US2989448A - Brass, copper-tin, and copper plating bath brightener - Google Patents
Brass, copper-tin, and copper plating bath brightener Download PDFInfo
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- US2989448A US2989448A US804880A US80488059A US2989448A US 2989448 A US2989448 A US 2989448A US 804880 A US804880 A US 804880A US 80488059 A US80488059 A US 80488059A US 2989448 A US2989448 A US 2989448A
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- metal
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- copper
- ounces
- tin
- Prior art date
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Links
- 238000007747 plating Methods 0.000 title claims description 26
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 title claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title description 15
- 229910052802 copper Inorganic materials 0.000 title description 15
- 239000010949 copper Substances 0.000 title description 15
- 229910001369 Brass Inorganic materials 0.000 title description 10
- 239000010951 brass Substances 0.000 title description 10
- 229910052751 metal Inorganic materials 0.000 claims description 89
- 239000002184 metal Substances 0.000 claims description 89
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 72
- 239000000080 wetting agent Substances 0.000 claims description 26
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 claims description 8
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 claims description 5
- HJTAZXHBEBIQQX-UHFFFAOYSA-N 1,5-bis(chloromethyl)naphthalene Chemical compound C1=CC=C2C(CCl)=CC=CC2=C1CCl HJTAZXHBEBIQQX-UHFFFAOYSA-N 0.000 claims description 4
- GOLCXWYRSKYTSP-UHFFFAOYSA-N arsenic trioxide Inorganic materials O1[As]2O[As]1O2 GOLCXWYRSKYTSP-UHFFFAOYSA-N 0.000 claims description 4
- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical compound [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 claims description 4
- VLOJXAQYHIVPFI-UHFFFAOYSA-H lead(2+);diacetate;tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Pb+2].[Pb+2].[Pb+2].CC([O-])=O.CC([O-])=O VLOJXAQYHIVPFI-UHFFFAOYSA-H 0.000 claims description 4
- 229940079864 sodium stannate Drugs 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052785 arsenic Inorganic materials 0.000 description 21
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 21
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 20
- 229910052718 tin Inorganic materials 0.000 description 20
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 19
- 229960001484 edetic acid Drugs 0.000 description 15
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 14
- 229910052720 vanadium Inorganic materials 0.000 description 10
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 10
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 8
- 229910052787 antimony Inorganic materials 0.000 description 8
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 8
- 229910052797 bismuth Inorganic materials 0.000 description 8
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 8
- 229910052711 selenium Inorganic materials 0.000 description 8
- 239000011669 selenium Substances 0.000 description 8
- 229910052714 tellurium Inorganic materials 0.000 description 8
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 8
- 229910000581 Yellow brass Inorganic materials 0.000 description 7
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 7
- 229910000906 Bronze Inorganic materials 0.000 description 6
- 239000010974 bronze Substances 0.000 description 6
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical class [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 4
- 125000002877 alkyl aryl group Chemical group 0.000 description 3
- 238000013019 agitation Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- GTLDTDOJJJZVBW-UHFFFAOYSA-N zinc cyanide Chemical compound [Zn+2].N#[C-].N#[C-] GTLDTDOJJJZVBW-UHFFFAOYSA-N 0.000 description 2
- 229910052728 basic metal Inorganic materials 0.000 description 1
- 150000003818 basic metals Chemical class 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
Definitions
- An object of the invention is to provide a single basic brightener which will operate satisfactorily and with equal results in brass, copper-tin and copper plating baths.
- Another object of the invention is to accomplish what has long been desired in the art of electroplatingto deposit copper, copper-tin.and brass in such a manner as to cause a smoothing out of the surface imperfections of the underlying metal plated and to maintain this surface over wide ranges in current densities and temperatures.
- Still another object is to provide a brightener which will deposit copper, copper-tin or brass in a fully bright condition from the plating bath without agitation or periodic reverse of the bath.
