US2882208A - Electrodeposition of nickel - Google Patents

Electrodeposition of nickel Download PDF

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US2882208A
US2882208A US685417A US68541757A US2882208A US 2882208 A US2882208 A US 2882208A US 685417 A US685417 A US 685417A US 68541757 A US68541757 A US 68541757A US 2882208 A US2882208 A US 2882208A
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nickel
group
liter
sulfonimides
gram
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US685417A
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Donald H Becking
Richard J Clauss
Brown Henry
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Occidental Chemical Corp
Udylite Research Corp
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Udylite Research Corp
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Priority to GB21538/58A priority patent/GB850134A/en
Priority to FR1211476D priority patent/FR1211476A/en
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Assigned to HOOKER CHEMICALS & PLASTICS CORP. reassignment HOOKER CHEMICALS & PLASTICS CORP. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: OXY METAL INDUSTRIES CORPORATION
Assigned to OCCIDENTAL CHEMICAL CORPORATION reassignment OCCIDENTAL CHEMICAL CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). EFFECTIVE MARCH 30, 1982. Assignors: HOOKER CHEMICAS & PLASTICS CORP.
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16—Acetylenic compounds

Definitions

  • concentrations that are necessary for high brilliance without excessive brittleness are very low, 0.001 to 0.01 gram per liter, much lower than the recommended concentrations for compounds carrying' separately either the -CEC-gro-up or the -CEN group.
  • concentrations that are necessary for high brilliance without excessive brittleness are very low, 0.001 to 0.01 gram per liter, much lower than the recommended concentrations for compounds carrying' separately either the -CEC-gro-up or the -CEN group.
  • the presence of both types of triple bonds in the same molecule exerts an enhanced brightening effect over either one alone.
  • the compounds of Table. I are preferably used in concentrations of 0.001 to 0.005 gram/liter in conjunction with the organic sulfon-compounds illustratedin Table II.
  • the compounds of Table I can be used in conjunction with other nickel brighteners such as those I containing the bond (U.S. Patent 2,647,866, August 4, 1953), u ing lower concentrations of the compounds ofrTable I to- :gether with lower concentrations of p a-.. compounds giving improved results.
  • the combination of the compounds of Table I with those of Table II can be used in all types of acidic nickel baths that give good ductile gray nickel deposits, such as Watts nickel baths, high chloride, fluoborate, and sulfamate baths and mixtures of these various nickel salts.
  • Sodium, potassium, and lithium ions may be pres- 'ent, also ammonium ions, though the latter should prefferably be kept below about 7 grams/liter for maximum ductility and brightness.
  • Boric acid is the preferred buffer.
  • the best pH range is from about 2.8 to 4.5, though pH values of 2 to 6 may be used.
  • the temperature of the bath may be from room to 190 F., though in general 120 F. to 160 F. is preferred.
  • a suitable surface-active agent such as sodium lauryl sulfate, sodium 2-ethyl 'hexyl sulfate or sul'fonate, octyl sulfonic acid, etc.
  • a surface active agent such as sodium 2-ethyl hexyl sulfate or' sulfonate can be used which does not foam excessively, or else an anti-foam such as a silicone oil can be used with a more powerful sm'face-ac'tive agent, such as sodium lauryl sulfate.
  • the preferred organic sulfon-compounds to be used with the compounds of Table I are o-benzoyl sulfimide and the benzene sulfonamides and sulfonimides (0.1 gram/liter 'to saturation) especially when used in conjunction with allyl 'sul-fonic acid (0.6-2 grams per liter) or 2-butyne-1,4-disulfonic acid (2-10 grams/liter).
  • Sodium allyl sulfonate 0.6-2 Benzene sulfonamide 1-"2 o-Benzoyl sulfiinide j Temperature, 120 F.-1,60 F. pH, 3.2-4.8.
  • Example B Y I Grant /liter 'NiCl jH Q 100-200 NiSO .6H O H3BO3
  • Example 2 of Table I 0002-0005 Sodium allyl sulfonate 0.6-2 oBenzoyl sulfimide 1-2 Beniene sulfonamide 1-2 Temperature, 120 F.-160 F. pH, 3.2-4.8.
  • Example C Grams/liter NiSO .6H O 200-300 NiC1 .6H O 30-100 H BO 30-50
  • Example 10 of Table I 0.005-0015 2-butyne-1,4-disulfonic acid (Na, K or Ni Temperature, F.- F. pH, 3.2 to 4.8.
  • the above baths give brilliant ductile nickel deposits with very good rate of brightening or leveling.
  • a bath for electrodepositing bright, ductile nickel plate which comprises an aqueous acidic solution containing -at least one electrolyte selected from the group consisting of nickel sulfate, nickel chloride, nickel fluoborate and nickel s'ulfamate, and having dissolved therein about 0.1 gram/liter to saturation of at least one organic sulfoncompound selected from the class consisting of benzene, biphenyl andnaphthalene 'sulfonic acids, sulfonamides and sulfonirni'des and the mixed phenyl, biphenyl and naphthyl stilfonamides and the mono-, di-, tri-, and tetra-sulfo'nimid'es thereof, and dibenzene sulfonimides and the halogen, methyl, and aldehydo derivatives of said sulfonic acids, sulfonamides and sulfonimides, and
  • the said uitrile is the compound OH] 'SHCEC- -li-OtZiEO'N ahdis dissolved'in the said nickel bath in a concentration at 0.001 to about 0.01-gram/liter.
  • a bath in accordance with claim 1 wherein said organic sulfon-compound is 2-butyne-l,4-disulfonate.
  • a method of electrodepositing bright, ductile nickel plate which comprises 'electrolyz'ing an aqueous acidic solution comprising at least one nickel salt selected from the group consisting of nickel sulfate, nickel chloride, nickel fiuoborate and nickel sulfamate, said bath containing dissolved therein about 0.1 gram/liter to saturation of at least one organic sulfon-compound selected from the group consisting of benzene, biphenyl and naphthalene sulfonic acids, sulfonamides and sulfonimides and the mixed phenyl, biphenyl and naphthyl sulfonamides and the mono-, di-, tri-, and tetra-sulfonimides thereof, and dibenzene sulfonimides and the halogen, methyl, and aldehydo derivatives of said sulfonic acids, sulfonamides and sulfonimides, and beta
  • a method in accordance with claim 7 wherein said organic sulfon-compound is allyl sulfonate.
  • a bath in accordance with claim 1 wherein the said nitrile is the compound N E CC2H4OH2CC E and is present in a concentration in the bath of about 0.001 to about 0.01 gram/liter.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Description

