JP7142227B2 - 角度調節を有する交換可能レーザ共振器 - Google Patents

角度調節を有する交換可能レーザ共振器 Download PDF

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Publication number
JP7142227B2
JP7142227B2 JP2020565288A JP2020565288A JP7142227B2 JP 7142227 B2 JP7142227 B2 JP 7142227B2 JP 2020565288 A JP2020565288 A JP 2020565288A JP 2020565288 A JP2020565288 A JP 2020565288A JP 7142227 B2 JP7142227 B2 JP 7142227B2
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oscillator
output coupler
output
laser
refractive optics
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Japanese (ja)
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JP2021525003A (ja
JP2021525003A5 (https=
JPWO2019224601A5 (https=
Inventor
ブライアン・ロックマン
マシュー・ソーター
ビエン・チャン
ワン－ロン・ジョウ
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/0014—Monitoring arrangements not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/08—Construction or shape of optical resonators or components thereof
    • H01S3/086—One or more reflectors having variable properties or positions for initial adjustment of the resonator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/14—External cavity lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4062—Edge-emitting structures with an external cavity or using internal filters, e.g. Talbot filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/14—External cavity lasers
    • H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
    • H01S5/143—Littman-Metcalf configuration, e.g. laser - grating - mirror
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4068—Edge-emitting structures with lateral coupling by axially offset or by merging waveguides, e.g. Y-couplers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Lasers (AREA)
JP2020565288A 2018-05-24 2019-05-24 角度調節を有する交換可能レーザ共振器 Active JP7142227B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862676041P 2018-05-24 2018-05-24
US62/676,041 2018-05-24
PCT/IB2019/000650 WO2019224601A2 (en) 2018-05-24 2019-05-24 Exchangeable laser resonator modules with angular adjustment

Publications (4)

Publication Number Publication Date
JP2021525003A JP2021525003A (ja) 2021-09-16
JP2021525003A5 JP2021525003A5 (https=) 2022-03-24
JPWO2019224601A5 JPWO2019224601A5 (https=) 2022-03-24
JP7142227B2 true JP7142227B2 (ja) 2022-09-27

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US (2) US11121526B2 (https=)
JP (1) JP7142227B2 (https=)
CN (1) CN112204830A (https=)
DE (1) DE112019002638T5 (https=)
WO (1) WO2019224601A2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10910786B2 (en) 2018-07-23 2021-02-02 University Of Maryland, College Park Laser cavity optical alignment
US11152756B2 (en) * 2018-07-23 2021-10-19 University Of Maryland, College Park Laser cavity repetition rate tuning and high-bandwidth stabilization
GB2579801B (en) 2018-12-13 2021-04-14 Exalos Ag Superluminescent diode module
US11095084B1 (en) * 2019-02-07 2021-08-17 Panasonic Intellectual Property Management Co., Ltd. Laser system with isolated optical cavity
DE102019125103A1 (de) * 2019-09-18 2021-03-18 Bystronic Laser Ag Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks, Verfahren zur Laserbearbeitung eines Werkstücks
US12405483B2 (en) * 2022-02-04 2025-09-02 IonQ, Inc. Piezo-based beam stabilization for cryogenic environments

