JPWO2023166552A1 - - Google Patents
Info
- Publication number
- JPWO2023166552A1 JPWO2023166552A1 JP2022541302A JP2022541302A JPWO2023166552A1 JP WO2023166552 A1 JPWO2023166552 A1 JP WO2023166552A1 JP 2022541302 A JP2022541302 A JP 2022541302A JP 2022541302 A JP2022541302 A JP 2022541302A JP WO2023166552 A1 JPWO2023166552 A1 JP WO2023166552A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/008580 WO2023166552A1 (ja) | 2022-03-01 | 2022-03-01 | スルホニオ基含有エーテル化合物を含むめっき液 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7162162B1 JP7162162B1 (ja) | 2022-10-27 |
| JPWO2023166552A1 true JPWO2023166552A1 (https=) | 2023-09-07 |
| JPWO2023166552A5 JPWO2023166552A5 (https=) | 2024-02-06 |
Family
ID=83804246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022541302A Active JP7162162B1 (ja) | 2022-03-01 | 2022-03-01 | スルホニオ基含有エーテル化合物を含むめっき液 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250179676A1 (https=) |
| EP (1) | EP4488421A4 (https=) |
| JP (1) | JP7162162B1 (https=) |
| KR (1) | KR20240155294A (https=) |
| CN (1) | CN118922586A (https=) |
| TW (1) | TWI835422B (https=) |
| WO (1) | WO2023166552A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119352117A (zh) * | 2024-12-23 | 2025-01-24 | 西安智同航空科技有限公司 | 一种航空紧固件表面镀银的方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3000799A (en) * | 1960-02-10 | 1961-09-19 | Harshaw Chem Corp | Nickel plating solutions |
| US4388450A (en) * | 1981-03-13 | 1983-06-14 | General Electric Company | Aromatic polyvinyl ethers and heat curable molding compositions obtained therefrom |
| JP2003105584A (ja) | 2001-07-26 | 2003-04-09 | Electroplating Eng Of Japan Co | 微細配線埋め込み用銅メッキ液及びそれを用いた銅メッキ方法 |
| US6676823B1 (en) * | 2002-03-18 | 2004-01-13 | Taskem, Inc. | High speed acid copper plating |
| US20050070701A1 (en) * | 2003-09-29 | 2005-03-31 | Hochstetler Spencer Erich | Detection of living cells in polymers or pigments |
| JP5227524B2 (ja) * | 2007-03-20 | 2013-07-03 | 関東電化工業株式会社 | Ｓ−ｎ結合を含むスルホニウムカチオンを有するイオン液体およびその製造方法 |
| US7887693B2 (en) * | 2007-06-22 | 2011-02-15 | Maria Nikolova | Acid copper electroplating bath composition |
| CN102906078B (zh) | 2010-04-30 | 2015-12-16 | 株式会社杰希优 | 新型化合物及其利用 |
| KR20140010398A (ko) * | 2011-02-23 | 2014-01-24 | 바스프 에스이 | 술포늄 술페이트, 그의 제조법 및 용도 |
| JP6607106B2 (ja) * | 2015-03-26 | 2019-11-20 | 三菱マテリアル株式会社 | スルホニウム塩を用いためっき液 |
-
2022
- 2022-03-01 EP EP22929700.7A patent/EP4488421A4/en active Pending
- 2022-03-01 JP JP2022541302A patent/JP7162162B1/ja active Active
- 2022-03-01 US US18/842,532 patent/US20250179676A1/en active Pending
- 2022-03-01 KR KR1020247031812A patent/KR20240155294A/ko active Pending
- 2022-03-01 CN CN202280092757.0A patent/CN118922586A/zh active Pending
- 2022-03-01 WO PCT/JP2022/008580 patent/WO2023166552A1/ja not_active Ceased
- 2022-11-24 TW TW111145030A patent/TWI835422B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI835422B (zh) | 2024-03-11 |
| EP4488421A1 (en) | 2025-01-08 |
| WO2023166552A1 (ja) | 2023-09-07 |
| CN118922586A (zh) | 2024-11-08 |
| JP7162162B1 (ja) | 2022-10-27 |
| EP4488421A4 (en) | 2026-02-25 |
| US20250179676A1 (en) | 2025-06-05 |
| TW202336287A (zh) | 2023-09-16 |
| KR20240155294A (ko) | 2024-10-28 |
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