CN118922586A - 包含含锍基的醚化合物的镀液 - Google Patents

包含含锍基的醚化合物的镀液 Download PDF

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Publication number
CN118922586A
CN118922586A CN202280092757.0A CN202280092757A CN118922586A CN 118922586 A CN118922586 A CN 118922586A CN 202280092757 A CN202280092757 A CN 202280092757A CN 118922586 A CN118922586 A CN 118922586A
Authority
CN
China
Prior art keywords
group
plating solution
ether compound
plating
sulfonium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280092757.0A
Other languages
English (en)
Chinese (zh)
Inventor
岸本一喜
樋口翔太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCU Corp
Original Assignee
JCU Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JCU Corp filed Critical JCU Corp
Publication of CN118922586A publication Critical patent/CN118922586A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
CN202280092757.0A 2022-03-01 2022-03-01 包含含锍基的醚化合物的镀液 Pending CN118922586A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/008580 WO2023166552A1 (ja) 2022-03-01 2022-03-01 スルホニオ基含有エーテル化合物を含むめっき液

Publications (1)

Publication Number Publication Date
CN118922586A true CN118922586A (zh) 2024-11-08

Family

ID=83804246

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280092757.0A Pending CN118922586A (zh) 2022-03-01 2022-03-01 包含含锍基的醚化合物的镀液

Country Status (7)

Country Link
US (1) US20250179676A1 (https=)
EP (1) EP4488421A4 (https=)
JP (1) JP7162162B1 (https=)
KR (1) KR20240155294A (https=)
CN (1) CN118922586A (https=)
TW (1) TWI835422B (https=)
WO (1) WO2023166552A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119352117A (zh) * 2024-12-23 2025-01-24 西安智同航空科技有限公司 一种航空紧固件表面镀银的方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3000799A (en) * 1960-02-10 1961-09-19 Harshaw Chem Corp Nickel plating solutions
US4388450A (en) * 1981-03-13 1983-06-14 General Electric Company Aromatic polyvinyl ethers and heat curable molding compositions obtained therefrom
JP2003105584A (ja) 2001-07-26 2003-04-09 Electroplating Eng Of Japan Co 微細配線埋め込み用銅メッキ液及びそれを用いた銅メッキ方法
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
US20050070701A1 (en) * 2003-09-29 2005-03-31 Hochstetler Spencer Erich Detection of living cells in polymers or pigments
JP5227524B2 (ja) * 2007-03-20 2013-07-03 関東電化工業株式会社 Ｓ−ｎ結合を含むスルホニウムカチオンを有するイオン液体およびその製造方法
US7887693B2 (en) * 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
CN102906078B (zh) 2010-04-30 2015-12-16 株式会社杰希优 新型化合物及其利用
KR20140010398A (ko) * 2011-02-23 2014-01-24 바스프 에스이 술포늄 술페이트, 그의 제조법 및 용도
JP6607106B2 (ja) * 2015-03-26 2019-11-20 三菱マテリアル株式会社 スルホニウム塩を用いためっき液

Also Published As

Publication number Publication date
TWI835422B (zh) 2024-03-11
EP4488421A1 (en) 2025-01-08
WO2023166552A1 (ja) 2023-09-07
JP7162162B1 (ja) 2022-10-27
EP4488421A4 (en) 2026-02-25
US20250179676A1 (en) 2025-06-05
JPWO2023166552A1 (https=) 2023-09-07
TW202336287A (zh) 2023-09-16
KR20240155294A (ko) 2024-10-28

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