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060171428A1 (en) 2005-02-03 2006-08-03 Pd-Ld, Inc. High-power, phased-locked, laser arrays
WO2016060103A1 (ja) 2014-10-15 2016-04-21 株式会社アマダホールディングス 半導体レーザ発振器

Family Cites Families (147)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3358243A (en) * 1963-03-25 1967-12-12 Sperry Rand Corp Laser having interferometer controlled oscillatory modes
US3478608A (en) * 1966-06-23 1969-11-18 Electro Optics Associates Aligning and mounting mechanism device
US3718868A (en) * 1970-07-20 1973-02-27 Univ Case Western Reserve I{11 {11 {11 {11 INVERTED LAMB DIP STABILIZED He-Ne LASER
US4283116A (en) * 1977-04-22 1981-08-11 Jersey Nuclear-Avco Isotopes, Inc. Beam combiner
EP0063309B1 (en) * 1981-04-09 1985-11-27 Fujitsu Limited Laser apparatus
US4462103A (en) * 1982-03-23 1984-07-24 The United States Of America As Represented By The Secretary Of The Air Force Tunable CW semiconductor platelet laser
US4461006A (en) * 1982-03-23 1984-07-17 The United States Of America As Represented By The Secretary Of The Air Force Synchronously pumped mode-locked semiconductor platelet laser
DE3444823C2 (de) * 1984-12-08 1986-10-02 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Lösbare Verbindung zwischen einer Lichtleitfaser und einem Lasergerät
US4664487A (en) * 1985-09-30 1987-05-12 Rockwell International Corporation Laser mirror positioning apparatus
US4672626A (en) * 1986-01-09 1987-06-09 Amada Engineering Service Co., Inc. Laser oscillator mirror adjustment apparatus
US4922501A (en) * 1987-09-30 1990-05-01 Spectra Physics, Inc. Mirror translation apparatus for altering focal point position in a laser
US4955028A (en) * 1988-03-25 1990-09-04 At&T Bell Laboratories Wavelength tunable composite cavity laser
US4942583A (en) * 1988-06-17 1990-07-17 Hewlett-Packard Company Misalignment-tolerant, grating-tuned external-cavity laser
US4919532A (en) * 1988-08-15 1990-04-24 Mocker Hans W High accuracy semiconductor laser doppler velocimeter
US5172390A (en) * 1989-04-20 1992-12-15 Massachusetts Institute Of Technology Pre-aligned diode laser for external cavity operation
US5594543A (en) * 1990-01-16 1997-01-14 Hughes Danbury Optical Systems, Inc. Laser diode radar with extended range
JPH03241883A (ja) * 1990-02-20 1991-10-29 Seiko Epson Corp 波長可変半導体レーザー装置
US5111476A (en) * 1991-02-21 1992-05-05 Applied Laser Systems Method and apparatus for aligning a laser diode, and laser diode system produced thereby
US5197076A (en) * 1991-11-15 1993-03-23 Davis James G Temperature stabilizable laser apparatus
US5216729A (en) * 1991-11-18 1993-06-01 Harmonic Lightwaves, Inc. Active alignment system for laser to fiber coupling
US5291571A (en) * 1992-03-19 1994-03-01 Fujitsu Limited Duplicated light source module
US5383199A (en) * 1992-07-02 1995-01-17 Advanced Interventional Systems, Inc. Apparatus and method for optically controlling the output energy of a pulsed laser source
US5434874A (en) * 1993-10-08 1995-07-18 Hewlett-Packard Company Method and apparatus for optimizing output characteristics of a tunable external cavity laser
US5610930A (en) * 1995-03-02 1997-03-11 Hughes Aircraft Company Voltage adding diode laser array