l'at ented Apr. 14, 1959 2,882,208 ELECTRODEPOSITION OF NICKEL Donald H. Becking, Birmingham, Richard J. Clauss, Grosse Pointe Park, and Henry Brown, Huntington Woods, Mich., assignors to The Udylite Research Cor-j poration, Detroit, Mich., a corporation of Michigan No Drawing. Application September 23, 1957 Serial No. 685,417
14 Claims. (Cl. 204-49) In accordance with thisinvention, it has been found that certain unsaturated organic compounds containing both the triple bonded C-=-C-unsaturated group and the triple bonded unsaturated CEN group in the same molecule, as exemplified by the compounds of Table I, give brilliant ductile plate when used in aqueous acidic nickel baths in unusually small concentrations in conjunction with the'well-known organic .sulfon-compounds as exemplified in Table II.
While it is old to use compounds containing/the cyano group (nitriles), (US. Patent 2,524,010, September 26, 1950), in conjunctionwith the organic sulfoncompounds, nevertheless the concentrations necessary to obtain bright plate have been between 0.1 gram to 1 gram per liter. It has been found that on continued electrolysis of nickel baths using concentrations of 0.1 g./l.- to 1 g./l. of cyano compounds such ascyanoacetamide, lactonitrile, etc. not containing a sulfonic acid, in the same molecule, that there accumulates hydrolytic and electrolytic degradation products which cause increasing brittleness in the bath with the continued additions necessary to maintain brightness during continuous plating. It has also been found that the harmful break-down products formed during continuous electrolysis in the case of such aliphatic nitriles as cyanoacetamide, lactonitrile and others are not readily removed by activated carbon or absorptive clays, and the nickel baths give increasingly brittle plate andbecome exceedingly difiicult to purify. These serious embrittling defects are not encountered with the compounds of Table I which contain both the C z -N and CEC-unsaturated groups. It Will be noted that in each of the compounds of Table I, the CEN group is separated by an ether linkage from the CEC group. This linkage is considered to be an important contributor ot the effectiveness of these compounds. The concentrations that are necessary for high brilliance without excessive brittleness are very low, 0.001 to 0.01 gram per liter, much lower than the recommended concentrations for compounds carrying' separately either the -CEC-gro-up or the -CEN group. The presence of both types of triple bonds in the same molecule exerts an enhanced brightening effect over either one alone.
The compounds of Table. I are preferably used in concentrations of 0.001 to 0.005 gram/liter in conjunction with the organic sulfon-compounds illustratedin Table II. The compounds of Table I can be used in conjunction with other nickel brighteners such as those I containing the bond (U.S. Patent 2,647,866, August 4, 1953), u ing lower concentrations of the compounds ofrTable I to- :gether with lower concentrations of p a-.. compounds giving improved results.
TABLE I Optimum Cone, grams/liter E (1) I'iozo-o-o CYZHACEN 0. 001-0. 005
3-(beta-cyanoethoxy)-3-rnethyl-butyne-1 e (-2) HCEO(l1-O C2H40 C2H4CEN 0. 001-0. 008
. em (s) Ho5ceo 0113.0 0.1140 onncEN 0. 001-0. 008
CH: I
'CzHs I 4 HCECCO C2H4CEN 0. 001-0. 005
( s Bozo-c1120 CzHtCEN 0. 001-0. 003 (6) HCEC-CH2O CZHJO ORHACEN 0. 001-0. 005
HCEC(IJ--O 021140 021340 CzH4CEN I CH3 w (8 HCEC-(f-OCzEQCEN. 0.001-0.005
CHzOCHtCEC-CHzOCzHtOEN 0.001-0.01 (10) HOCHr-CECCH2OC2H4CEN (1003-0015 (11) NEC-GzHiOHzCCEOCHzO CzH CEN 0. 001-0. 01
