US3000799A - Nickel plating solutions - Google Patents
Nickel plating solutions Download PDFInfo
- Publication number
- US3000799A US3000799A US7783A US778360A US3000799A US 3000799 A US3000799 A US 3000799A US 7783 A US7783 A US 7783A US 778360 A US778360 A US 778360A US 3000799 A US3000799 A US 3000799A
- Authority
- US
- United States
- Prior art keywords
- nickel
- integer
- sulfate
- aromatic
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims description 56
- 229910052759 nickel Inorganic materials 0.000 title claims description 28
- 238000007747 plating Methods 0.000 title claims description 25
- 239000000654 additive Substances 0.000 claims description 33
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 13
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 13
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 13
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 12
- 150000003460 sulfonic acids Chemical class 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims description 3
- 229910001453 nickel ion Inorganic materials 0.000 claims description 3
- 239000011260 aqueous acid Substances 0.000 claims description 2
- 230000002708 enhancing effect Effects 0.000 claims description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical compound [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 claims 2
- 239000000243 solution Substances 0.000 description 49
- -1 aromatic sulfonates Chemical class 0.000 description 30
- 239000004215 Carbon black (E152) Substances 0.000 description 25
- 229930195733 hydrocarbon Natural products 0.000 description 25
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 21
- 229940124530 sulfonamide Drugs 0.000 description 21
- 239000002253 acid Substances 0.000 description 18
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 18
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 17
- 230000002378 acidificating effect Effects 0.000 description 16
- 150000004820 halides Chemical class 0.000 description 16
- 125000003118 aryl group Chemical group 0.000 description 15
- 239000003795 chemical substances by application Substances 0.000 description 11
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 239000000080 wetting agent Substances 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 4
- 150000003456 sulfonamides Chemical class 0.000 description 4
- 239000003637 basic solution Substances 0.000 description 3
- 239000004327 boric acid Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 150000003871 sulfonates Chemical class 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 238000005282 brightening Methods 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 2
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- GVNVAWHJIKLAGL-UHFFFAOYSA-N 2-(cyclohexen-1-yl)cyclohexan-1-one Chemical compound O=C1CCCCC1C1=CCCCC1 GVNVAWHJIKLAGL-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- 125000000175 2-thienyl group Chemical group S1C([*])=C([H])C([H])=C1[H] 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 101150065749 Churc1 gene Proteins 0.000 description 1
- 102100023170 Nuclear receptor subfamily 1 group D member 1 Human genes 0.000 description 1
- 102100038239 Protein Churchill Human genes 0.000 description 1
- 229910006069 SO3H Inorganic materials 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical class [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 241000272534 Struthio camelus Species 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfate Natural products OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- MIAUJDCQDVWHEV-UHFFFAOYSA-N benzene-1,2-disulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1S(O)(=O)=O MIAUJDCQDVWHEV-UHFFFAOYSA-N 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- BZPDQIJCEDKMAB-UHFFFAOYSA-L cobalt(2+) naphthalene-1,2-disulfonate Chemical compound C=1(C(=CC=C2C=CC=CC12)S(=O)(=O)[O-])S(=O)(=O)[O-].[Co+2] BZPDQIJCEDKMAB-UHFFFAOYSA-L 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- JOXWSDNHLSQKCC-UHFFFAOYSA-N ethenesulfonamide Chemical compound NS(=O)(=O)C=C JOXWSDNHLSQKCC-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- OVQABVAKPIYHIG-UHFFFAOYSA-N n-(benzenesulfonyl)benzenesulfonamide Chemical compound C=1C=CC=CC=1S(=O)(=O)NS(=O)(=O)C1=CC=CC=C1 OVQABVAKPIYHIG-UHFFFAOYSA-N 0.000 description 1
- YXDGWYSXMGRDPY-UHFFFAOYSA-N naphthalene-1,2,3-trisulfonic acid;sodium Chemical compound [Na].C1=CC=C2C(S(O)(=O)=O)=C(S(O)(=O)=O)C(S(=O)(=O)O)=CC2=C1 YXDGWYSXMGRDPY-UHFFFAOYSA-N 0.000 description 1
- PCPDOIKJFCRPEA-UHFFFAOYSA-L naphthalene-1,2-disulfonate nickel(2+) Chemical compound C=1(C(=CC=C2C=CC=CC12)S(=O)(=O)[O-])S(=O)(=O)[O-].[Ni+2] PCPDOIKJFCRPEA-UHFFFAOYSA-L 0.000 description 1
- CGEXUOTXYSGBLV-UHFFFAOYSA-N phenyl benzenesulfonate Chemical compound C=1C=CC=CC=1S(=O)(=O)OC1=CC=CC=C1 CGEXUOTXYSGBLV-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- RTVVXRKGQRRXFJ-UHFFFAOYSA-N sodium;2-sulfobutanedioic acid Chemical compound [Na].OC(=O)CC(C(O)=O)S(O)(=O)=O RTVVXRKGQRRXFJ-UHFFFAOYSA-N 0.000 description 1
- SETMGIIITGNLAS-UHFFFAOYSA-N spizofurone Chemical compound O=C1C2=CC(C(=O)C)=CC=C2OC21CC2 SETMGIIITGNLAS-UHFFFAOYSA-N 0.000 description 1
- 229950001870 spizofurone Drugs 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- FZUJWWOKDIGOKH-UHFFFAOYSA-N sulfuric acid hydrochloride Chemical compound Cl.OS(O)(=O)=O FZUJWWOKDIGOKH-UHFFFAOYSA-N 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Definitions
- n is an integer from 1 to 6
- R is a member selected from the group consisting of where R" and R' are independently selected earn the group consisting of hydrocarbon radicals and hydrogen
- R is a member selected from the group consisting of where m is an integer from 1 to 6
- R and R' are independently selected from the group consisting of hydrocarbon radicals and hydrogen;
- W is a hydrocarbon radicalrX is an acidic radical selected from the group consisting 6f sulfate, sulfonate, halide and perchlorate radicals and t is an integer from 0 to 1 inclusive.