US5663980A (en) * 1995-05-22 1997-09-02 Adachi; Yoshi Semiconductor laser device having changeable wavelength, polarization mode, and beam shape image
JPH09293917A (ja) * 1996-04-26 1997-11-11 Mitsui Petrochem Ind Ltd 半導体レーザ励起固体レーザ装置
JPH10153726A (ja) * 1996-11-25 1998-06-09 Kawasaki Heavy Ind Ltd 光学素子姿勢調整装置
DE19815620B4 (de) * 1997-04-07 2012-12-06 Ricoh Co., Ltd. Lichtquellenvorrichtung
JPH11251661A (ja) * 1998-03-04 1999-09-17 Nikon Corp レーザ光源および露光装置
JPH11220193A (ja) * 1998-02-02 1999-08-10 Nidek Co Ltd レーザ装置
US6198580B1 (en) * 1998-08-17 2001-03-06 Newport Corporation Gimballed optical mount
US6108355A (en) * 1998-10-16 2000-08-22 New Focus, Inc. Continuously-tunable external cavity laser
JP2003502849A (ja) * 1999-06-11 2003-01-21 コプフ、ダニエル 高パワーおよび高利得飽和ダイオードポンピングレーザ手段およびダイオードアレイポンピングデバイス
GB2364167B (en) * 2000-06-28 2002-08-14 Univ St Andrews Laser system
US6754243B2 (en) * 2000-08-09 2004-06-22 Jds Uniphase Corporation Tunable distributed feedback laser
US6556599B1 (en) * 2000-10-17 2003-04-29 Bookham Technology Plc External cavity laser using angle-tuned filter and method of making same
US6912052B2 (en) * 2000-11-17 2005-06-28 Cymer, Inc. Gas discharge MOPA laser spectral analysis module
US6717965B2 (en) * 2001-07-06 2004-04-06 Intel Corporation Graded thin film wedge interference filter and method of use for laser tuning
US6901088B2 (en) * 2001-07-06 2005-05-31 Intel Corporation External cavity laser apparatus with orthogonal tuning of laser wavelength and cavity optical pathlength
US6876679B1 (en) * 2001-08-20 2005-04-05 Dennis Bowler Systems and methods of operating an incoherently beam combined laser
JP2003094716A (ja) * 2001-09-20 2003-04-03 Dainippon Screen Mfg Co Ltd 画像記録装置および光源ユニット
US6507593B1 (en) * 2001-09-24 2003-01-14 Coherent, Inc. Step-tunable external-cavity surface-emitting semiconductor laser
US7230959B2 (en) * 2002-02-22 2007-06-12 Intel Corporation Tunable laser with magnetically coupled filter
JP4083464B2 (ja) * 2002-05-02 2008-04-30 富士通株式会社 波長可変光源装置およびそれを用いた光増幅器
AUPS266302A0 (en) * 2002-05-30 2002-06-20 Clvr Pty Ltd Solid state uv laser
US6967976B2 (en) * 2002-08-29 2005-11-22 Picarro, Inc. Laser with reflective etalon tuning element
ITTO20020845A1 (it) * 2002-09-27 2004-03-28 Bright Solutions Soluzioni Laser Innovative Srl Metodo per la selezione della polarizzazione del fascio laser oscillante all'interno di una cavita' laser
JP2004128087A (ja) * 2002-09-30 2004-04-22 Nidek Co Ltd レーザ装置
US7177340B2 (en) * 2002-11-05 2007-02-13 Jds Uniphase Corporation Extended cavity laser device with bulk transmission grating
US20040202223A1 (en) * 2003-04-08 2004-10-14 Eric Crosson External cavity laser having improved single mode operation
US6940879B2 (en) * 2002-12-06 2005-09-06 New Focus, Inc. External cavity laser with dispersion compensation for mode-hop-free tuning
US7499207B2 (en) * 2003-04-10 2009-03-03 Hitachi Via Mechanics, Ltd. Beam shaping prior to harmonic generation for increased stability of laser beam shaping post harmonic generation with integrated automatic displacement and thermal beam drift compensation
JP4037815B2 (ja) * 2003-09-29 2008-01-23 オムロンレーザーフロント株式会社 レーザダイオードモジュール、レーザ装置、及びレーザ加工装置
WO2005031929A1 (en) * 2003-09-29 2005-04-07 Agilent Technologies, Inc. Angular laser control