- the general composition of the brightener is the metals lead, arsenic, tin and vanadium and organic materials alkyl-aryl amine type wetting agent and ethylenediaminetetra acetic acid (Versene).
- metals lead, arsenic, tin and vanadium and organic materials alkyl-aryl amine type wetting agent and ethylenediaminetetra acetic acid (Versene).
- tellurium, selenium, antimony or bismuth in the same quantities as the vanadium in the examples hereinafter set forth can be used to replace the vanadium and good results still be obtained.
- composition of the brightener is as follows:
- the plating bath formulas, the proportions in which they should be maintained and the amount of brightener needed to produce the best result is as follows:
- All three types of plating baths are worked at temperatures from 135 to 160 degrees Fahrenheit and all three produce bright plated deposits at from 3 to a.p.s.f. Agitation or periodic reverse is not required.
- the free NaCN is kept at the same ratio to copper cyanide in all three plating baths. (.6 ounce of free sodium cyanide for each one ounce of copper cyanide which is contained in the plating bath). This ratio is kept regardless of any other metal present in the bath such as ZnCN in the brass or NaSnO in the bronze.
- the brightener provides bright deposits at the temperatures of the baths to degrees).
- High C/D can be employed without burningthe deposit.
- Excellent color control is provided overwide range in C/D. in the brass and bronze baths.
- a leveling of the basic metal occurs by the metal being deposited and the metal is deposited in a fully bright condition.
- the vanadium in the brightener can be replaced by tellurium, selenium, antimony or bismuth.
- Examples of plating baths showing such replacement are as follows:
- Copper plating bath 7 Ounces per gallon Free NaCN 4.8 CuCN 8.0 NaOH 8.0 Arsenic (as metal) .015 Lead (as metal) .0034 Tellurium (as metal) .0009 Tin (as metal) .02 Wetting agent .5 Ethylenediaminetetra acetic acid .25
- a brightener for plating a metal selected from the group consisting of copper, copper-tin and brass comprising the following in the following proportions, sixteen ounces sodium hydroxide, six ounces arsenic trioxide, six tenths ounce lead subacetate, three ounces sodium stannate, two tenths ounce vanadium pentoxide, one and six tenths ounces ethylenediaminetetra acetic acid tetrasodium salt, three and two tenths ounce alkyl-aryl amine type wetting agent and water sufficient to make one gallon of brightener.
- a copper plating bath comprising the following in the following proportions per gallon: 4.8 ounces free sodium cyanide, 8.0 ounces copper cyanide, 8.0 ounces sodium hydroxide, .015 ounce arsenic (as metal), .0034 ounce lead (as metal), .0009 ounce vanadium (as metal), .02 ounce tin (as metal), .5 ounce wetting agent and .25 ounce ethylenediaminetetra acetic acid tetrasodium salt.
- a copper-tin plating bath comprising the following in the following proportions per gallon: 1.8 ounces free sodium cyanide, 3.5 ounces NaSnO 3.0 ounces copper cyanide, 6.0 ounces Rochelle salts, 1.5 ounces sodium hydroxide, .005 ounce arsenic (as metal), .001 ounce lead (as metal), .003 ounce vanadium (as metal), .006
- a yellow brass plating bath comprising the following in the following proportion per gallon: 4.8 ounces free sodium cyanide, 8.0 ounces copper cyanide, 10.0 ounces sodium hydroxide, .5 ounce zinc cyanide, 2.0 ounces Rochelle salts, .015 ounce arsenic (as metal), .0034 ounce lead (as metal), .02 ounce tin (as metal), .0009 ounce vanadium (as metal), .5 ounce wetting agent and .25 ounce ethylenediaminetetra acetic tetrasodium salt.