- n 2 and the hydrogen atoms may be substituted by methyl and where W is a hydrocarbon radical, X is acidic radical selected from the group consisting of sul fate, sulfonate, halide and perchlorate radicals and t is integer from 0 to 1 inclhsive.
- W 35 where R is a hyzi aearbea iadieal having item 1 to a: 1561i areas, it is ⁇ 2 and the hydrogen atom iiiay as sub ⁇ stitu'ted by methyl, and where W is a hyaraearbeh radii-:51, X is an acidic radical selected from the roup consisting oi sulfate; sulfonate, halide and perchlorate radi'als; ai'id t is an integer from 0 to 1 inclusive.
- son s-m s oein -(sheaths) where R and R are members independently selected from the group consisting of H and CH n is an integer from 1 to 3, and m is a n integer from 1 to 2, and where W id a hydrocarbon radical, X is an acidic radical selected from the group consistiiig of sulfate, sulfonate, halide and perchlorate radicals, and t is an integer from 0 to 1 ill.- clusive.
- W is a hydrocarbon radical
- X is an acidic radieal selected from the group consisting of sulfate, sulfonate, halide and perchlorate radieals
- t is an integer frdiii 0 to 1 inclusive.
- n 2 + where Wis a hydrocarbon radical
- X is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and perchlorate radicals
- t is an integer from to 1 inclusive.
- R is a hydrocarbon radical having from 1 to 6 carbon atoms and n is an integer from 1 to 2
- W is a hydrocarbon radical
- X is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and v perchlorate radicals, and tis an integer from '0 to. 1- inclusive.
- R is a'hy focarbonfiradical havinggfrom i1: to'-6 carbon atoms and n is an integer from 1 to 2,. and where Wis a hydrocarbon radical, X is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and perchlorate radicals, and t is an integer from 0 to 1-. inclusive.
- n is an integer from 1 to 2
- W is a hydrocarbon radical
- X is' an acidicradi'cal selected from the group consisting of sulfate, sulfonate, halide and perchlorate radicals
- t is an integer from 0. to .1 inclusive.
- n is an integer from 1 to 2
- W is a hydrocarbonradioal
- X is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and perchlorate radicals
- t is an integer from 0 to l inelusive
- g suonanornr I g U o where n is 2, and where W is a hydrocarbon radical, X is anacidicradical" selected from the group" consisting'of sulfate, sulfonate, halideandperchlorate radicals ,..and t is an integer from 0 to l inclusive.
- W is a hydrocarbon radical
- X is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and perchlorate
- t is an integer from 0 to 1 inclusive.
- the foregoing brighteners may be employed in the bright acid nickel plating solution at the rate. of 0.0025 to 0.075 gram per liter.
- control agent dissolved in the acid nickel filat ing solution ranges from ,05 gram per liter to 2 0 grarhs per liter, best results being obtained from about 2 to about 5 grams per liter. These may be used in admixture as Wellas singly. That is, two control agents may be ris'ed 70 instead of one, their combined concentration being kept within the above indicatedlirnits n It is to be understood that in the case qt the suifonium compounds, the radicalcorresponding to X iiithe general maon page 1 may be writtenas carrying a negative 75 I charge while the remainder f the ear-1 106006 me Be written as carrying a positive charge, a v. aqcmon sacm n' W X or as written in column 1, lines 38 00a 39.
- Aromatic sulfonates benzene monosulfonic acid C H SO H benzene disulfonic acid s 4( 3 2 nickel naphthalene disulfonate 1o a( 2 s cobalt naphthalene disulfonate (CSHBSOQZCO I nickel benezene monosulfonate s 5 s)z dichlorobenezene disulionic acid 2 s 2( s 2 r f toluene sulfonic acid cn c n so n diphenyl sulfonic acid C H C H SO H 'thiophene sulionic acid C4H3S.SO3H
- the constitutents of the plating bath are (1) water, (2) nickel sulfate, nickel chloride, or a mixture of nickel sulfate and. nickel, chloride,.
- a bufi'ering agent such as boric acid, formic acid, or the like.
