(i)約1~約30%の約50,000g/molより大きいMnを有するヒドロキシ末端シロキサンポリマー;
(ii)約10~約50%の約30,000g/molのMnを有するヒドロキシ末端シロキサンポリマー
(iii)約10~約50%の反応性シリコーン樹脂
(iv)約0.1~約10%のビニルアルコキシ官能性シラン
(v)約0.001~約1%の(v1)-6以下のpKa値を有する酸または(v2)15以上のpKa値を有する塩基触媒の反応生成物を調製し、
(2)室温で約0.1~約5%の(b)ヒドリド官能性シロキサンポリマーと(c)約0.001~約5%の熱硬化触媒を添加する工程を含む方法に関する。
(i)約1~約30%の約50,000g/molより大きいMnを有するヒドロキシ末端シロキサンポリマー;
(ii)約10~約50%の約50,000g/mol未満のMnを有する(メタ)アクリルオキシアルキルアルコキシ末端シロキサンポリマー
(iii)約10~約50%の反応性シリコーン樹脂
(iv)約0.001~約1%の(v1)-6以下のpKa値を有する酸または(v2)15以上のpKa値を有する塩基触媒の反応生成物:
(b)約0.001~約5%の光開始剤の混合物を含むUV硬化性シリコーン光学的透明接着剤組成物に関する。
(1)約60~約150℃の有機溶媒中で混合することにより
(i)約1~約30%の約50,000g/molより大きいMnを有するヒドロキシ末端シロキサンポリマー;
(ii)約10~約50%の約50,000g/mol未満のMnを有する(メタ)アクリルオキシアルキルアルコキシ末端シロキサンポリマー
(iii)約10~約50%の反応性シリコーン樹脂
(iv)約0.001~約1%の(v1)-6以下のpKa値を有する酸または(v2)15以上のpKa値を有する塩基触媒の反応生成物を調製し、
(2)室温で約0.001~約5%の熱硬化触媒を添加する工程を含む方法に関する。
別に定義されない限り、本明細書で使用されるすべての技術用語および科学用語は、当業者によって一般に理解されるのと同じ意味を有する。矛盾がある場合は、定義を含む本明細書が支配する。好ましい方法および材料を以下に記載するが、本開示の実施または試験において、本明細書に記載のものと類似または同等の方法および材料を使用することができる。本明細書で言及されるすべての出版物、特許出願、特許および他の参考文献は、参照によりその全体が組み込まれる。本明細書で開示される材料、方法、および例は、例示のみであり、限定することを意図していない。
(a)約95~約99.999%の
(i)約1~約30%の約750,000g/molより大きい数平均分子量を有する高分子量ヒドロキシ末端シロキサンポリマー;
(ii)約10~約50%の約30,000g/mol未満の数平均分子量を有する低分子量ヒドロキシ末端シロキサンポリマー
(iii)約10~約50%の反応性シリコーン樹脂
(iv)約0.1~約10%のビニルアルコキシ官能性シラン
(v)約0.001~約1%の(v1)-6以下のpKa値を有する酸または(v2)15以上のpKa値を有する塩基触媒の反応生成物:
(b)約0.1~約10%のヒドリド官能性シロキサンポリマー、および;
(c)約0.001~約5%の熱硬化触媒を含む熱硬化性シリコーン光学的透明接着剤に関する。
(i)約1~約30%の約50,000g/molより大きい数平均分子量を有する高分子量ヒドロキシ末端シロキサンポリマー;
(ii)約10~約50%の約30,000g/mol未満の数平均分子量を有する低分子量ヒドロキシ末端シロキサンポリマー
(iii)約10~約50%の反応性シリコーン樹脂
(iv)約0.1~約10%のビニルアルコキシ官能性シラン
(v)約0.001~約1%の(v1)-6以下のpKa値を有する酸または(v2)15以上のpKa値を有する塩基触媒を約60~約150℃の高温の有機溶媒中で混合することにより形成する。
(1)約60~約150℃の有機溶媒中で混合することにより
(i)約1~約30%の約50,000g/molより大きい数平均分子量を有する高分子量ヒドロキシ末端シロキサンポリマー;
(ii)約10~約50%の約30,000g/mol未満の数平均分子量を有する低分子量ヒドロキシ末端シロキサンポリマー
(iii)約10~約50%の反応性シリコーン樹脂
(iv)約0.1~約10%のビニルアルコキシ官能性シラン