- a yellow brass plating bath comprising the following in the following proportions per gallon: 4.8 ounces free"sodium cyanide, 8.0 ounces copper cyanide, 10.0 ounces sodium hydroxide, .5 ounce zinc cyanide, 2.0 ounces Rochelle salts, .015 ounce arsenic (as metal), .15 ounce wetting agent, .25 ounce ethylenediaminetetra acetic tetrasodium salt and .0009 ounce of a metal (as metal) from the group consisting of selenium, bismuth, antimony and tellurium.
- a copper plating bath comprising the following in the following proportions per gallon: 4.8 ounces free sodium cyanide, 8.0 ounces sodium hydroxide, .015 ounce arsenic (as metal), .0034 ounce lead (as metal), .02 ounce tin (as metal), .5 ounce Wetting agent, .25 ounce ethylenediaminetetra acetic acid tetrasodium salt and .0009 ounce of a metal (as metal) from the group consisting of selenium, bismuth, antimony and tellurium.
- a copper-tin plating bath comprising the following in the following proportions per gallon: 1.8 ounces free sodium cyanide, 3.5 ounces NaSn0 3.0 ounces copper cyanide, 6.0 ounces Rochelle salts, 1.5 ounces sodium hydroxide, .005 ounce arsenic (as metal), .001 ounce lead (as metal), .006 ounce tin (as metal), .16 ounce Wetting agent, .08 ounce ethylencdiaminetetra acetic tetrasodium salt, and .0003 ounce of a metal (as metal) from the group consisting of selenium, bismuth, antimony and tellurium.
- a brightener for plating a metal selected from the group consisting of copper, copper-tin and brass comprising the following in the following proportions: .6 ounce lead subacetate, 6.0 ounces arsenic trioxide, 3.0 ounces sodium stannate, .2 ounce vanadium pentoxide, .25 ounce ethylenediaminetetra acetic acid tetrasodium salt, .5 ounce wetting agent, 16.0 ounces sodium hydroxide and water to make one gallon of brightener.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
United States Patent i 2,980,448 BRASS, COPPER-TIN, AND COPPER PLATING BATH BRIGHTENER Daniel R. France, 1650 W. 3rd St., Brooklyn 1, N.Y. No Drawing. Filed Apr. 8, 1959, Ser. No. 804,880 8 Claims. (Cl. 204-44) This invention relates to new and useful improvements in plating baths and plating bath brighteners for brass, copper-tin and copper plating.
An object of the invention is to provide a single basic brightener which will operate satisfactorily and with equal results in brass, copper-tin and copper plating baths.
Another object of the invention is to accomplish what has long been desired in the art of electroplatingto deposit copper, copper-tin.and brass in such a manner as to cause a smoothing out of the surface imperfections of the underlying metal plated and to maintain this surface over wide ranges in current densities and temperatures.
Still another object is to provide a brightener which will deposit copper, copper-tin or brass in a fully bright condition from the plating bath without agitation or periodic reverse of the bath.
Other objects, advantages and features of the invention will be apparent from the specification and appended claims.
The general composition of the brightener is the metals lead, arsenic, tin and vanadium and organic materials alkyl-aryl amine type wetting agent and ethylenediaminetetra acetic acid (Versene). However, either tellurium, selenium, antimony or bismuth in the same quantities as the vanadium in the examples hereinafter set forth can be used to replace the vanadium and good results still be obtained.
More specifically, the composition of the brightener is as follows:
Ounces Sodium hydroxide 16 Arsenic trioxide 6 Lead subacetate .6 Sodium stannate 3 Vanadium pentoxide .2 Ethylenediaminetetra acetic acid (Versene) 1.6 Wetting agent (alkyl-aryl amine type) 3.2
Water to make one gallon.
