KR20240155294A - 설포니오기 함유 에테르 화합물을 포함하는 도금액 - Google Patents

설포니오기 함유 에테르 화합물을 포함하는 도금액 Download PDF

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Publication number
KR20240155294A
KR20240155294A KR1020247031812A KR20247031812A KR20240155294A KR 20240155294 A KR20240155294 A KR 20240155294A KR 1020247031812 A KR1020247031812 A KR 1020247031812A KR 20247031812 A KR20247031812 A KR 20247031812A KR 20240155294 A KR20240155294 A KR 20240155294A
Authority
KR
South Korea
Prior art keywords
group
plating solution
plating
ether compound
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247031812A
Other languages
English (en)
Korean (ko)
Inventor
가즈키 기시모토
쇼타 히구치
Original Assignee
가부시끼가이샤 제이씨유
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 제이씨유 filed Critical 가부시끼가이샤 제이씨유
Publication of KR20240155294A publication Critical patent/KR20240155294A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020247031812A 2022-03-01 2022-03-01 설포니오기 함유 에테르 화합물을 포함하는 도금액 Pending KR20240155294A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/008580 WO2023166552A1 (ja) 2022-03-01 2022-03-01 スルホニオ基含有エーテル化合物を含むめっき液

Publications (1)

Publication Number Publication Date
KR20240155294A true KR20240155294A (ko) 2024-10-28

Family

ID=83804246

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247031812A Pending KR20240155294A (ko) 2022-03-01 2022-03-01 설포니오기 함유 에테르 화합물을 포함하는 도금액

Country Status (7)

Country Link
US (1) US20250179676A1 (https=)
EP (1) EP4488421A4 (https=)
JP (1) JP7162162B1 (https=)
KR (1) KR20240155294A (https=)
CN (1) CN118922586A (https=)
TW (1) TWI835422B (https=)
WO (1) WO2023166552A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119352117A (zh) * 2024-12-23 2025-01-24 西安智同航空科技有限公司 一种航空紧固件表面镀银的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003105584A (ja) 2001-07-26 2003-04-09 Electroplating Eng Of Japan Co 微細配線埋め込み用銅メッキ液及びそれを用いた銅メッキ方法
WO2011135716A1 (ja) 2010-04-30 2011-11-03 荏原ユージライト株式会社 新規化合物およびその利用
JP2016183410A (ja) 2015-03-26 2016-10-20 三菱マテリアル株式会社 スルホニウム塩を用いためっき液

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3000799A (en) * 1960-02-10 1961-09-19 Harshaw Chem Corp Nickel plating solutions
US4388450A (en) * 1981-03-13 1983-06-14 General Electric Company Aromatic polyvinyl ethers and heat curable molding compositions obtained therefrom
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
US20050070701A1 (en) * 2003-09-29 2005-03-31 Hochstetler Spencer Erich Detection of living cells in polymers or pigments
JP5227524B2 (ja) * 2007-03-20 2013-07-03 関東電化工業株式会社 Ｓ−ｎ結合を含むスルホニウムカチオンを有するイオン液体およびその製造方法
US7887693B2 (en) * 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
KR20140010398A (ko) * 2011-02-23 2014-01-24 바스프 에스이 술포늄 술페이트, 그의 제조법 및 용도

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003105584A (ja) 2001-07-26 2003-04-09 Electroplating Eng Of Japan Co 微細配線埋め込み用銅メッキ液及びそれを用いた銅メッキ方法
WO2011135716A1 (ja) 2010-04-30 2011-11-03 荏原ユージライト株式会社 新規化合物およびその利用
JP2016183410A (ja) 2015-03-26 2016-10-20 三菱マテリアル株式会社 スルホニウム塩を用いためっき液

Also Published As

Publication number Publication date
TWI835422B (zh) 2024-03-11
EP4488421A1 (en) 2025-01-08
WO2023166552A1 (ja) 2023-09-07
CN118922586A (zh) 2024-11-08
JP7162162B1 (ja) 2022-10-27
EP4488421A4 (en) 2026-02-25
US20250179676A1 (en) 2025-06-05
JPWO2023166552A1 (https=) 2023-09-07
TW202336287A (zh) 2023-09-16

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