- SULFATE-CHLORIDE WATTS TYPE NISOa-THaO L 100 to 400 grams, preferably 200 to 300 grams. N1Cla.6HzO 10 60 grams, preferably 25 to grams. Boric acid 0 to 50 grams, preferably 15 to 40 grams.
- Wetting agent e.g. sodium laury1su1fate. r. 0 to 0.5 gram, preferably 0.025
- the plating solutions above identified may be operated under conditions of pH, temperature, and cathode current density which are customarily employed therewith.
- the cooperating brightening agents of the invention are dissolved in the plating solutions in the amount previously indicated, bright, ductile deposits will be obtained upon electrolysis of the solution.
- Typical operating conditions for the basic solutions are as follows:
- the plating solution for the best results contains an antipitting agent although the deposits may be suitable for some purposes
- Sodiumlauryl sulfate --or other wetting agents such as the sodium sulfate derivative of 7-ethyl-2-mcthyl-undecanol-4 and the dihexyl ester of sodium sulfosuccinic acid may be used as an antipitting agent, although its use is not essential and other wetting agents or mixtures of wetting agents may be used to control the pitting. For some purposes pitting may betolerated. and sometimes very little pitting occurs.
- electroplating solutions containing .difierent cooperating brighteners and carriers are illustrated in the following table which has been designated as Table III. It should be understood that the specific electroplating solution may be employed with or,
- An aqueous acid nickel plating solution comprising a source of nickel ions selected from the class consisting of nickel sulfate, nickel chloride and mixtures thereof, said solution also containing cooperating additives for enhancing the brightness of nickel deposits produced therein, one of said additives being chosen from the class consisting-of aromatic sultonates, aromatic sulfonamides, aromatic sulfimides, aliphatic sulfonates and sulfonic acids and the second being chosen from the class of compounds having the formula R*(CH S(CH -R, where n is an integer from 1 to 6, n is an integer from 1 to 6, R is a member selected from the group consisting of IO E, -0H,-0CH5, 'i-n, i--on, -t .i'oonj nn Where m is an integer from 110 6,
- W is a hydrocarbon radical
- X. is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and perchlorate radicals
- t is an integer from O'to 1 inclusive
- R" and R are independently se lected from the group consisting of hydrocarbon radicals and hydrogen
- R is a member selected from the group consisting of a 0 II N ll -on, -oon,, -c--n, -o-on *C -Q-(QEQmH a where m is an integer from 1 to 6, p
- R and R are independently selected from the group consisting of hydrocarbon radicals and hydrogen wherein said second mentioned additive is present in solution in concentrations of from 0.0025 to 0.075 gram per liter, and said first mentioned additive being present in solution in concentrations of from 0.05 to 20 grams per liter.
- An aqueous, acid, nickel plating solution comprising nickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations of from 0.05 to 20 grams per liter, and being chosen from the class consisting of aromatic sulfonates, aromatic sulfonamides, aromatic sulfimides, ali- 1 0 phatic sulfonarnides and sulfonic acids, and the other-oi said cooperating additives being a compound of the formula and being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter.
- An aqueous, acid, nickel plating solution comprising nickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations of from 0.05 to 20 grams per liter, and being chosen from the class consisting of aromatic sulfonates, aromatic sulfonarnides, aromatic sulfimides, aliphatic sulfonamides and sulfonic acids, and the other of said cooperating additives being a compound of the formula and being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter.
- An aqueous, acid, nickel plating solution comprising nickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations'of from 0.05 to 20 grams per liter, and being chosen from the class consisting of aromatic sulfonate's, aromatic sulfonamides, aromatic sulfimides, aliphatic sulfonamides and sulfonic acids, and the other of said cooperating additives being a compound of the formula [CH -O--OH -CH S and being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter.
- An aqueous, acid, nickel plating solution comprisingnickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations of from 0.05 to 20 grams per liter, and being chosen from the class consisting of aromatic sulfonates, aromatic sulfonamides, aromatic sulfimides, ali phatic sulfonamides and sulfonic acids, and the other of said cooperating additives being a compound of the formula and'being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter.
- An aqueous, acid, nickel plating solution comprising nickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations of from 0.05 to grams per liter, and being chosen from the class consisting of aromatic sulfonates, aromatic sulfonamides, aromatic sulfimides, aliphatic sulfonamides and sulfonic acids, and the other of said cooperating additives being a compound of the formula OHaCHs-S-CHnCH and being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter.
- An aqueous, acid, nickel plating solution comprising nickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations of from 0.05 to 20 grams per liter, and being chosen from the class consisting of aromatic sulfonates, aromatic sulfonamides, aromatic sulfimides, aliphatic sulfonamides and sulfonic acids, and the other of said cooperating additives being a compound of the formula and being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter. 11.
- An aqueous, acid, nickel plating solution comprising nickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations of from 0.05 to 20 grams per liter, and being chosen from the class consisting of aromatic sulfonates, aromatic sulfonamides, aromatic sulfimides, ali 'phatic sulfonarnides and sulfonic acids and the other of said cooperating additives being a compound of the formula HOCH CH SCH OH SO CI-I CH SCH CH OH and being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter.