The plating bath formulas, the proportions in which they should be maintained and the amount of brightener needed to produce the best result is as follows:
Copper plating bath Ounces per gallon Free NaCN 4.8 CuCN 8.0 NaOH 8.0 Arsenic (as metal) .015 Lead (as metal) .0034 Vanadium (as metal) .0009 Tin (as metal) .02
Wetting agent Patented June 20, 1961 Ounces per gallon Tin (as metal) .006 Vanadium (as metal) .0003 Wetting agent i .16 Ethylenediaminetetra acetic acid (Versene) .08
Yellow brass bath Free NaCN 4.8 CuCN 8.0 NaOH 10.0
ZnCN g .5 KNaC H O 4H O 2.0 Arsenic (as metal) .015 Lead (as metal) .0034 Tin (as metal) L .02 Vanadium (as metal) .0009 Wetting agent .5 Versene .25
All three types of plating baths are worked at temperatures from 135 to 160 degrees Fahrenheit and all three produce bright plated deposits at from 3 to a.p.s.f. Agitation or periodic reverse is not required. The free NaCN is kept at the same ratio to copper cyanide in all three plating baths. (.6 ounce of free sodium cyanide for each one ounce of copper cyanide which is contained in the plating bath). This ratio is kept regardless of any other metal present in the bath such as ZnCN in the brass or NaSnO in the bronze.
The brightener provides bright deposits at the temperatures of the baths to degrees). High C/D can be employed without burningthe deposit. Excellent color control is provided overwide range in C/D. in the brass and bronze baths. There is 100% anode efliciency due to high tolerance to a high free NaCN content. A leveling of the basic metal occurs by the metal being deposited and the metal is deposited in a fully bright condition.
As above mentioned, the vanadium in the brightener can be replaced by tellurium, selenium, antimony or bismuth. Examples of plating baths showing such replacement are as follows:
Copper plating bath 7 Ounces per gallon Free NaCN 4.8 CuCN 8.0 NaOH 8.0 Arsenic (as metal) .015 Lead (as metal) .0034 Tellurium (as metal) .0009 Tin (as metal) .02 Wetting agent .5 Ethylenediaminetetra acetic acid .25
Copper-tin bath (bronze) Free NaCN V 1.8 NaSnO 3.5 CuCN 3.0 KNaC4H4O54H O 6 .0 NaOH 7 1.5 Arsenic (as metal) .005 Lead (as metal) .001 Tellurium (as metal) .003 Tin (as metal) .006 Wetting agent .16 Ethylenediaminetetra acetic acid 3 Yellow brass bath Ounces per gallon Free NaCN 4.8 CuCN 8.0
NaOH 10.0
ZnCN .5 KNaC H O 4H O 2.0 Arsenic (as metal) .015 Lead (as metal) .0034 Tin (as metal) .02 Tellurium (as metal) .0009 Wetting agent .5 Ethylenediaminetetra acetic acid .25
Copper plating bath Free NaCN 4.8
CuCN 80 NaOH 8.0 Arsenic (as metal) .015 Lead (as metal) .0034 Selenium (as metal) .0009 Tin (as metal) .02 Wetting agent .5 Ethylenediaminetetra acetic acid .25
Copper-tin bath (bronze) Free NaCN 1.8 NaSnO 3.5 CuCN 3.0 KNaC H O 4H O 6.0 NaOH 1.5 Arsenic (as metal) .005 Lead (as metal) .001 Selenium (as metal) .003 Tin (as metal) .006 Wetting agent .16 Ethylenediaminetetra acetic acid .08
Yellow brass bath Free NaCN 4.8 CuCN 8.0 NaOH 10.0 ZnCN .5 KNaC H O 4H O 2.0 Arsenic (as metal) .015 Lead (as metal) .0034 Tin (as metal) .02 Selenium (as metal) .0009 Wet-ting agent .5 Ethylenediaminetetra acetic acid .25
