JP7162162B1 - スルホニオ基含有エーテル化合物を含むめっき液 - Google Patents

スルホニオ基含有エーテル化合物を含むめっき液 Download PDF

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Publication number
JP7162162B1
JP7162162B1 JP2022541302A JP2022541302A JP7162162B1 JP 7162162 B1 JP7162162 B1 JP 7162162B1 JP 2022541302 A JP2022541302 A JP 2022541302A JP 2022541302 A JP2022541302 A JP 2022541302A JP 7162162 B1 JP7162162 B1 JP 7162162B1
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JP
Japan
Prior art keywords
group
plating solution
plating
acid
ether compound
Prior art date
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Active
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JP2022541302A
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English (en)
Japanese (ja)
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JPWO2023166552A1 (https=
JPWO2023166552A5 (https=
Inventor
一喜 岸本
翔太 樋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCU Corp
Original Assignee
JCU Corp
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Publication date
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Publication of JP7162162B1 publication Critical patent/JP7162162B1/ja
Publication of JPWO2023166552A1 publication Critical patent/JPWO2023166552A1/ja
Publication of JPWO2023166552A5 publication Critical patent/JPWO2023166552A5/ja
Active legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2022541302A 2022-03-01 2022-03-01 スルホニオ基含有エーテル化合物を含むめっき液 Active JP7162162B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/008580 WO2023166552A1 (ja) 2022-03-01 2022-03-01 スルホニオ基含有エーテル化合物を含むめっき液

Publications (3)

Publication Number Publication Date
JP7162162B1 true JP7162162B1 (ja) 2022-10-27
JPWO2023166552A1 JPWO2023166552A1 (https=) 2023-09-07
JPWO2023166552A5 JPWO2023166552A5 (https=) 2024-02-06

Family

ID=83804246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022541302A Active JP7162162B1 (ja) 2022-03-01 2022-03-01 スルホニオ基含有エーテル化合物を含むめっき液

Country Status (7)

Country Link
US (1) US20250179676A1 (https=)
EP (1) EP4488421A4 (https=)
JP (1) JP7162162B1 (https=)
KR (1) KR20240155294A (https=)
CN (1) CN118922586A (https=)
TW (1) TWI835422B (https=)
WO (1) WO2023166552A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119352117A (zh) * 2024-12-23 2025-01-24 西安智同航空科技有限公司 一种航空紧固件表面镀银的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3000799A (en) * 1960-02-10 1961-09-19 Harshaw Chem Corp Nickel plating solutions
JP2008231033A (ja) * 2007-03-20 2008-10-02 Kanto Denka Kogyo Co Ltd Ｓ−ｎ結合を含むスルホニウムカチオンを有するイオン液体およびその製造方法
JP2016183410A (ja) * 2015-03-26 2016-10-20 三菱マテリアル株式会社 スルホニウム塩を用いためっき液

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4388450A (en) * 1981-03-13 1983-06-14 General Electric Company Aromatic polyvinyl ethers and heat curable molding compositions obtained therefrom
JP2003105584A (ja) 2001-07-26 2003-04-09 Electroplating Eng Of Japan Co 微細配線埋め込み用銅メッキ液及びそれを用いた銅メッキ方法
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
US20050070701A1 (en) * 2003-09-29 2005-03-31 Hochstetler Spencer Erich Detection of living cells in polymers or pigments
US7887693B2 (en) * 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
CN102906078B (zh) 2010-04-30 2015-12-16 株式会社杰希优 新型化合物及其利用
KR20140010398A (ko) * 2011-02-23 2014-01-24 바스프 에스이 술포늄 술페이트, 그의 제조법 및 용도

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3000799A (en) * 1960-02-10 1961-09-19 Harshaw Chem Corp Nickel plating solutions
JP2008231033A (ja) * 2007-03-20 2008-10-02 Kanto Denka Kogyo Co Ltd Ｓ−ｎ結合を含むスルホニウムカチオンを有するイオン液体およびその製造方法
JP2016183410A (ja) * 2015-03-26 2016-10-20 三菱マテリアル株式会社 スルホニウム塩を用いためっき液

Also Published As

Publication number Publication date
TWI835422B (zh) 2024-03-11
EP4488421A1 (en) 2025-01-08
WO2023166552A1 (ja) 2023-09-07
CN118922586A (zh) 2024-11-08
EP4488421A4 (en) 2026-02-25
US20250179676A1 (en) 2025-06-05
JPWO2023166552A1 (https=) 2023-09-07
TW202336287A (zh) 2023-09-16
KR20240155294A (ko) 2024-10-28

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