(v)約0.001~約1%の(v1)-6以下のpKa値を有する酸または(v2)15以上のpKa値を有する塩基触媒の反応生成物を調製し、
(2)室温で約0.1~約10%の(b)ヒドリド官能性シロキサンポリマーと(c)約0.001~約5%の熱硬化触媒を添加する工程を含む方法に関する。
(i)約1~約30%の約50,000g/molより大きい数平均分子量を有する高分子量ヒドロキシ末端シロキサンポリマー;
(ii)約10~約50%の約50,000g/mol未満の数平均分子量を有する(メタ)アクリルオキシアルキルアルコキシ末端シロキサンポリマー
(iii)約10~約50%の反応性シリコン樹脂
(iv)場合により、約0.1~約10%の(メタ)アクリルオキシアルキルアルコキシ官能性シラン
(v)約0.001~約1%の(v1)-6以下のpKa値を有する酸または(v2)15以上のpKa値を有する塩基触媒の反応生成物:
(b)約0.001~約5%の光開始剤の混合物を含むUV硬化性シリコーン光学的透明接着剤組成物に関する。
Xは、メタクリルオキシアルキルまたはアクリルオキシアルキル基である。本発明において有用な(メタ)アクリルオキシアルキルアルコキシ官能性シランの例は、(γ-アクリルオキシメチル)フェネチルトリメトキシシラン、(γ-アクリルオキシメチル)トリメトキシシラン、(γ-アクリルオキシプロピル)メチルビス(トリメチルシロキシ)シラン、(γ-アクリルオキシプロピル)メチルジメトキシシラン、(γ-アクリルオキシプロピル)メチルジエトキシシラン、(γ-アクリルオキシプロピル)トリメトキシシラン、(γ-アクリルオキシプロピル)トリス(トリメチルシロキシ)シラン、(γ-メタクリルオキシプロピル)ビス(トリメチルシロキシ)メチルシラン、(γ-メタクリルオキシメチル)ビス(トリメチルシロキシ)メチルシラン、(γ-メタクリルオキシメチル)メチルジメトキシシラン、(γ-メタクリルオキシメチルフェネチル)トリス(トリメチルシロキシ)シラン、(γ-メタクリルオキシメチル)トリス(トリメチルシロキシ)シラン、(γ-メタクリルオキシプロピル)メチルジメトキシシラン、(γ-メタクリルオキシプロピル)メチルジエトキシシラン、(γ-メタクリルオキシプロピル)トリエトキシシラン、(γ-メタクリルオキシプロピル)トリイソプロポキシシラン、(γ-メタクリルオキシプロピル)トリメトキシシラン、(γ-メタクリルオキシプロピル)トリス(メトキシエトキシ)シラン、(γ-メタクリルオキシプロピル)トリス(トリメチルシロキシ)シランである。好ましくは、(メタ)アクリルオキシ基を有する(メタ)アクリルオキシアルキルアルコキシ官能性シランは、(メタ)アクリルオキシアルキルアルコキシ官能性シランが(メタ)アクリルオキシプロピルトリメトキシシラン、(メタ)アクリルオキシプロピルメチルジメトキシシラン、(メタ)アクリルオキシエチルトリメトキシシラン、または(メタ)アクリルオキシエチルメチルジメトキシシランから選択される。
(1)約60~約150℃の有機溶媒中で混合することにより
(i)約1~約30%の約100,000g/molより大きい数平均分子量を有する高分子量ヒドロキシ末端シロキサンポリマー;
(ii)約10~約50%の約50,000g/mol未満の数平均分子量を有する(メタ)アクリルオキシアルキルアルコキシ末端シロキサンポリマー
(iii)約10~約50%の反応性シリコーン樹脂
(iv)約0.1~約10%の(メタ)アクリルオキシアルキルアルコキシ官能性シラン
(v)約0.001~約1%の(v1)-6以下のpKa値を有する酸または(v2)15以上のpKa値を有する塩基触媒の反応生成物を混合することにより調製し、:
(b)約0.001~約5%の光開始剤を室温で添加する工程を含む方法に関する。
ヒドロキシ末端ポリジメチルシロキサン(Mn95,000g/mol)は、Wackerから市販されている。