TABLE II 0 timum Sulfur-Containing Brighteners one grams/liter Benzene sulfonamide 0.1-3 Toluenesulionamides (oand p- 0. 1-2 o-Benzoyl su1fimide 0.1-2 N-Benzoyl benzene sulfonimide 0.1-1 p-Toluene sulfonch10ran1ide. 0. 1-1 p-Brom benzene sulfonamide- 0.1-1 6 Chlor ob enzoy1 sulfimide. 0.1-1 m-Aldehydo benzene sulfonamide 0. 1-1 Sulfomethyl benzene sulfonamide 0. 1-6 Benzene sulfonamide m-carboxylic ami e. 0. 1-3 7-Aldehydo o-benzoyl sulfimide 0. 1-3 N-acetyl benzene sulfonimide. 0. 1-2 Methoxy benzene sulfonamides 0.1-1 Hydroxymethyl benzene sultona 0. 1-2 Allyl sultonamide 0, 4-12 Benzene sulionic acids (mono-, di 1-15 p-Brorn benzene sulfonic acid 3-6 'Benzaldehyde sulfonie acids (0, m, p) 2-0 Diphenyl sulfone sulfonic acid 1-8 Naphthalene sulfonic acids (mono-, di-, and tri-) 1-8 Benzene sulfohydroxarnic acid 1-5 p-Chlor benzene sulfonic acid' 1-15 Diphenyl sulfonic acid- 1-5 m-Diphenyl benzene sulfonic acid. l-4 2-Chloro-5-sul1obenzaldehyde 1-5 m-Benzene disulfonamide- 0. 5-1 Allyl,su.lfonic acid 0. 4-12 Dichlorobenzene sultonic acids" 0.5-8 .Dibenzene sulf0nimide 0. 1-3 Di-toluene sulfonimide--. 0. 1-3 Z-Bntyne-l, 4-disu1ionic ac 5-20 4-Hydr0xy-2-butyne-1-sulton 0. 2-2 2 Butyne-l-sultonic acid 0 05-1. 5 3 Oh1or0-2-propyne-1-sulfoni 0 05-1. 6 2-butene-L4-disulfonic acid-.. 03-5 2-chloro butene-4-sult'onic acid 0.3-5 2-chloro propene sulfonic acid 0. 1-1. 5 Cinnamyl sulionic acid 0. 1-3. 0 3-1henyl-2-propyne-l-sulfonic acid. 0. 3-3. 0 4-Methoxy-2-butyne-1-sulionic acid 0. 2-2
The more rapid the rate of cathode or solution agitation, the lower the concentration of the compounds of Table I that are necessary for high brilliance. For example, with strong air agitation of the bath, the lower concentrations of the compounds of Table I are used.
The combination of the compounds of Table I with those of Table II can be used in all types of acidic nickel baths that give good ductile gray nickel deposits, such as Watts nickel baths, high chloride, fluoborate, and sulfamate baths and mixtures of these various nickel salts. Sodium, potassium, and lithium ions may be pres- 'ent, also ammonium ions, though the latter should prefferably be kept below about 7 grams/liter for maximum ductility and brightness. Boric acid is the preferred buffer.
The best pH range is from about 2.8 to 4.5, though pH values of 2 to 6 may be used. The temperature of the bath may be from room to 190 F., though in general 120 F. to 160 F. is preferred.
When no air agitation or strong mechanical or hydraulie agitation is used, it is preferred to use a suitable surface-active agent such as sodium lauryl sulfate, sodium 2-ethyl 'hexyl sulfate or sul'fonate, octyl sulfonic acid, etc., to prevent gas-pitting. With air agitation a surface active agent such as sodium 2-ethyl hexyl sulfate or' sulfonate can be used which does not foam excessively, or else an anti-foam such as a silicone oil can be used with a more powerful sm'face-ac'tive agent, such as sodium lauryl sulfate.
The preferred organic sulfon-compounds to be used with the compounds of Table I are o-benzoyl sulfimide and the benzene sulfonamides and sulfonimides (0.1 gram/liter 'to saturation) especially when used in conjunction with allyl 'sul-fonic acid (0.6-2 grams per liter) or 2-butyne-1,4-disulfonic acid (2-10 grams/liter).
In the following examples typical bath compositions and conditions are illustrated for obtaining the bright nickel deposits in accordance with this invention, but it is to be understood that they are representative only, and that the compounds of Table I can be used in such bath compositions in combination with each compound or combinations of the compounds of Table II or other organic Stilton-compounds similar to those of Table II such V H M smmmOO- O in the approximate -proportions indicated in Table II.
Example A Grams/liter NiSO .6H O 200-300 NiCl .6H O 30-80 130 so-so NaBFd I 0-015 Example 1 of Table I: 3-{beta cyano'ethoxy)- p n 3-methyl-butyne-l 0.001-0.004 Sodium allyl sulfonate 0.6-2 Benzene sulfonamide 1-"2 o-Benzoyl sulfiinide j Temperature, 120 F.-1,60 F. pH, 3.2-4.8.
Example B Y I Grant /liter 'NiCl jH Q 100-200 NiSO .6H O H3BO3 Example 2 of Table I 0002-0005 Sodium allyl sulfonate 0.6-2 oBenzoyl sulfimide 1-2 Beniene sulfonamide 1-2 Temperature, 120 F.-160 F. pH, 3.2-4.8.
4 Example C Grams/liter NiSO .6H O 200-300 NiC1 .6H O 30-100 H BO 30-50 Example 10 of Table I 0.005-0015 2-butyne-1,4-disulfonic acid (Na, K or Ni Temperature, F.- F. pH, 3.2 to 4.8.