- An aqueous, acid, nickel plating solution comprising a source of nickel ions selected from the class consisting of nickel sulfate, nickel chloride and mixtures thereof,
- R" and R" are independently selected from the group consisting of hydrocarbon radicals and hydrogen; R is a member selected from the group consisting of -'0 CH8 O-0H where m is an integer from 1 to 6,
- R" and R' are independently selected from the group consisting of hydrocarbon radicals and hydrogen; W is a hydrocarbon radical; X is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and perchlorate radicals and t is an integer from 0 to 1 inclusive wherein said second mentioned additive is present in solution in concentrations of from 0.0025 to 0.075 gram per liter, and said first mentioned additive being present in solution in concentrations of from 0.05 to 20 grams per liter.-
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
V r 3,000,799 NICKEL PLATING SOLUTIONS Jack L. Towle, Cleveland, Ohio, assignor to The Harshaw GheinitEal Gompany, Cleveland, Ohio, a corporatihn Qf h a... H
No Drawing, Eiled Feb; ,10,,1 9 60, $er. No. 7,783
12 Claims. (Cl. 204- 49) This invention, which is a continuation-in-part 6f espending applicatio'rl Serial No. 833,398, filed August 13; 1959 now abandoned, which is a continuation-in-part of copending application Serial No. 796,211, filed March 2, 1959 now abandoned, relates to electrodeposition of bright nickel, that is, to the production or bright deposits of nickel which are bright as taken from the electroplating solution without bufiing or polishing of any kind, and to the composition of solutins suitable for the pi'dduetion of such deposits.
Various solutions are known which are capable of pro= dueing bright nickel deposits. Some of these are 65 com mercial value. Some are superior in pa'rticularrespets while being inferior in other respects. Brightness, resistance to corrosion, long periods of trouble-free operation, adherence, ductility, freedorii from pits, streaks and other irregularities, resistance to impurities in the bath are some of the factors which the art seeks to find in high degree angles many as possible in one process.
I have newdiscovered a group oi closely related classes of compounds comprised within the general formula below which are excellent additives for use in acid nickel plating when used in connection with the aromatic sulfonates, sulfonarnides and suliiinide's. The latter may be referred to as control agents, the for-i'ner as brighteners or auxiliary brighteners. I
The biifg'h'teii'ef's with whih the invention i cs'neeraea are thds'e having the teams M M wherein n is an integer from 1 to 6, n is an integer from 1 to 6, R is a member selected from the group consisting of where R" and R' are independently selected earn the group consisting of hydrocarbon radicals and hydrogen; R is a member selected from the group consisting of where m is an integer from 1 to 6,
United States Patent "ice where R" and R' are independently selected from the group consisting of hydrocarbon radicals and hydrogen; W is a hydrocarbon radicalrX is an acidic radical selected from the group consisting 6f sulfate, sulfonate, halide and perchlorate radicals and t is an integer from 0 to 1 inclusive. M
The classes of brighteners referred to are as follows:
H -woman where n is 2 and the hydrogen atoms may be substituted by methyl and where W is a hydrocarbon radical, X is acidic radical selected from the group consisting of sul fate, sulfonate, halide and perchlorate radicals and t is integer from 0 to 1 inclhsive.
(WM 35); where R is a hyzi aearbea iadieal having item 1 to a: 1561i areas, it is {2 and the hydrogen atom iiiay as sub} stitu'ted by methyl, and where W is a hyaraearbeh radii-:51, X is an acidic radical selected from the roup consisting oi sulfate; sulfonate, halide and perchlorate radi'als; ai'id t is an integer from 0 to 1 inclusive.
(3) [CHs0-(CHa)n]2S where n is 2, and whre W is a hydrocarbon radical, X is an acidic radical selected from the group consisting of sulfate, sulfonate halide and perchlorate radicals, and r is an integer from 0 to 1 inclusive.
son s-m s oein -(sheaths where R and R are members independently selected from the group consisting of H and CH n is an integer from 1 to 3, and m is a n integer from 1 to 2, and where W id a hydrocarbon radical, X is an acidic radical selected from the group consistiiig of sulfate, sulfonate, halide and perchlorate radicals, and t is an integer from 0 to 1 ill.- clusive.
where is an integer from '1 to '3' and is an integer ffom 1 to 3, and Where W is a hydrocarbon radical, X is an acidic radieal selected from the group consisting of sulfate, sulfonate, halide and perchlorate radieals, and t is an integer frdiii 0 to 1 inclusive.
bdn atoms, and n is 2, and where Wis a hydrocarbon radical, X is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and perchlorate radicals, and t is an integer from to 1 inclusive.
where R is a hydrocarbon radical having from 1 to 6 carbon atoms and n is an integer from 1 to 2, and where W is a hydrocarbon radical, X is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and v perchlorate radicals, and tis an integer from '0 to. 1- inclusive. s
oi fi where R is a'hy focarbonfiradical havinggfrom i1: to'-6 carbon atoms and n is an integer from 1 to 2,. and where Wis a hydrocarbon radical, X is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and perchlorate radicals, and t is an integer from 0 to 1-. inclusive.