JP2005161361A (ja) * 2003-12-02 2005-06-23 Fujitsu Ltd レーザ加工機の管理方法及びレーザ加工機
US20050168826A1 (en) * 2004-02-02 2005-08-04 Serguei Koulikov Method and apparatus for adjusting the path of an optical beam
US7885311B2 (en) * 2007-03-27 2011-02-08 Imra America, Inc. Beam stabilized fiber laser
US7565084B1 (en) * 2004-09-15 2009-07-21 Wach Michael L Robustly stabilizing laser systems
US7296359B2 (en) * 2004-10-27 2007-11-20 Videojet Technologies Laser alignment system and method
US20060092993A1 (en) * 2004-11-01 2006-05-04 Chromaplex, Inc. High-power mode-locked laser device
US7728964B2 (en) * 2004-12-23 2010-06-01 Matthew Feinsod Motion compensated light-emitting apparatus
JP2006196638A (ja) * 2005-01-13 2006-07-27 Institute Of Physical & Chemical Research パルスレーザーのレーザー発振制御方法およびパルスレーザーシステム
US7817704B2 (en) * 2005-03-17 2010-10-19 Scientific Materials Corporation Monoblock laser with improved alignment features
US7336691B2 (en) * 2005-03-24 2008-02-26 Coherent, Inc. Apparatus for combining beams from repetitively pulsed lasers along a common path
GB0514493D0 (en) * 2005-07-14 2005-08-17 Point Source Ltd Optical assembly
JP2007029627A (ja) * 2005-07-29 2007-02-08 Nidek Co Ltd 医療用レーザ装置
US7733924B2 (en) * 2005-08-15 2010-06-08 William Marsh Rice University Piezo activated mode tracking system for widely tunable mode-hop-free external cavity mid-IR semiconductor lasers
GB0519761D0 (en) * 2005-09-28 2005-11-09 Point Source Ltd Laser systems
US7511880B2 (en) * 2005-10-14 2009-03-31 Konica Minolta Opto, Inc. Semiconductor light source module
US20070115617A1 (en) * 2005-11-22 2007-05-24 Nlight Photonics Corporation Modular assembly utilizing laser diode subassemblies with winged mounting blocks
US7839904B1 (en) * 2006-01-26 2010-11-23 Scientific Materials Corporation Monoblock laser systems and methods
US7495838B2 (en) * 2006-07-19 2009-02-24 Inphase Technologies, Inc. Collimation lens group adjustment for laser system
WO2008050685A1 (en) * 2006-10-24 2008-05-02 Panasonic Corporation Internal resonator type shg light source
US7547867B2 (en) * 2007-03-01 2009-06-16 Konica Minolta Opto, Inc. Positioning device and positiioning method
JP2008250731A (ja) * 2007-03-30 2008-10-16 Konica Minolta Opto Inc 位置決め装置
US7756170B2 (en) * 2007-07-20 2010-07-13 Corning Incorporated Frequency modulation in the optical alignment of wavelength-converted laser sources
US8102514B2 (en) * 2007-09-14 2012-01-24 Sanyo Electric Co., Ltd. Beam irradiation apparatus
US7643528B2 (en) * 2007-09-20 2010-01-05 Cymer, Inc. Immersion lithography laser light source with pulse stretcher
US7760776B2 (en) * 2007-11-02 2010-07-20 Glen Ivan Redford Scalable, reconfigurable, laser combiner
GB0724874D0 (en) * 2007-12-20 2008-01-30 Uws Ventures Ltd Turntable laser
JP2009158683A (ja) * 2007-12-26 2009-07-16 Mitsubishi Electric Corp レーザ装置
US20090213350A1 (en) * 2008-02-22 2009-08-27 Nikon Corporation Coherence-reduction devices and methods for pulsed lasers
US9086375B2 (en) * 2008-04-29 2015-07-21 Daylight Solutions, Inc. Laser source with a large spectral range
WO2009133546A1 (en) * 2008-04-29 2009-11-05 Raicol Crystals Ltd. Method and system for fine adjustment of optical elements position
US8564783B2 (en) * 2008-05-15 2013-10-22 Axsun Technologies, Inc. Optical coherence tomography laser with integrated clock