温度変化に対する弾性率(G’)、損失弾性率(G”)、およびtanδを得るためにレオメトリックスダイナミックメカニカルアナライザー(ModelRDA 700)を使用した。この機器は、Rhiosソフトウェアバージョン4.3.2によって制御された。直径8mmで、約2mmのギャップで隔てられた平行プレートを使用した。試料を装填し、約-100℃に冷却し、時間プログラムを開始した。プログラムテストでは、5℃間隔で、各温度で10秒間の浸漬時間(soak time)を取って、温度を上昇させた。対流オーブンを窒素で連続的に通気した。周波数は10rad/sに維持した。試験開始時の初期ひずみは0.05%であった(プレートの外縁部で)。ソフトウエア内のオートストレインオプションを使用して、テスト中に正確に測定可能なトルクを維持した。このオプションは、ソフトウェアによって許容される最大の歪みが80%になるように構成されていた。オートストレインプログラムは、保証されていれば、以下の手順で各温度上昇時のひずみを調整した。トルクが200g-cm未満であった場合、歪みを、現在の値の25%だけ増加させた。トルクが1200g-cmを上回った場合、現在の値の25%だけ減少させた。200~1200g-cmのトルクでは、その温度上昇時に歪みを変化させなかった。せん断貯蔵または弾性率(G’)およびせん断損失弾性率(G”)は、ソフトウェアによってトルクおよび歪みデータから計算される。tanδ(タンデルタ)としても知られている、それらの比、G”/G’も計算した。
T-剥離接着試験は、Instron Sintech 1/Dを用いて、ASTM D1876に従って実施した。手順は以下の通りであった:(1)接着剤フィルムを2枚の2~3ミルのPETフィルムの間に移す;(2)UVA&Vの1~5J/cm2の照射量でD-バルブ(Fusion Systems)を用いて積層接着剤をUV硬化させる;(3)試料を幅1.0インチ×長さ6~12インチの細長いストリップに切断する;(4)23℃、相対湿度50%の条件下で12時間養生する;(5)T-剥離試験片の各端部をインストロンの別々の試験グリップでクランプし、23℃および50%相対湿度でT-剥離接着試験を、ボンドラインの長さに12.0インチ/分の速度で行う。
ASTM E903およびASTM D1003に従って、AgilentのCary300分光光度計を用いて光学特性(T%、ヘイズ%および黄色度b*)を測定した。透過率の試験方法は次のとおりである:(1)イソプロパノールで3回拭き取った75mm×50mm平滑マイクロスライド(Dow Corning、Midland、MIから入手のガラススライド)上に接着剤の小さなフィルムを置く;(2)第2のガラススライドを力を掛けながら接着剤に付着する;(3)UVA&Vを1~5J/cm2でD-バルブ(Fusion Systems)により、接着剤を硬化させる;分光器で300~900nmの光透過率を測定する。
熱硬化性シリコーン光学的透明接着剤を作製する手順は以下の通りである。ヒドロキシル末端ポリジメチルシロキサン(MW95Kおよび13K)、シリコーンMQ樹脂(33g)、ビニルトリメトキシシラン、およびヘプタン(60g)の混合物を、N2ガスブランケットで2時間還流攪拌した。n-BuLi(0.3mL、ヘキサン中1.6M)を混合物に添加し、これをさらに1時間混合した。反応混合物をCO2で1時間、続いてN2で1時間パージした。ヒドリド末端ポリジメチルシロキサンとカルシュテット触媒を混合物に添加した。生成物を室温まで冷却し、ガラス瓶に詰めた。成分と特性を表1に示す。例1(C)および7のRDAT曲線、例1(C)および7のレオロジーデータを図1に示す。線■は例1のせん断弾性率G’であり、線□は例1のtanδである。線▲は、例7のせん断弾性率G’であり、線△は例7のtanδである。
UV硬化性シリコーン光学的透明接着剤を作製する手順は以下の通りである。ヒドロキシ末端ポリジメチルシロキサン(MW95Kおよび13K)、シリコーンMQ樹脂、アクリレート末端ポリジメチルシロキサン、メタクリロプロポキシトリメトキシイルシラン、およびヘプタン(60g)の混合物をN2ガスブランケットで2時間還流攪拌した。N-BuLi(0.3mL、ヘキサン中1.6M)を加え、混合物をさらに1時間混合した。反応混合物をCO2で1時間、続いてN2で1時間パージした。TPOを添加した。生成物を室温まで冷却し、ガラス瓶に詰めた。成分および特性を表2に示す。例1(C)および9のRDA T曲線、例1(C)および9のレオロジーデータを図2に示す。線■は例1(C)のせん断弾性率G’であり、線□は例1のtanδである。線▲は、例9のせん断弾性率G’であり、線△は例9のtanδである。
Claims (6)
- (a)95~99.999%の
(i)1~30%の50,000g/molより大きい数平均分子量を有するヒドロキシ末端シロキサンポリマー、
(ii)10~50%の30,000g/mol未満の数平均分子量を有するヒドロキシ末端シロキサンポリマー、
