TWI835422B - 包含含有鋶基之醚化合物之鍍敷液 - Google Patents

包含含有鋶基之醚化合物之鍍敷液 Download PDF

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Publication number
TWI835422B
TWI835422B TW111145030A TW111145030A TWI835422B TW I835422 B TWI835422 B TW I835422B TW 111145030 A TW111145030 A TW 111145030A TW 111145030 A TW111145030 A TW 111145030A TW I835422 B TWI835422 B TW I835422B
Authority
TW
Taiwan
Prior art keywords
group
formula
plating solution
plating
ether
Prior art date
Application number
TW111145030A
Other languages
English (en)
Chinese (zh)
Other versions
TW202336287A (zh
Inventor
岸本一喜
樋口翔太
Original Assignee
日商傑希優股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商傑希優股份有限公司 filed Critical 日商傑希優股份有限公司
Publication of TW202336287A publication Critical patent/TW202336287A/zh
Application granted granted Critical
Publication of TWI835422B publication Critical patent/TWI835422B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
TW111145030A 2022-03-01 2022-11-24 包含含有鋶基之醚化合物之鍍敷液 TWI835422B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2022/008580 WO2023166552A1 (ja) 2022-03-01 2022-03-01 スルホニオ基含有エーテル化合物を含むめっき液
WOPCT/JP2022/008580 2022-03-01

Publications (2)

Publication Number Publication Date
TW202336287A TW202336287A (zh) 2023-09-16
TWI835422B true TWI835422B (zh) 2024-03-11

Family

ID=83804246

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111145030A TWI835422B (zh) 2022-03-01 2022-11-24 包含含有鋶基之醚化合物之鍍敷液

Country Status (7)

Country Link
US (1) US20250179676A1 (https=)
EP (1) EP4488421A4 (https=)
JP (1) JP7162162B1 (https=)
KR (1) KR20240155294A (https=)
CN (1) CN118922586A (https=)
TW (1) TWI835422B (https=)
WO (1) WO2023166552A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119352117A (zh) * 2024-12-23 2025-01-24 西安智同航空科技有限公司 一种航空紧固件表面镀银的方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201704546A (zh) * 2015-03-26 2017-02-01 三菱綜合材料股份有限公司 使用鋶鹽之鍍敷液

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3000799A (en) * 1960-02-10 1961-09-19 Harshaw Chem Corp Nickel plating solutions
US4388450A (en) * 1981-03-13 1983-06-14 General Electric Company Aromatic polyvinyl ethers and heat curable molding compositions obtained therefrom
JP2003105584A (ja) 2001-07-26 2003-04-09 Electroplating Eng Of Japan Co 微細配線埋め込み用銅メッキ液及びそれを用いた銅メッキ方法
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
US20050070701A1 (en) * 2003-09-29 2005-03-31 Hochstetler Spencer Erich Detection of living cells in polymers or pigments
JP5227524B2 (ja) * 2007-03-20 2013-07-03 関東電化工業株式会社 Ｓ−ｎ結合を含むスルホニウムカチオンを有するイオン液体およびその製造方法
US7887693B2 (en) * 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
CN102906078B (zh) 2010-04-30 2015-12-16 株式会社杰希优 新型化合物及其利用
KR20140010398A (ko) * 2011-02-23 2014-01-24 바스프 에스이 술포늄 술페이트, 그의 제조법 및 용도

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201704546A (zh) * 2015-03-26 2017-02-01 三菱綜合材料股份有限公司 使用鋶鹽之鍍敷液

Also Published As

Publication number Publication date
EP4488421A1 (en) 2025-01-08
WO2023166552A1 (ja) 2023-09-07
CN118922586A (zh) 2024-11-08
JP7162162B1 (ja) 2022-10-27
EP4488421A4 (en) 2026-02-25
US20250179676A1 (en) 2025-06-05
JPWO2023166552A1 (https=) 2023-09-07
TW202336287A (zh) 2023-09-16
KR20240155294A (ko) 2024-10-28

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