GB0823084D0 (en) * 2008-12-18 2009-01-28 Renishaw Plc Laser Apparatus
WO2010100898A1 (ja) * 2009-03-04 2010-09-10 三菱電機株式会社 レーザ光源装置及び画像表示装置
US8774244B2 (en) * 2009-04-21 2014-07-08 Daylight Solutions, Inc. Thermal pointer
US8066389B2 (en) * 2009-04-30 2011-11-29 Eastman Kodak Company Beam alignment chamber providing divergence correction
US8033666B2 (en) * 2009-05-28 2011-10-11 Eastman Kodak Company Beam alignment system using arrayed light sources
TWI426209B (zh) * 2009-09-15 2014-02-11 Alps Electric Co Ltd Light emitting device
JP5473535B2 (ja) * 2009-10-28 2014-04-16 三菱電機株式会社 光源装置
WO2012058683A2 (en) * 2010-10-31 2012-05-03 Bien Chann Compact interdependent optical element wavelength beam combining laser system and method
US8724222B2 (en) * 2010-10-31 2014-05-13 TeraDiode, Inc. Compact interdependent optical element wavelength beam combining laser system and method
JP5740190B2 (ja) * 2011-03-28 2015-06-24 ギガフォトン株式会社 レーザシステムおよびレーザ生成方法
CN102324699A (zh) * 2011-09-22 2012-01-18 西安炬光科技有限公司 一种用于激光加工的高功率半导体激光光源系统
JP2013089680A (ja) * 2011-10-14 2013-05-13 Canon Inc レーザー装置およびその制御方法
US9212990B1 (en) * 2011-12-06 2015-12-15 Zybertec Llc System and methods for molecular detection using intracavity laser absorption spectroscopy
KR20130093704A (ko) * 2011-12-23 2013-08-23 한국전자통신연구원 사용자 선택형 레이저 및 이를 포함하는 광 송신기
DE102012000038A1 (de) * 2012-01-03 2013-07-04 Humboldt-Universität Zu Berlin Lasereinrichtung
DE102012002470A1 (de) * 2012-02-03 2013-08-08 Iai Industrial Systems B.V. CO2-Laser mit schneller Leistungssteuerung
US9746679B2 (en) * 2012-02-22 2017-08-29 TeraDiode, Inc. Wavelength beam combining laser systems utilizing lens roll for chief ray focusing
JP2013207276A (ja) * 2012-03-29 2013-10-07 Mitsubishi Electric Corp レーザモジュール
US8537865B1 (en) * 2012-07-26 2013-09-17 Coherent, Inc. Fiber-laser pumped by stabilized diode-laser bar stack
CN103197431B (zh) * 2013-03-29 2015-04-08 光库通讯(珠海)有限公司 光纤耦合器
WO2014208111A1 (ja) * 2013-06-27 2014-12-31 ギガフォトン株式会社 光ビーム計測装置、レーザ装置及び光ビーム分離装置
JP2015056469A (ja) * 2013-09-11 2015-03-23 昭和オプトロニクス株式会社 外部共振器により波長制御されたダイオードレーザモジュール
WO2015115301A1 (ja) * 2014-01-30 2015-08-06 三菱電機株式会社 ビーム結合装置およびビーム結合装置の出力回復方法
DE102014201701B4 (de) * 2014-01-30 2018-04-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikroelektromechanisches System zum Durchstimmen von Lasern
US9310560B2 (en) * 2014-02-26 2016-04-12 TeraDiode, Inc. Systems and methods for multiple-beam laser arrangements with variable beam parameter product
US9435964B2 (en) * 2014-02-26 2016-09-06 TeraDiode, Inc. Systems and methods for laser systems with variable beam parameter product
US9380691B2 (en) * 2014-02-28 2016-06-28 Asml Netherlands B.V. Adaptive laser system for an extreme ultraviolet light source
US9889524B2 (en) 2014-03-05 2018-02-13 TeraDiode, Inc. Polarization-adjusted beam operation for materials processing
US11204506B2 (en) * 2014-03-05 2021-12-21 TeraDiode, Inc. Polarization-adjusted and shape-adjusted beam operation for materials processing
US11780029B2 (en) 2014-03-05 2023-10-10 Panasonic Connect North America, division of Panasonic Corporation of North America Material processing utilizing a laser having a variable beam shape