Copper plating bath Free NaCN 4.8 CuCN 8.0 NaOH 8.0 Arsenic (as metal) .015 Lead (as metal) .0034 .Antimony (as metal) .0009 Tin (as metal) .02 Wetting agent .5 Ethylenediaminetetra acetic acid .25
Copper-tin bath (bronze) Free NaCN 1.8 NaSnO 3.5 CuCN 3.0 KNaC I-I O 4H O 6.0 NaOH 1.5 Arsenic (as metal) .005 Lead (as metal) .001 Antimony (asmetal) .003 Tin (as metal) .006 Wetting agent .16 Ethylenediaminetetraacetic acid .08
4 Yellow brass both Ounces per gallon Free N aCN 4.8 CuCN 8.0 NaOH 10.0
ZnCN .5
KNaC H O 4H O Arsenic (as metal) .015 Lead (as metal) .0034 Tin (as metal) .02 Antimony (as metal) .009 Wetting agent .5 Ethylenediaminetetra acetic acid .25
Copper plating bath Free NaCN 4.8 CuCN 8.0 NaOH 8.0 Arsenic (as metal) .015 Lead (as metal) .0034 Bismuth (as metal) .0009 Tin (as metal) .02 Wetting agent .5 Ethylenediaminetetra acetic acid .25
Copper-tin bath (bronze) Free N aCN 1.8 NaSnO 3.5 CuCN 3.0 KNaC H O 4I-I O 6.0 NaOH 1.5 Arsenic (as metal) .005 Lead (as metal) .001 Bismuth (as metal) .0003 Wetting agent .16 Ethylenediaminetetra acetic acid .08
Yellow brass bath Free NaCN 4.8
CuCN 8.0
NaOH 10.0
ZnCN .5
KNaC H O 4H O 2. 0 Arsenic (as metal) .015 Lead (as metal) .0034 Tin (as metal) .02 Bismuth (as metal) .0009 Wetting agent .5 Ethylenediaminetetra acetic acid .25
Having described my invention, I claim: 1. A brightener for plating a metal selected from the group consisting of copper, copper-tin and brass comprising the following in the following proportions, sixteen ounces sodium hydroxide, six ounces arsenic trioxide, six tenths ounce lead subacetate, three ounces sodium stannate, two tenths ounce vanadium pentoxide, one and six tenths ounces ethylenediaminetetra acetic acid tetrasodium salt, three and two tenths ounce alkyl-aryl amine type wetting agent and water sufficient to make one gallon of brightener.
2. A copper plating bath comprising the following in the following proportions per gallon: 4.8 ounces free sodium cyanide, 8.0 ounces copper cyanide, 8.0 ounces sodium hydroxide, .015 ounce arsenic (as metal), .0034 ounce lead (as metal), .0009 ounce vanadium (as metal), .02 ounce tin (as metal), .5 ounce wetting agent and .25 ounce ethylenediaminetetra acetic acid tetrasodium salt.
3. A copper-tin plating bath comprising the following in the following proportions per gallon: 1.8 ounces free sodium cyanide, 3.5 ounces NaSnO 3.0 ounces copper cyanide, 6.0 ounces Rochelle salts, 1.5 ounces sodium hydroxide, .005 ounce arsenic (as metal), .001 ounce lead (as metal), .003 ounce vanadium (as metal), .006
5 ounce tin (as metal), .16 ounce wetting agent and .08
ounce ethylenediaminetetra acetic tetrasodium salt.
4. A yellow brass plating bath comprising the following in the following proportion per gallon: 4.8 ounces free sodium cyanide, 8.0 ounces copper cyanide, 10.0 ounces sodium hydroxide, .5 ounce zinc cyanide, 2.0 ounces Rochelle salts, .015 ounce arsenic (as metal), .0034 ounce lead (as metal), .02 ounce tin (as metal), .0009 ounce vanadium (as metal), .5 ounce wetting agent and .25 ounce ethylenediaminetetra acetic tetrasodium salt.