u c. r
where n is an integer from 1 to 2, and where W is a hydrocarbon radical, X is' an acidicradi'cal selected from the group consisting of sulfate, sulfonate, halide and perchlorate radicals, and t is an integer from 0. to .1 inclusive.
where n is an integer from 1 to 2, and where W is a hydrocarbonradioal, X is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and perchlorate radicals, and t is an integer from 0 to l inelusive,
a-tcmn-p (wk i where R is a'hydrocarbon radical having from 1 to 12 carbon atoms and n is 2, and where W is a hydrocarbon radicaL'X is an acidic radical selected from the group consisting of-vsulfate, sulfonate, halide and perchlorate radicals, ancltv is an integer fromO to l inclusive. j H
' v cameraman (W): (X): I where n is 2, and where W is a hydrocarbon radical, X is an acidic radical selected from 'the group consisting of sulfate-emanate, halide and perchlorate radicals, and t is an integer from 0 to 1 inclusive. 1 (is g P H R-S(CHz)nGNHz .Y (Kn where R is a hydrocarbon radical having from 1 to carbon atoms and n is 2, and where W is a hydrocarbon radical, X is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and perchlorate radicals, and t is an integer from 0 to 1 inclusive.
(16) g suonanornr I g U o where n is 2, and where W is a hydrocarbon radical, X is anacidicradical" selected from the group" consisting'of sulfate, sulfonate, halideandperchlorate radicals ,..and t is an integer from 0 to l inclusive.
(l7) HQCHzCHsSCHzCHaSOnCHzCHzSCHzCHzOH (W): h (WM (X):
where W is a hydrocarbon radical, X is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and perchlorate, and t is an integer from 0 to 1 inclusive.
The foregoing brighteners may be employed in the bright acid nickel plating solution at the rate. of 0.0025 to 0.075 gram per liter.
Specific examples of brightener compositions according to the invention are set forth in Table I below. 1
. TABLE 1' Preferred No. Structure 1 Name Concentrait tion, Grams per Liter N N 1. l, 5-Bi's(2'-benzlmidazolyl)-3-thiapantane, 0. 01-11015 or BlslB- '-benzimidazolyl) ethyl] sul- C-OHaCHrB-GHaCHz-C fide.
\ N E H 7 The Second addition agent, which cooiirats Withthe brightener in bright, acid, nickel plating soljitions falls into the category of organic siilfonamides', sulfir'nid, and suifonates'. 35
I The amount of control agent dissolved in the acid nickel filat ing solution ranges from ,05 gram per liter to 2 0 grarhs per liter, best results being obtained from about 2 to about 5 grams per liter. These may be used in admixture as Wellas singly. That is, two control agents may be ris'ed 70 instead of one, their combined concentration being kept within the above indicatedlirnits n It is to be understood that in the case qt the suifonium compounds, the radicalcorresponding to X iiithe general maon page 1 may be writtenas carrying a negative 75 I charge while the remainder f the ear-1 106006 me Be written as carrying a positive charge, a v. aqcmon sacm n' W X or as written in column 1, lines 38 00a 39.
TABLE IT Aromatic sulfonamides benzene monosul fonai'riide C 'H SO NH eh'at n smfiuin. Sall- C H S0 GQNNa Table IlContinued p-toluenesulfonamide I cnt c n so rln trichlorodibenzene'sulfonamide Cl C I-I SO NHSO C I-I Cl M dii-naphthalenesulfonamide o n so Nnso c rn 4-carboxydibenzenesulfonamide C H SO NHSO C H COOH 1 p,p'-methylene-bis(dibenzenesulfonamide) c n so nnso c nncn cnns0,,1-1ns0,c,n
Aromatic sulfonates benzene monosulfonic acid C H SO H benzene disulfonic acid s 4( 3 2 nickel naphthalene disulfonate 1o a( 2 s cobalt naphthalene disulfonate (CSHBSOQZCO I nickel benezene monosulfonate s 5 s)z dichlorobenezene disulionic acid 2 s 2( s 2 r f toluene sulfonic acid cn c n so n diphenyl sulfonic acid C H C H SO H 'thiophene sulionic acid C4H3S.SO3H
, diphenyl sulfone s s z s s naphthalene trisulfonic acid sodium allyl sulfonate H C= CHCH SO Na vinyl sulfonamide H O: CHSO NH The constitutents of the plating bath, according to the preferred practice of the invention, are (1) water, (2) nickel sulfate, nickel chloride, or a mixture of nickel sulfate and. nickel, chloride,. (3) the brightcner, (4) a sulfouate, a sulfonamide, a sulfimide, or one or more sulfonates, sulfonamides, sulfirnides or mixtures thereof of the type previously indicated, (5) and a wetting agent (optional). An additional ingredient of the solution which is desirable is a bufi'ering agent such as boric acid, formic acid, or the like.