US9972963B2 (en) * 2014-04-01 2018-05-15 The United States Of America, As Represented By The Secretary Of The Army Process using a single circular wedge prism for fine alignment of a laser cavity with a single-axis scanning element as the optical Q-switch
US9160136B1 (en) * 2014-05-30 2015-10-13 Lee Laser, Inc. External diffusion amplifier
CN107078466B (zh) * 2014-12-10 2020-01-14 特拉迪欧德公司 用于波长光束组合激光系统的光学交叉耦合抑制系统
JP6655287B2 (ja) * 2014-12-25 2020-02-26 古河電気工業株式会社 光学ユニット、光学ユニットの固定構造および半導体レーザモジュール
CN107112716A (zh) * 2015-02-06 2017-08-29 株式会社岛津制作所 激光装置
JP2016157863A (ja) * 2015-02-25 2016-09-01 株式会社ミツトヨ レーザ光源装置およびその調整方法
DE102015103127A1 (de) * 2015-03-04 2016-09-08 Trumpf Laser- Und Systemtechnik Gmbh Bestrahlungssystem für eine Vorrichtung zur generativen Fertigung
JP2016181643A (ja) * 2015-03-25 2016-10-13 株式会社アマダホールディングス 半導体レーザ発振器
US9651426B2 (en) * 2015-06-30 2017-05-16 Agilent Technologies, Inc. Light source with controllable linear polarization
JPWO2017022142A1 (ja) * 2015-08-04 2017-11-30 三菱電機株式会社 半導体レーザ装置
KR20170079355A (ko) * 2015-12-30 2017-07-10 엘지이노텍 주식회사 발광 장치, 이 장치를 포함하는 광학 모듈, 및 이 모듈을 포함하는 차량
CN108604775B (zh) * 2016-02-03 2020-10-30 古河电气工业株式会社 激光装置
CN108780189B (zh) 2016-04-06 2021-11-19 特拉迪欧德公司 用于改变激光束轮廓的光纤结构和方法
CN109313383A (zh) * 2016-04-13 2019-02-05 赛尔米克实验室公司 用于聚焦激光投射器的系统、设备和方法
CN105762636B (zh) * 2016-04-21 2019-01-22 上海交通大学 一种产生高空间强度对比度的飞秒涡旋光束的方法
US10606052B2 (en) * 2016-06-10 2020-03-31 General Electric Company Vehicle navigational system
JP6836848B2 (ja) * 2016-06-22 2021-03-03 株式会社ミツトヨ レーザ光調整方法、及びレーザ光源装置
JP6964654B2 (ja) 2016-08-05 2021-11-10 テラダイオード， インコーポレーテッド モジュール式ダイオード源を有する高出力レーザシステム
US10305247B2 (en) * 2016-08-30 2019-05-28 Apple Inc. Radiation source with a small-angle scanning array
CN113422280B (zh) * 2016-09-12 2023-03-31 广埸(厦门)科技有限公司 具有激光阵列照明的系统和装置
WO2018067837A1 (en) * 2016-10-06 2018-04-12 The Regents Of The University Of California Inhomogeneous focusing and broadband metasurface quantum-cascade lasers
CN106711765B (zh) * 2017-02-13 2019-02-01 江苏华博数控设备有限公司 一种具有三光斑照射一次成型功能的半导体激光熔覆光源结构
WO2018176274A1 (en) * 2017-03-29 2018-10-04 SZ DJI Technology Co., Ltd. A lidar sensor system with small form factor
CN106950707A (zh) 2017-05-25 2017-07-14 力合科技（湖南）股份有限公司 一种光束耦合装置
US10589377B2 (en) * 2017-07-06 2020-03-17 Ii-Vi Delaware Inc. Additive manufacturing in metals with a fiber array laser source and adaptive multi-beam shaping
US10673203B2 (en) * 2018-03-09 2020-06-02 North Inc. Alignment methods for laser diodes
JP7053993B2 (ja) * 2018-03-28 2022-04-13 日亜化学工業株式会社 光源装置
CN108321677A (zh) * 2018-04-28 2018-07-24 上海高意激光技术有限公司 一种半导体激光器合束装置
JP7060799B2 (ja) * 2018-05-31 2022-04-27 日亜化学工業株式会社 光源装置
US11515681B2 (en) * 2018-07-12 2022-11-29 Electronics And Telecommunications Research Institute Laser module and laser system including the same
US11152756B2 (en) * 2018-07-23 2021-10-19 University Of Maryland, College Park Laser cavity repetition rate tuning and high-bandwidth stabilization
WO2020183729A1 (ja) * 2019-03-14 2020-09-17 三菱電機株式会社 レーザ装置およびレーザ加工機

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060171428A1 (en) 2005-02-03 2006-08-03 Pd-Ld, Inc. High-power, phased-locked, laser arrays
WO2016060103A1 (ja) 2014-10-15 2016-04-21 株式会社アマダホールディングス 半導体レーザ発振器

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