5. A yellow brass plating bath comprising the following in the following proportions per gallon: 4.8 ounces free"sodium cyanide, 8.0 ounces copper cyanide, 10.0 ounces sodium hydroxide, .5 ounce zinc cyanide, 2.0 ounces Rochelle salts, .015 ounce arsenic (as metal), .15 ounce wetting agent, .25 ounce ethylenediaminetetra acetic tetrasodium salt and .0009 ounce of a metal (as metal) from the group consisting of selenium, bismuth, antimony and tellurium.
6. A copper plating bath comprising the following in the following proportions per gallon: 4.8 ounces free sodium cyanide, 8.0 ounces sodium hydroxide, .015 ounce arsenic (as metal), .0034 ounce lead (as metal), .02 ounce tin (as metal), .5 ounce Wetting agent, .25 ounce ethylenediaminetetra acetic acid tetrasodium salt and .0009 ounce of a metal (as metal) from the group consisting of selenium, bismuth, antimony and tellurium.
7. A copper-tin plating bath comprising the following in the following proportions per gallon: 1.8 ounces free sodium cyanide, 3.5 ounces NaSn0 3.0 ounces copper cyanide, 6.0 ounces Rochelle salts, 1.5 ounces sodium hydroxide, .005 ounce arsenic (as metal), .001 ounce lead (as metal), .006 ounce tin (as metal), .16 ounce Wetting agent, .08 ounce ethylencdiaminetetra acetic tetrasodium salt, and .0003 ounce of a metal (as metal) from the group consisting of selenium, bismuth, antimony and tellurium.
8. A brightener for plating a metal selected from the group consisting of copper, copper-tin and brass comprising the following in the following proportions: .6 ounce lead subacetate, 6.0 ounces arsenic trioxide, 3.0 ounces sodium stannate, .2 ounce vanadium pentoxide, .25 ounce ethylenediaminetetra acetic acid tetrasodium salt, .5 ounce wetting agent, 16.0 ounces sodium hydroxide and water to make one gallon of brightener.
References Cited in the file of this patent UNITED STATES PATENTS 2,841,542 Manquen July 1, 1958 2,881,122 Foulke et a1 Apr. 7, 1959 FOREIGN PATENTS 2,778,788 France Ian. 22, 1957 2.838.448 France une 10, 58
Claims (1)
1. A BRIGHTENER FOR PLATING A METAL SELECTED FROM THE GROUP CONSISTING OF COPPER, COPPER-TIN AND BRASS COMPRISING THE FOLLOWING IN THE FOLLOWING PROPORTIONS, SIXTEEN OUNCES SODIUM HYDROXIDE, SIX OUNCES ARSENIC TRIOXIDE, SIX TENTHS OUNCE LEAD SUBACETATE, THREE OUNCES SODIUM STANNATE, TWO TENTHS OUNCE VANADIUM PENTOXIDE, ONE AND SIX TENTHS OUNCES ETHYLENEDIAMINETETRA ACETIC ACID TETRASODIUM SALT, THREE AND TWO TENTHS OUNCE ALKYL-ARYL AMINE TYPE WETTING AGENT AND WATER SUFFICIENT TO MAKE ONE GALLON OF BRIGHTENER.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US804880A US2989448A (en) | 1959-04-08 | 1959-04-08 | Brass, copper-tin, and copper plating bath brightener |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US804880A US2989448A (en) | 1959-04-08 | 1959-04-08 | Brass, copper-tin, and copper plating bath brightener |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2989448A true US2989448A (en) | 1961-06-20 |
Family
ID=25190097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US804880A Expired - Lifetime US2989448A (en) | 1959-04-08 | 1959-04-08 | Brass, copper-tin, and copper plating bath brightener |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2989448A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3440151A (en) * | 1965-06-02 | 1969-04-22 | Robert Duva | Electrodeposition of copper-tin alloys |