It will be noted that in reference to the major constituent of the nickel plating solution, the solutions are similar to the wellknown "all chloride, all sulfate, and "sulfate-chloride" or Watts type acid nickel plating solutions. The essential novel feature of the invention is the use of an acid nickel plating solution having one or more nickel electrolytes selected from nickel sulfate and nickel chloride and additionally containing cooperating brightening agents, one of which is at least one carrier selected from the group consisting of unsaturated aliphatic sulfonamides, unsaturated aliphatic sulfimides,""uns'a'tu= without eliminating pitting.
rated aliphaticsulfonates, aromatic sulfonamides, ,aromatic sulfimides and aromatic sulfonates, and the other of which is a small amount of a brightener of the type heretofore indicated.
The basic solutions in connection with which the bright ductile nickcldeposits are realized when containing the cooperating addition agents dissolved therein are as follows: ALL SULFATE NlSO4.7HaO to 400 grams, preferably 200 to 300 grams.
Boric acid 0 to 60 grams, preferably 1010 40 grams. Wetting agent (e.g. sodium lauryl sulfate) 0 to 0.5 gram, preferably 0.05
to 0.2 gram. H20 to make 1000 cc.
ALL CHLORIDE NiChBHzO 50 to 250 grams, preferably 100 to 200 grams. Boric acid-.. O to 60 grams, preferably 10 to 40 grams. Wetting1 agent (e.g. sodium laury sulfate) 0 to 0.5 gram, preferably 0.05
to 0.2 gram H20 to make 1000 cc.
SULFATE-CHLORIDE WATTS TYPE NISOa-THaO L. 100 to 400 grams, preferably 200 to 300 grams. N1Cla.6HzO 10 60 grams, preferably 25 to grams. Boric acid 0 to 50 grams, preferably 15 to 40 grams.
Wetting agent (e.g. sodium laury1su1fate). r. 0 to 0.5 gram, preferably 0.025
; to 0.2 gram. Hi0 to make 1000 cc.
The plating solutions above identified may be operated under conditions of pH, temperature, and cathode current density which are customarily employed therewith. When the cooperating brightening agents of the invention are dissolved in the plating solutions in the amount previously indicated, bright, ductile deposits will be obtained upon electrolysis of the solution. Typical operating conditions for the basic solutions are as follows:
' All Sulfate All Chloride Watts n 3-4. 5 2.4-4. 5 3-4.5 emperature o r 120-160 100-150 -100 Cathode Current Density 7 (amp/it!) 20-40 00-200 30-10 In thepreparation of the plating solution according to the invention, I add to each of the foregoing basic solutions a suitable quantity of the brightener and also one or more of the unsaturated aliphatic, or aromatic sulfonamides, sulfimides, and sulfonates. The plating solution for the best results, contains an antipitting agent although the deposits may be suitable for some purposes Sodiumlauryl sulfate --or other wetting agents such as the sodium sulfate derivative of 7-ethyl-2-mcthyl-undecanol-4 and the dihexyl ester of sodium sulfosuccinic acid may be used as an antipitting agent, although its use is not essential and other wetting agents or mixtures of wetting agents may be used to control the pitting. For some purposes pitting may betolerated. and sometimes very little pitting occurs.
Specific examples of electroplating solutions containing .difierent cooperating brighteners and carriers are illustrated in the following table which has been designated as Table III. It should be understood that the specific electroplating solution may be employed with or,
is. l -rv' in acid nickel plating processes utilizing solutions of the type indicated herein. Y
What I claim is: 1. An aqueous acid nickel plating solution comprising a source of nickel ions selected from the class consisting of nickel sulfate, nickel chloride and mixtures thereof, said solution also containing cooperating additives for enhancing the brightness of nickel deposits produced therein, one of said additives being chosen from the class consisting-of aromatic sultonates, aromatic sulfonamides, aromatic sulfimides, aliphatic sulfonates and sulfonic acids and the second being chosen from the class of compounds having the formula R*(CH S(CH -R, where n is an integer from 1 to 6, n is an integer from 1 to 6, R is a member selected from the group consisting of IO E, -0H,-0CH5, 'i-n, i--on, -t .i'oonj nn Where m is an integer from 110 6,
R moi-crowns onionion, J-N
. h R' where W is a hydrocarbon radical, X. is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and perchlorate radicals, and t is an integer from O'to 1 inclusive, where R" and R are independently se lected from the group consisting of hydrocarbon radicals and hydrogen; R is a member selected from the group consisting of a 0 II N ll -on, -oon,, -c--n, -o-on *C -Q-(QEQmH a where m is an integer from 1 to 6, p
where R and R are independently selected from the group consisting of hydrocarbon radicals and hydrogen wherein said second mentioned additive is present in solution in concentrations of from 0.0025 to 0.075 gram per liter, and said first mentioned additive being present in solution in concentrations of from 0.05 to 20 grams per liter.
2. An aqueous, acid, nickel plating solution comprising nickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations of from 0.05 to 20 grams per liter, and being chosen from the class consisting of aromatic sulfonates, aromatic sulfonamides, aromatic sulfimides, ali- 1 0 phatic sulfonarnides and sulfonic acids, and the other-oi said cooperating additives being a compound of the formula and being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter.