(iii)10~50%の反応性シリコーン樹脂、
(iv)0.1~10%のビニルアルコキシ官能性シラン、および
(v)0.001~1%の(v1)-6以下のpKa値を有する酸または(v2)15以上のpKa値を有する塩基触媒、
の反応生成物、
(b)0.1~10%のヒドリド官能性シロキサンポリマー、および
(c)0.001~5%の熱硬化触媒を含む熱硬化性シリコーン光学的透明接着剤であって、
ヒドロキシ末端シロキサンポリマーが、α、ω-エンドキャップヒドロキシを有するポリジオルガノシロキサンポリマーであり、
反応性シリコーン樹脂が、四官能性シロキシ単位(SiO 4/2 )およびトリオルガノシロキシ単位(R 3 SiO 1/2 )を有し、Rが、ヒドロキシ基およびメチル基であり、SiO 4/2 のR 3 SiO 1/2 に対する単位のモル比が、1:2~2:1であり、
熱硬化性シリコーン光学的透明接着剤の硬化組成物が、25℃で1.5×10 6 dyn/cm未満のせん断弾性率(G’)およびASTM D1876による2つのPETフィルム間の1オンス/インチを超えるT-剥離接着を有する熱硬化性シリコーン光学的透明接着剤。 - ヒドロキシ末端シロキサンポリマーが、α、ω-エンドキャップヒドロキシを有するポリジメチルシロキサンポリマーである、請求項1に記載の熱硬化性シリコーン光学的透明接着剤。
- (iii)反応性シリコーン樹脂の数平均分子量が、500~200,000g/molであり、
(iv)ビニルアルコキシ官能性シランが、ビニルトリメトキシシラン、ビニルメチルジメトキシシラン、ビニルジメチルメトキシシランおよびそれらの混合物からなる群から選択され、
(v)触媒が、KOH、NaOH、LiOH、有機リチウム試薬、グリニャール試薬、メタンスルホン酸、硫酸、およびそれらの混合物からなる群から選択される、請求項1に記載の熱硬化性シリコーン光学的透明接着剤。 - (b)ヒドリド官能性シロキサンポリマーが、(1)SiMe2Hの末端官能基、(2)SiMeHのペンダント官能基、または(3)それらの混合物を有するポリジメチルシロキサンポリマーまたはオリゴマーであり、
反応性シリコーン樹脂の数平均分子量(Mn)が、200~50,000g/molであり、
(c)熱硬化触媒が、シュパイアー触媒H2PtCl6、カルシュテット触媒またはそれらの混合物である、請求項1に記載の熱硬化性シリコーン光学的透明接着剤。 - 請求項1に記載の熱硬化性シリコーン光学的透明接着剤の硬化組成物を含む物品。
- 熱硬化性シリコーン光学的透明接着剤を形成する方法であって、
(1)60~150℃の有機溶媒中で混合することにより
(i)1~30%の50,000g/molより大きい数平均分子量を有するヒドロキシ末端シロキサンポリマー、
(ii)10~50%の30,000g/mol未満の数平均分子量を有するヒドロキシ末端シロキサンポリマー、
(iii)10~50%の反応性シリコーン樹脂、
(iv)0.1~10%のビニルアルコキシ官能性シラン、および
(v)0.001~1%の(v1)-6以下のpKa値を有する酸または(v2)15以上のpKa値を有する塩基触媒、
の反応生成物を調製し、
(2)室温で0.1~5%の(b)ヒドリド官能性シロキサンポリマーと(c)0.001~5%の熱硬化触媒を添加する工程を含み、
ヒドロキシ末端シロキサンポリマーが、α、ω-エンドキャップヒドロキシを有するポリジオルガノシロキサンポリマーであり、
(iii)反応性シリコーン樹脂が、四官能性シロキシ単位(SiO 4/2 )およびトリオルガノシロキシ単位(R 3 SiO 1/2 )を有し、Rが、ヒドロキシ基およびメチル基であり、SiO 4/2 のR 3 SiO 1/2 に対する単位のモル比が、1:2~2:1であり、
熱硬化性シリコーン光学的透明接着剤の硬化組成物が、25℃で1.5×10 6 dyn/cm未満のせん断弾性率(G’)およびASTM D1876による2つのPETフィルム間の1オンス/インチを超えるT-剥離接着を有する熱硬化性シリコーン光学的透明接着剤である方法。
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KR20200038246A (ko) | 2020-04-10 |
TWI782066B (zh) | 2022-11-01 |
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