| US3440152A (en) * | 1966-03-21 | 1969-04-22 | Natural Products Co | Method and electrolyte for electroplating brass |
| US3775268A (en) * | 1971-12-30 | 1973-11-27 | Us Navy | Use of lead in a nonorganic-containing copper pyrophosphate bath |
| US3930965A (en) * | 1974-03-18 | 1976-01-06 | Mcgean Chemical Company, Inc. | Zinc-copper alloy electroplating baths |
| FR2478133A1 (en) * | 1980-03-17 | 1981-09-18 | Aliprandini P | BATH FOR THE GALVANOPLASTIC DEPOSITION OF A YELLOW-GOLD TINT METAL ALLOY |
| US4828615A (en) * | 1986-01-27 | 1989-05-09 | Chemfil Corporation | Process and composition for sealing a conversion coated surface with a solution containing vanadium |
| WO2004027120A1 (en) * | 2002-09-17 | 2004-04-01 | Omg Galvanotechnik Gmbh | Dark layers |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2841542A (en) * | 1955-12-19 | 1958-07-01 | Udylite Res Corp | Electrodeposition of copper |
| US2881122A (en) * | 1957-03-14 | 1959-04-07 | Hanson Van Winkle Munning Co | Electroplating |
| FR2778788A1 (en) * | 1998-05-12 | 1999-11-19 | Schneider Electric Ind Sa | CIRCUIT BREAKER OF WHICH AT LEAST ONE PHASE IS CONSISTING OF SEVERAL POLAR COMPARTMENTS CONNECTED IN PARALLEL |
| FR2838448A1 (en) * | 2002-04-12 | 2003-10-17 | Saint Gobain Abrasives Inc | Coated abrasive with outer layer, used to abrade or wear down article surface, consists of specific amount of inorganic, anti-loading agent chosen from metal silicates, silica, metal carbonates and metal sulfates |
-
1959
- 1959-04-08 US US804880A patent/US2989448A/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2841542A (en) * | 1955-12-19 | 1958-07-01 | Udylite Res Corp | Electrodeposition of copper |
| US2881122A (en) * | 1957-03-14 | 1959-04-07 | Hanson Van Winkle Munning Co | Electroplating |
| FR2778788A1 (en) * | 1998-05-12 | 1999-11-19 | Schneider Electric Ind Sa | CIRCUIT BREAKER OF WHICH AT LEAST ONE PHASE IS CONSISTING OF SEVERAL POLAR COMPARTMENTS CONNECTED IN PARALLEL |
| FR2838448A1 (en) * | 2002-04-12 | 2003-10-17 | Saint Gobain Abrasives Inc | Coated abrasive with outer layer, used to abrade or wear down article surface, consists of specific amount of inorganic, anti-loading agent chosen from metal silicates, silica, metal carbonates and metal sulfates |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3440151A (en) * | 1965-06-02 | 1969-04-22 | Robert Duva | Electrodeposition of copper-tin alloys |
| US3440152A (en) * | 1966-03-21 | 1969-04-22 | Natural Products Co | Method and electrolyte for electroplating brass |
| US3775268A (en) * | 1971-12-30 | 1973-11-27 | Us Navy | Use of lead in a nonorganic-containing copper pyrophosphate bath |
| US3930965A (en) * | 1974-03-18 | 1976-01-06 | Mcgean Chemical Company, Inc. | Zinc-copper alloy electroplating baths |
| FR2478133A1 (en) * | 1980-03-17 | 1981-09-18 | Aliprandini P | BATH FOR THE GALVANOPLASTIC DEPOSITION OF A YELLOW-GOLD TINT METAL ALLOY |
| US4364804A (en) * | 1980-03-17 | 1982-12-21 | Aliprandini P | Bath for the galvanoplastic deposition of a yellow-gold tinted metallic alloy |
| US4828615A (en) * | 1986-01-27 | 1989-05-09 | Chemfil Corporation | Process and composition for sealing a conversion coated surface with a solution containing vanadium |
| WO2004027120A1 (en) * | 2002-09-17 | 2004-04-01 | Omg Galvanotechnik Gmbh | Dark layers |
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