The above baths give brilliant ductile nickel deposits with very good rate of brightening or leveling.
What is claimed is:
'1. A bath for electrodepositing bright, ductile nickel plate which comprises an aqueous acidic solution containing -at least one electrolyte selected from the group consisting of nickel sulfate, nickel chloride, nickel fluoborate and nickel s'ulfamate, and having dissolved therein about 0.1 gram/liter to saturation of at least one organic sulfoncompound selected from the class consisting of benzene, biphenyl andnaphthalene 'sulfonic acids, sulfonamides and sulfonirni'des and the mixed phenyl, biphenyl and naphthyl stilfonamides and the mono-, di-, tri-, and tetra-sulfo'nimid'es thereof, and dibenzene sulfonimides and the halogen, methyl, and aldehydo derivatives of said sulfonic acids, sulfonamides and sulfonimides, and beta unsaturated alkene and alkyne sulrfonic acids having 4-2 carbon atoms, and about 0.001 to about 0.015 gram/liter of a nitrile having the elements hydrogen, nitrogen, oxyg'en 'and 6-1-7 carbon atoms inclusive and containing a -;CC group, which CEC group is separated from the -C-EN group by at least one ether linkage.
'2. A bath in accordance with claim 1 wherein the said nitrile the compound and is present in a concentration in the bath of 0.001 to about 0.008 gram/liter. 3. A bath in accordance with claim 1 wherein the said uitrile is the compound OH] 'SHCEC- -li-OtZiEO'N ahdis dissolved'in the said nickel bath in a concentration at 0.001 to about 0.01-gram/liter. V ,-4.'A bath in accordance with claim 1 wherein the said nitrile is the compound HCECCH 0C H CN and is dissolved in the said nickel bath in a concentration of 0.001 to about 0.01 gram/liter.
55A bath in accordance with claim 1 wherein said organic sulfon-compound is allyl sulfonate.
6. A bath in accordance with claim 1 wherein said organic sulfon-compound is 2-butyne-l,4-disulfonate.
7 A method of electrodepositing bright, ductile nickel plate which comprises 'electrolyz'ing an aqueous acidic solution comprising at least one nickel salt selected from the group consisting of nickel sulfate, nickel chloride, nickel fiuoborate and nickel sulfamate, said bath containing dissolved therein about 0.1 gram/liter to saturation of at least one organic sulfon-compound selected from the group consisting of benzene, biphenyl and naphthalene sulfonic acids, sulfonamides and sulfonimides and the mixed phenyl, biphenyl and naphthyl sulfonamides and the mono-, di-, tri-, and tetra-sulfonimides thereof, and dibenzene sulfonimides and the halogen, methyl, and aldehydo derivatives of said sulfonic acids, sulfonamides and sulfonimides, and beta unsaturated alkene and alkyne sulfonic acids having 4-2 carbon atoms, and about 0.001 to about 0.015 gram/ liter of a nitrile having the elements hydrogen, nitrogen, oxygen and 6-17 carbon atoms inclusive and containing a CEC group, which CEC group is separated from the CEN group by at least one ether linkage.
8. A method in accordance with claim 7 wherein the said nitrile is the compound and is present in a concentration in the bath of 0.001 to about 0.008 gram/liter.
9. A method in accordance with claim 7 wherein the said nitrile is the compound 6 and is present in the said nickel bath in a concentration of 0.001 to about 0.01 gram/liter.
10. A method in accordance with claim 7 wherein the said nitrile is the compound I-ICECCH OC H CN and is present in the said nickel bath in a concentration of 0.001 to about 0.01 gram/liter.
11. A method in accordance with claim 7 wherein said organic sulfon-compound is allyl sulfonate.
12. A method in accordance with claim 7 wherein said organic sulfon-compound is Z-butyne-l,4-disulfonate.
13. A bath in accordance with claim 1 wherein the said nitrile is the compound N E CC2H4OH2CC E and is present in a concentration in the bath of about 0.001 to about 0.01 gram/liter.
14. A method in accordance with claim 7 wherein the said nitrile is the compound Du Rose et a1 Sept. 26, 1950 Brown July 23, 1957