3. An aqueous, acid, nickel plating solution comprising nickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations of from 0.05 to 20 grams per liter, and being chosen from the class consisting of aromatic sulfonates, aromatic sulfonarnides, aromatic sulfimides, aliphatic sulfonamides and sulfonic acids, and the other of said cooperating additives being a compound of the formula and being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter. I
4. An aqueous, acid, nickel plating solution compris ing nickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations'of from 0.05 to 20 grams per liter, and being chosen from the class consisting of aromatic sulfonate's, aromatic sulfonamides, aromatic sulfimides, aliphatic sulfonamides and sulfonic acids, and the other of said cooperating additives being a compound of the formula [CH -O--OH -CH S and being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter.
5. An aqueous, acid, nickel plating solution compris ingnickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations of from 0.05 to 20 grams per liter, and being chosen from the class consisting of aromatic sulfonates, aromatic sulfonamides, aromatic sulfimides, ali phatic sulfonamides and sulfonic acids, and the other of said cooperating additives being a compound of the formula and'being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter.
7. An aqueous, acid, nickel plating solution compris= ing nickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations of from 0.05 to 20 grams per liter, and being chosen from the class consisting of aromatic sulfonates, aromatic sulfonamides, aromatic sulfimides, aliphatic sulfonamides and sulfonic acids, and the other of said cooperating additives being a compound of the formula CHaCHzCHzSCH2CHr-t l H and being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter.
8. An aqueous, acid, nickel plating solution comprising nickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations of from 0.05 to grams per liter, and being chosen from the class consisting of aromatic sulfonates, aromatic sulfonamides, aromatic sulfimides, aliphatic sulfonamides and sulfonic acids, and the other of said cooperating additives being a compound of the formula OHaCHs-S-CHnCH and being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter.
9. An aqueous, acid, nickel plating solution comprising nickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations of from 0.05 to 20 grams per liter, and being chosen from the class consisting of aromatic sulfonates, aromatic sulfonamides, aromatic sulfimides, aliphatic sulfonamides and sulfonic acids, and the other of said cooperating additives being a compound of the formula and being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter. 11. An aqueous, acid, nickel plating solution comprising nickel sulfate and nickel chloride and cooperating additives, one of said additives being present in solution in concentrations of from 0.05 to 20 grams per liter, and being chosen from the class consisting of aromatic sulfonates, aromatic sulfonamides, aromatic sulfimides, ali 'phatic sulfonarnides and sulfonic acids and the other of said cooperating additives being a compound of the formula HOCH CH SCH OH SO CI-I CH SCH CH OH and being dissolved in said solution in concentration from 0.0025 to 0.075 gram per liter.
12. An aqueous, acid, nickel plating solution comprising a source of nickel ions selected from the class consisting of nickel sulfate, nickel chloride and mixtures thereof,
ie e-re? ll 1 ll 1 -11, -03, -0oHi, -c-H,- i-orr, C0-(0H:)mH- where m is an integer from 1 to 6,
n (wt a... (.4 a.
O /N N where R" and R" are independently selected from the group consisting of hydrocarbon radicals and hydrogen; R is a member selected from the group consisting of -'0 CH8 O-0H where m is an integer from 1 to 6,
' N/ \N (W0 ix). (wf ix.
where R" and R' are independently selected from the group consisting of hydrocarbon radicals and hydrogen; W is a hydrocarbon radical; X is an acidic radical selected from the group consisting of sulfate, sulfonate, halide and perchlorate radicals and t is an integer from 0 to 1 inclusive wherein said second mentioned additive is present in solution in concentrations of from 0.0025 to 0.075 gram per liter, and said first mentioned additive being present in solution in concentrations of from 0.05 to 20 grams per liter.-
References Cited in the file of this patent UNITED STATES PATENTS Gundel et al. Apr. 8, 1958 Strauss et a1. Oct. 27, 1959 UNITED STATES PATENT OFFICE CERTIFICATION OF CORRECTION Patent No. 3,000 799 September 19 1961 Jack L. Towle It is hereby certified that error appears in the above numbered patent requiring correction and that the said Letters Patent should read as corrected below.
Column l lines 47 to 54, the third formula should appear as shown below instead of as in the patent:
column 2, line 50 for "a n" read an column 4, line 57 after "perchlorate" insert radicals columns 5 and 6 Table I--Continued column 41; line 14 thereof for "0,0lO,Q]5"- read OOl-0,02 column 7, line 31 for "benezene" read benzene line 33., for "dichlorobenezene" read dichlorobenzene column 12, lines 8 and 9, the formula should appear as shown below instead of as in the patent:
Signed and sealed this 27th day of March 1962.
