JP7154106B2 - 電子部品のピックアップ装置及び実装装置 - Google Patents

電子部品のピックアップ装置及び実装装置 Download PDF

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Publication number
JP7154106B2
JP7154106B2 JP2018203187A JP2018203187A JP7154106B2 JP 7154106 B2 JP7154106 B2 JP 7154106B2 JP 2018203187 A JP2018203187 A JP 2018203187A JP 2018203187 A JP2018203187 A JP 2018203187A JP 7154106 B2 JP7154106 B2 JP 7154106B2
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Japan
Prior art keywords
pressing
adhesive sheet
electronic component
cam
pressing body
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JP2018203187A
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English (en)
Japanese (ja)
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JP2020072125A5 (https=
JP2020072125A (ja
Inventor
宣明 小西
康一 志賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2018203187A priority Critical patent/JP7154106B2/ja
Priority to KR1020190134538A priority patent/KR102330577B1/ko
Priority to CN201911028600.8A priority patent/CN111106037B/zh
Priority to TW108138938A priority patent/TWI720667B/zh
Publication of JP2020072125A publication Critical patent/JP2020072125A/ja
Publication of JP2020072125A5 publication Critical patent/JP2020072125A5/ja
Application granted granted Critical
Publication of JP7154106B2 publication Critical patent/JP7154106B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2018203187A 2018-10-29 2018-10-29 電子部品のピックアップ装置及び実装装置 Active JP7154106B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018203187A JP7154106B2 (ja) 2018-10-29 2018-10-29 電子部品のピックアップ装置及び実装装置
KR1020190134538A KR102330577B1 (ko) 2018-10-29 2019-10-28 전자 부품의 픽업 장치 및 실장 장치
CN201911028600.8A CN111106037B (zh) 2018-10-29 2019-10-28 电子零件的拾取装置以及安装装置
TW108138938A TWI720667B (zh) 2018-10-29 2019-10-29 電子零件的拾取裝置以及安裝裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018203187A JP7154106B2 (ja) 2018-10-29 2018-10-29 電子部品のピックアップ装置及び実装装置

Publications (3)

Publication Number Publication Date
JP2020072125A JP2020072125A (ja) 2020-05-07
JP2020072125A5 JP2020072125A5 (https=) 2021-11-18
JP7154106B2 true JP7154106B2 (ja) 2022-10-17

Family

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Family Applications (1)

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JP2018203187A Active JP7154106B2 (ja) 2018-10-29 2018-10-29 電子部品のピックアップ装置及び実装装置

Country Status (4)

Country Link
JP (1) JP7154106B2 (https=)
KR (1) KR102330577B1 (https=)
CN (1) CN111106037B (https=)
TW (1) TWI720667B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI743870B (zh) * 2020-07-06 2021-10-21 友達光電股份有限公司 排片機構
KR102819884B1 (ko) * 2020-07-20 2025-06-12 한화세미텍 주식회사 다이 박리 장치 및 이를 이용한 다이 박리 방법
JP7607462B2 (ja) * 2021-01-26 2024-12-27 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
WO2022195697A1 (ja) * 2021-03-16 2022-09-22 株式会社新川 吸着装置、吸着ユニット、吸着方法、および、プログラム
JP7465859B2 (ja) * 2021-11-25 2024-04-11 キヤノントッキ株式会社 基板キャリア、基板剥離装置、成膜装置、及び基板剥離方法
CN116884908B (zh) * 2023-09-06 2023-11-10 深圳华太芯创有限公司 一种芯片加工用吸附转移机构及其使用方法
CN117810129A (zh) * 2023-12-29 2024-04-02 中科长光精拓智能装备(苏州)有限公司 一种芯片分离装置及芯片分离方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013171996A (ja) 2012-02-21 2013-09-02 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
JP2015179813A (ja) 2014-02-26 2015-10-08 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3117326B2 (ja) * 1993-05-28 2000-12-11 株式会社東芝 半導体チップ取出装置
JP2007220905A (ja) * 2006-02-16 2007-08-30 Shibuya Kogyo Co Ltd 板状物品のピックアップ装置
KR20070120319A (ko) * 2006-06-19 2007-12-24 삼성전자주식회사 한 쌍의 이젝터들을 구비하는 반도체 칩의 탈착 장치 및이를 이용한 반도체 칩의 탈착 방법
JP5054949B2 (ja) * 2006-09-06 2012-10-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4825637B2 (ja) * 2006-10-31 2011-11-30 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置
JP5075013B2 (ja) * 2008-05-27 2012-11-14 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP5227117B2 (ja) * 2008-08-29 2013-07-03 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及びピックアップ方法
JP2011082379A (ja) * 2009-10-08 2011-04-21 Hitachi High-Technologies Corp 本圧着装置及び本圧着方法
JP5123357B2 (ja) * 2010-06-17 2013-01-23 株式会社日立ハイテクインスツルメンツ ダイボンダ及びピックアップ装置
JP2013033850A (ja) * 2011-08-02 2013-02-14 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
JP5924446B1 (ja) * 2015-11-30 2016-05-25 富士ゼロックス株式会社 半導体製造装置および半導体片の製造方法
JP6637397B2 (ja) * 2016-09-12 2020-01-29 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013171996A (ja) 2012-02-21 2013-09-02 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
JP2015179813A (ja) 2014-02-26 2015-10-08 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法

Also Published As

Publication number Publication date
CN111106037A (zh) 2020-05-05
TWI720667B (zh) 2021-03-01
KR102330577B1 (ko) 2021-11-25
KR20200049625A (ko) 2020-05-08
JP2020072125A (ja) 2020-05-07
TW202017082A (zh) 2020-05-01
CN111106037B (zh) 2023-10-24

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