JP7148610B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP7148610B2
JP7148610B2 JP2020531430A JP2020531430A JP7148610B2 JP 7148610 B2 JP7148610 B2 JP 7148610B2 JP 2020531430 A JP2020531430 A JP 2020531430A JP 2020531430 A JP2020531430 A JP 2020531430A JP 7148610 B2 JP7148610 B2 JP 7148610B2
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coil
segment
conductors
struts
shield member
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JP2020532087A (ja
JP2020532087A5 (enExample
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ジェームズ ロジャーズ
ジョン ポウローズ
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H01J37/32183—Matching circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32651—Shields, e.g. dark space shields, Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/026—Shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/026—Shields
    • H01J2237/0266—Shields electromagnetic

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Discharge Heating (AREA)
JP2020531430A 2017-10-09 2018-07-10 基板処理装置 Active JP7148610B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022150932A JP7431296B2 (ja) 2017-10-09 2022-09-22 誘導結合プラズマソースの改善

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/727,998 US11521828B2 (en) 2017-10-09 2017-10-09 Inductively coupled plasma source
US15/727,998 2017-10-09
PCT/US2018/041499 WO2019074563A1 (en) 2017-10-09 2018-07-10 IMPROVEMENTS IN INDUCTIVE COUPLING PLASMA SOURCE

Related Child Applications (1)

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JP2022150932A Division JP7431296B2 (ja) 2017-10-09 2022-09-22 誘導結合プラズマソースの改善

Publications (3)

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JP2020532087A JP2020532087A (ja) 2020-11-05
JP2020532087A5 JP2020532087A5 (enExample) 2020-12-17
JP7148610B2 true JP7148610B2 (ja) 2022-10-05

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JP2022150932A Active JP7431296B2 (ja) 2017-10-09 2022-09-22 誘導結合プラズマソースの改善

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US (2) US11521828B2 (enExample)
JP (2) JP7148610B2 (enExample)
KR (2) KR102371471B1 (enExample)
CN (2) CN111095475B (enExample)
TW (2) TWI805611B (enExample)
WO (1) WO2019074563A1 (enExample)

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US11521828B2 (en) 2017-10-09 2022-12-06 Applied Materials, Inc. Inductively coupled plasma source
WO2020131608A1 (en) * 2018-12-18 2020-06-25 Mattson Technology, Inc. Carbon containing hardmask removal process using sulfur containing process gas
JP6976279B2 (ja) * 2019-03-25 2021-12-08 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法及びプログラム
US12374530B2 (en) * 2019-08-28 2025-07-29 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing apparatus for generating plasma
JP2021103641A (ja) * 2019-12-25 2021-07-15 東京エレクトロン株式会社 プラズマ発生源の検査方法及び負荷
US12159770B2 (en) * 2020-12-28 2024-12-03 Beijing E-town Semiconductor Technology Co., Ltd. Cooled shield for ICP source
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CN115295389B (zh) * 2022-08-23 2025-07-15 盛吉盛半导体科技(北京)有限公司 电感耦合等离子体装置及半导体薄膜设备
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CN118969592B (zh) * 2024-09-18 2025-09-23 海创智能装备(烟台)有限公司 一种晶圆等离子表面活性化设备及活性化方法

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Publication number Publication date
JP7431296B2 (ja) 2024-02-14
CN116053108B (zh) 2025-09-12
CN116053108A (zh) 2023-05-02
US20230052071A1 (en) 2023-02-16
CN111095475A (zh) 2020-05-01
JP2020532087A (ja) 2020-11-05
JP2022180536A (ja) 2022-12-06
WO2019074563A1 (en) 2019-04-18
US11521828B2 (en) 2022-12-06
TW202341232A (zh) 2023-10-16
KR20220031766A (ko) 2022-03-11
KR102398974B1 (ko) 2022-05-16
TW201933419A (zh) 2019-08-16
KR102371471B1 (ko) 2022-03-04
KR20200026321A (ko) 2020-03-10
CN111095475B (zh) 2023-03-28
TWI805611B (zh) 2023-06-21
TWI880219B (zh) 2025-04-11
US20190108974A1 (en) 2019-04-11
US12217938B2 (en) 2025-02-04

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