Claims (1)

1. A BATH FOR ELECTRODEPOSITING BRIGHT, DUCTILE NICKEL PLATE WHICH COMPRISES AN AQUEOUS ACIDIC SOLUTION CONTAINING AT LEAST ONE ELECTROLYTESELECTED FROM THE GROUP CONSISTING OF NICKEL SULFATE, NICKEL CHLORIDE, NICKEL FLUOBORATE AND NICKEL SULFAMATE, AND HAVING DISSOLVED THEREIN ABOUT 0.1 GRAM/LITER TO SATURATION OF AT LEAST ONE ORGANIC SULFONCOMPOUND SELECTED FROM THE CLASS CONSISTING OF BENZENE, BIPHENYL AND NAHTHALENE SULFONIC ACIDS, SULFONAMIDES AND SULFONIMIDES AND THE MIXED PHENYL, BIPHENYL AND NAPHTHYL SULFONAMIDES AND THE MONO-, DI-, TRI-, AND TETRA-SULFONIMIDES THEREOF, AND DIBENZENE SULFONIMIDES, AND THE HALOGEN METHYL, AND ALDEHYDO DERIVATIVES OF SAID SULFONIC ACIDS, SULFONAMIDES AND SULFONIMIDES, AND BETA UNSATURATED ALKENE AND ALKYNE SULFONIC ACIDS HAVING 4-2 CARBON ATOMS, AND ABOUT 0.001 TO ABOUT 0.015 GRAM/LITER OF A NITRILE HAVING THE ELEMENTS HYDROGEN, NITROGEN, OXYGEN AND 6-17 CARBON ATOMS INCLUSIVE AND CONTAINING A -C$C GROUP, WHICH -C$C GROUP IS SEPARATED FROM THE -C$N GROUP BY AT LEAST ONE ETHER LINKAGE.
US685417A 1957-09-23 1957-09-23 Electrodeposition of nickel Expired - Lifetime US2882208A (en)

