KR102330577B1 - 전자 부품의 픽업 장치 및 실장 장치 - Google Patents

전자 부품의 픽업 장치 및 실장 장치 Download PDF

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KR102330577B1
KR102330577B1 KR1020190134538A KR20190134538A KR102330577B1 KR 102330577 B1 KR102330577 B1 KR 102330577B1 KR 1020190134538 A KR1020190134538 A KR 1020190134538A KR 20190134538 A KR20190134538 A KR 20190134538A KR 102330577 B1 KR102330577 B1 KR 102330577B1
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South Korea
Prior art keywords
pressing
adhesive sheet
electronic component
pressing body
sensitive adhesive
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KR1020190134538A
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English (en)
Korean (ko)
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KR20200049625A (ko
Inventor
노부아키 고니시
고이치 시가
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
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Publication of KR20200049625A publication Critical patent/KR20200049625A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H01L21/67132—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H01L21/52—
    • H01L21/67144—
    • H01L21/67712—
    • H01L21/67721—
    • H01L21/6836—
    • H01L24/50—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020190134538A 2018-10-29 2019-10-28 전자 부품의 픽업 장치 및 실장 장치 Active KR102330577B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018203187A JP7154106B2 (ja) 2018-10-29 2018-10-29 電子部品のピックアップ装置及び実装装置
JPJP-P-2018-203187 2018-10-29

Publications (2)

Publication Number Publication Date
KR20200049625A KR20200049625A (ko) 2020-05-08
KR102330577B1 true KR102330577B1 (ko) 2021-11-25

Family

ID=70421023

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190134538A Active KR102330577B1 (ko) 2018-10-29 2019-10-28 전자 부품의 픽업 장치 및 실장 장치

Country Status (4)

Country Link
JP (1) JP7154106B2 (https=)
KR (1) KR102330577B1 (https=)
CN (1) CN111106037B (https=)
TW (1) TWI720667B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI743870B (zh) * 2020-07-06 2021-10-21 友達光電股份有限公司 排片機構
KR102819884B1 (ko) * 2020-07-20 2025-06-12 한화세미텍 주식회사 다이 박리 장치 및 이를 이용한 다이 박리 방법
JP7607462B2 (ja) * 2021-01-26 2024-12-27 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
WO2022195697A1 (ja) * 2021-03-16 2022-09-22 株式会社新川 吸着装置、吸着ユニット、吸着方法、および、プログラム
JP7465859B2 (ja) * 2021-11-25 2024-04-11 キヤノントッキ株式会社 基板キャリア、基板剥離装置、成膜装置、及び基板剥離方法
CN116884908B (zh) * 2023-09-06 2023-11-10 深圳华太芯创有限公司 一种芯片加工用吸附转移机构及其使用方法
CN117810129A (zh) * 2023-12-29 2024-04-02 中科长光精拓智能装备(苏州)有限公司 一种芯片分离装置及芯片分离方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009289785A (ja) 2008-05-27 2009-12-10 Renesas Technology Corp 半導体集積回路装置の製造方法
JP2010056466A (ja) * 2008-08-29 2010-03-11 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
JP2012004393A (ja) 2010-06-17 2012-01-05 Hitachi High-Tech Instruments Co Ltd ダイボンダ並びにピックアップ方法及びピックアップ装置
JP2013033850A (ja) 2011-08-02 2013-02-14 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3117326B2 (ja) * 1993-05-28 2000-12-11 株式会社東芝 半導体チップ取出装置
JP2007220905A (ja) * 2006-02-16 2007-08-30 Shibuya Kogyo Co Ltd 板状物品のピックアップ装置
KR20070120319A (ko) * 2006-06-19 2007-12-24 삼성전자주식회사 한 쌍의 이젝터들을 구비하는 반도체 칩의 탈착 장치 및이를 이용한 반도체 칩의 탈착 방법
JP5054949B2 (ja) * 2006-09-06 2012-10-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4825637B2 (ja) * 2006-10-31 2011-11-30 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置
JP2011082379A (ja) * 2009-10-08 2011-04-21 Hitachi High-Technologies Corp 本圧着装置及び本圧着方法
JP2013171996A (ja) 2012-02-21 2013-09-02 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
JP5717910B1 (ja) * 2014-02-26 2015-05-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
JP5924446B1 (ja) * 2015-11-30 2016-05-25 富士ゼロックス株式会社 半導体製造装置および半導体片の製造方法
JP6637397B2 (ja) * 2016-09-12 2020-01-29 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009289785A (ja) 2008-05-27 2009-12-10 Renesas Technology Corp 半導体集積回路装置の製造方法
JP2010056466A (ja) * 2008-08-29 2010-03-11 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
JP2012004393A (ja) 2010-06-17 2012-01-05 Hitachi High-Tech Instruments Co Ltd ダイボンダ並びにピックアップ方法及びピックアップ装置
JP2013033850A (ja) 2011-08-02 2013-02-14 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法

Also Published As

Publication number Publication date
CN111106037A (zh) 2020-05-05
JP7154106B2 (ja) 2022-10-17
TWI720667B (zh) 2021-03-01
KR20200049625A (ko) 2020-05-08
JP2020072125A (ja) 2020-05-07
TW202017082A (zh) 2020-05-01
CN111106037B (zh) 2023-10-24

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