(SEAL) Attest:
ERNEST w. SWIDER DAVID L. LADfl Attesting Officer Y Commissioner of Patents Attest:
Claims (1)
1. AN AQUEOUS ACID NICKEL PLATING SOLUTION COMPRISING A SOURCE OF NICKEL IONS SELECTED FROM THE CLASS CONSISTING OF NICKEL SULFATE, NICKEL CHLORIDE AND MIXTURES THEREOF, SAID SOLUTION ALSO CONTAINING COOPERATING ADDITIVES FOR ENHANCING THE BRIGHTNESS OF NICKEL DEPOSITS PRODUCED THEREIN, ONE OF SAID ADDITIVES BEING CHOSEN FROM THE CLASS CONSISTING OF AROMATIC SULFONATES, AROMATIC CULFONAMIDES, AROMATIC SULFIMIDES, ALIPHATIC SULFONATES AND SULFONIC ACIDS AND THE SECOND BEING CHOSEN FROM THE CLASS OF COMPOUNDS HAVING THE FORMULA R$-(CH2)N''-S(CH2)N-R'', WHERE N IS AN INTEGER FROM 1 TO 6, N'' IS AN INTEGER FROM 1 TO 6, R IS A MEMBER SELECTED FROM THE GROUP CONSISTING OF
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7783A US3000799A (en) | 1960-02-10 | 1960-02-10 | Nickel plating solutions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7783A US3000799A (en) | 1960-02-10 | 1960-02-10 | Nickel plating solutions |
Publications (1)
Publication Number | Publication Date |
---|---|
US3000799A true US3000799A (en) | 1961-09-19 |
Family
ID=21728123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US7783A Expired - Lifetime US3000799A (en) | 1960-02-10 | 1960-02-10 | Nickel plating solutions |
Country Status (1)
Country | Link |
---|---|
US (1) | US3000799A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3245887A (en) * | 1963-01-31 | 1966-04-12 | M & T Chemicals Inc | Electrodeposition of nickel |
US4046647A (en) * | 1976-06-17 | 1977-09-06 | M&T Chemicals Inc. | Additive for improved electroplating process |
US20080012328A1 (en) * | 2005-09-29 | 2008-01-17 | Neoperl Gmbh | Sanitary line connection |
US20160231651A1 (en) * | 2015-02-10 | 2016-08-11 | Tokyo Ohka Kogyo Co., Ltd. | Chemically amplified positive-type photosensitive resin composition for thick film |
JP7162162B1 (en) * | 2022-03-01 | 2022-10-27 | 株式会社Jcu | Plating solution containing ether compound containing sulfonio group |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2830014A (en) * | 1954-03-22 | 1958-04-08 | Dehydag Gmbh | Electroplating process |
US2910413A (en) * | 1955-01-19 | 1959-10-27 | Dehydag Gmbh | Brighteners for electroplating baths |
-
1960
- 1960-02-10 US US7783A patent/US3000799A/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2830014A (en) * | 1954-03-22 | 1958-04-08 | Dehydag Gmbh | Electroplating process |
US2910413A (en) * | 1955-01-19 | 1959-10-27 | Dehydag Gmbh | Brighteners for electroplating baths |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3245887A (en) * | 1963-01-31 | 1966-04-12 | M & T Chemicals Inc | Electrodeposition of nickel |
US4046647A (en) * | 1976-06-17 | 1977-09-06 | M&T Chemicals Inc. | Additive for improved electroplating process |
US20080012328A1 (en) * | 2005-09-29 | 2008-01-17 | Neoperl Gmbh | Sanitary line connection |
US20160231651A1 (en) * | 2015-02-10 | 2016-08-11 | Tokyo Ohka Kogyo Co., Ltd. | Chemically amplified positive-type photosensitive resin composition for thick film |
US9977328B2 (en) * | 2015-02-10 | 2018-05-22 | Tokyo Ohka Kogyo Co., Ltd. | Chemically amplified positive-type photosensitive resin composition for thick film |
JP7162162B1 (en) * | 2022-03-01 | 2022-10-27 | 株式会社Jcu | Plating solution containing ether compound containing sulfonio group |
WO2023166552A1 (en) * | 2022-03-01 | 2023-09-07 | 株式会社Jcu | Plating solution containing sulfonio group-containing ether compound |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US2647866A (en) | Electroplating of nickel | |
US2882208A (en) | Electrodeposition of nickel | |
US3000799A (en) | Nickel plating solutions | |
US3041255A (en) | Electrodeposition of bright nickel | |
US2523190A (en) | Electrodeposition of nickel from an acid bath | |
US2978391A (en) | Nickel plating process and solution | |
US3288690A (en) | Electrodeposition of copper from acidic baths | |
US2550449A (en) | Electrodeposition of nickel from an acid bath | |
US2849353A (en) | Bright nickel plating | |
US3220940A (en) | Electrodeposition of nickel | |
US2427280A (en) | Nickel electroplating composition | |
US2972571A (en) | Nickel plating solutions | |
US2466677A (en) | Electrodeposition of nickel from an acid bath | |
US2986500A (en) | Electrodeposition of bright nickel | |
US2994648A (en) | Nickel plating additives | |
US3139393A (en) | Electrodeposition | |
US2648628A (en) | Electroplating of nickel | |
US2541700A (en) | Electroplating copper | |
US2852449A (en) | Electrodeposition of nickel | |
US3152975A (en) | Electrodeposition of nickel | |
US2839460A (en) | Electrolating | |
US2757133A (en) | Electrodeposition of nickel | |
US2429970A (en) | Silver plating | |
US3711384A (en) | Electrodeposition of nickel | |
US2523191A (en) | Electrodeposition of nickel from an acid bath |