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Application Number Priority Date Filing Date Title
DENDAT1071439D DE1071439B (en) 1957-09-23 Acid bath for the galvanic deposition of nickel coatings
US685417A US2882208A (en) 1957-09-23 1957-09-23 Electrodeposition of nickel
GB21538/58A GB850134A (en) 1957-09-23 1958-07-04 Improvements in or relating to the electrodeposition of nickel
FR1211476D FR1211476A (en) 1957-09-23 1958-07-28 Improvements in electrolytic deposition of nickel

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2978391A (en) * 1958-08-25 1961-04-04 Harshaw Chem Corp Nickel plating process and solution
US2994648A (en) * 1960-04-22 1961-08-01 Harshaw Chem Corp Nickel plating additives
US3089888A (en) * 1961-05-05 1963-05-14 Gen Aniline & Film Corp Sulfates of alkenoxylated butynediol
US3093557A (en) * 1961-08-25 1963-06-11 Westinghouse Electric Corp Methods and electrolytes for depositing nickel and cobalt
US3114687A (en) * 1961-03-10 1963-12-17 Int Nickel Co Electrorefining nickel
US3219559A (en) * 1958-04-23 1965-11-23 Barnet D Ostrow Additive for level nickel plating
US3305462A (en) * 1965-09-02 1967-02-21 Barnet D Ostrow Acid nickel electroplating bath
US3366557A (en) * 1958-07-22 1968-01-30 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3429789A (en) * 1965-10-19 1969-02-25 Lea Ronal Inc Carbamate containing acid nickel plating bath
US3460953A (en) * 1966-05-27 1969-08-12 Pennsalt Chemicals Corp Process for depositing brasslike coatings and composition therefor
US4764262A (en) * 1979-09-13 1988-08-16 M&T Chemicals Inc. High quality, bright nickel plating
US6045682A (en) * 1998-03-24 2000-04-04 Enthone-Omi, Inc. Ductility agents for nickel-tungsten alloys

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1221873B (en) * 1961-07-08 1966-07-28 Dehydag Gmbh Galvanic nickel baths

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2524010A (en) * 1946-07-12 1950-09-26 Harshaw Chem Corp Electrodeposition of nickel
US2800440A (en) * 1955-10-04 1957-07-23 Udylite Res Corp Electrodeposition of nickel

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2524010A (en) * 1946-07-12 1950-09-26 Harshaw Chem Corp Electrodeposition of nickel
US2800440A (en) * 1955-10-04 1957-07-23 Udylite Res Corp Electrodeposition of nickel

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3219559A (en) * 1958-04-23 1965-11-23 Barnet D Ostrow Additive for level nickel plating
US3366557A (en) * 1958-07-22 1968-01-30 Hanson Van Winkle Munning Co Electrodeposition of nickel
US2978391A (en) * 1958-08-25 1961-04-04 Harshaw Chem Corp Nickel plating process and solution
US2994648A (en) * 1960-04-22 1961-08-01 Harshaw Chem Corp Nickel plating additives
US3114687A (en) * 1961-03-10 1963-12-17 Int Nickel Co Electrorefining nickel
US3089888A (en) * 1961-05-05 1963-05-14 Gen Aniline & Film Corp Sulfates of alkenoxylated butynediol
US3093557A (en) * 1961-08-25 1963-06-11 Westinghouse Electric Corp Methods and electrolytes for depositing nickel and cobalt
US3305462A (en) * 1965-09-02 1967-02-21 Barnet D Ostrow Acid nickel electroplating bath
US3429789A (en) * 1965-10-19 1969-02-25 Lea Ronal Inc Carbamate containing acid nickel plating bath
US3460953A (en) * 1966-05-27 1969-08-12 Pennsalt Chemicals Corp Process for depositing brasslike coatings and composition therefor
US4764262A (en) * 1979-09-13 1988-08-16 M&T Chemicals Inc. High quality, bright nickel plating
US6045682A (en) * 1998-03-24 2000-04-04 Enthone-Omi, Inc. Ductility agents for nickel-tungsten alloys

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GB850134A (en) 1960-09-28
DE1071439B (en) 1959-12-17

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