JPWO2023166552A5 - - Google Patents
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- Publication number
- JPWO2023166552A5 JPWO2023166552A5 JP2022541302A JP2022541302A JPWO2023166552A5 JP WO2023166552 A5 JPWO2023166552 A5 JP WO2023166552A5 JP 2022541302 A JP2022541302 A JP 2022541302A JP 2022541302 A JP2022541302 A JP 2022541302A JP WO2023166552 A5 JPWO2023166552 A5 JP WO2023166552A5
- Authority
- JP
- Japan
- Prior art keywords
- ether compound
- group
- plating solution
- compound
- sulfonio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 sulfonio group Chemical group 0.000 claims 13
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 7
- 238000007747 plating Methods 0.000 claims 5
- 150000003839 salts Chemical class 0.000 claims 3
- 125000001931 aliphatic group Chemical group 0.000 claims 2
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims 2
- 125000001033 ether group Chemical group 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 150000002898 organic sulfur compounds Chemical class 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/008580 WO2023166552A1 (ja) | 2022-03-01 | 2022-03-01 | スルホニオ基含有エーテル化合物を含むめっき液 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7162162B1 JP7162162B1 (ja) | 2022-10-27 |
| JPWO2023166552A1 JPWO2023166552A1 (https=) | 2023-09-07 |
| JPWO2023166552A5 true JPWO2023166552A5 (https=) | 2024-02-06 |
Family
ID=83804246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022541302A Active JP7162162B1 (ja) | 2022-03-01 | 2022-03-01 | スルホニオ基含有エーテル化合物を含むめっき液 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250179676A1 (https=) |
| EP (1) | EP4488421A4 (https=) |
| JP (1) | JP7162162B1 (https=) |
| KR (1) | KR20240155294A (https=) |
| CN (1) | CN118922586A (https=) |
| TW (1) | TWI835422B (https=) |
| WO (1) | WO2023166552A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119352117A (zh) * | 2024-12-23 | 2025-01-24 | 西安智同航空科技有限公司 | 一种航空紧固件表面镀银的方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3000799A (en) * | 1960-02-10 | 1961-09-19 | Harshaw Chem Corp | Nickel plating solutions |
| US4388450A (en) * | 1981-03-13 | 1983-06-14 | General Electric Company | Aromatic polyvinyl ethers and heat curable molding compositions obtained therefrom |
| JP2003105584A (ja) | 2001-07-26 | 2003-04-09 | Electroplating Eng Of Japan Co | 微細配線埋め込み用銅メッキ液及びそれを用いた銅メッキ方法 |
| US6676823B1 (en) * | 2002-03-18 | 2004-01-13 | Taskem, Inc. | High speed acid copper plating |
| US20050070701A1 (en) * | 2003-09-29 | 2005-03-31 | Hochstetler Spencer Erich | Detection of living cells in polymers or pigments |
| JP5227524B2 (ja) * | 2007-03-20 | 2013-07-03 | 関東電化工業株式会社 | Ｓ−ｎ結合を含むスルホニウムカチオンを有するイオン液体およびその製造方法 |
| US7887693B2 (en) * | 2007-06-22 | 2011-02-15 | Maria Nikolova | Acid copper electroplating bath composition |
| CN102906078B (zh) | 2010-04-30 | 2015-12-16 | 株式会社杰希优 | 新型化合物及其利用 |
| KR20140010398A (ko) * | 2011-02-23 | 2014-01-24 | 바스프 에스이 | 술포늄 술페이트, 그의 제조법 및 용도 |
| JP6607106B2 (ja) * | 2015-03-26 | 2019-11-20 | 三菱マテリアル株式会社 | スルホニウム塩を用いためっき液 |
-
2022
- 2022-03-01 EP EP22929700.7A patent/EP4488421A4/en active Pending
- 2022-03-01 JP JP2022541302A patent/JP7162162B1/ja active Active
- 2022-03-01 US US18/842,532 patent/US20250179676A1/en active Pending
- 2022-03-01 KR KR1020247031812A patent/KR20240155294A/ko active Pending
- 2022-03-01 CN CN202280092757.0A patent/CN118922586A/zh active Pending
- 2022-03-01 WO PCT/JP2022/008580 patent/WO2023166552A1/ja not_active Ceased
- 2022-11-24 TW TW111145030A patent/TWI835422B/zh active
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