JP7138261B1 - 半導体パッケージ、及び駆動装置 - Google Patents

半導体パッケージ、及び駆動装置 Download PDF

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Publication number
JP7138261B1
JP7138261B1 JP2022106345A JP2022106345A JP7138261B1 JP 7138261 B1 JP7138261 B1 JP 7138261B1 JP 2022106345 A JP2022106345 A JP 2022106345A JP 2022106345 A JP2022106345 A JP 2022106345A JP 7138261 B1 JP7138261 B1 JP 7138261B1
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hall element
semiconductor package
plan
view
external terminal
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Japanese (ja)
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JP2024005900A (ja
Inventor
啓太 岡田
亮太 坂元
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Asahi Kasei Microdevices Corp
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Asahi Kasei EMD Corp
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Priority to JP2022106345A priority Critical patent/JP7138261B1/ja
Priority to JP2022140946A priority patent/JP7763154B2/ja
Application granted granted Critical
Publication of JP7138261B1 publication Critical patent/JP7138261B1/ja
Priority to KR1020230019313A priority patent/KR102677824B1/ko
Priority to US18/295,269 priority patent/US12543510B2/en
Priority to CN202511760989.0A priority patent/CN121531930A/zh
Priority to CN202310378736.1A priority patent/CN117337128A/zh
Publication of JP2024005900A publication Critical patent/JP2024005900A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45—Differential amplifiers
    • H03F3/45071—Differential amplifiers with semiconductor devices only
    • H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
    • H03F3/45475—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using IC blocks as the active amplifying circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N52/00—Hall-effect devices
    • H10N52/101—Semiconductor Hall-effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N52/00—Hall-effect devices
    • H10N52/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N59/00—Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/261—Functions other than electrical connecting
    • H10W72/267—Multiple bump connectors having different functions

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Hall/Mr Elements (AREA)
  • Measuring Magnetic Variables (AREA)
  • Adjustment Of Camera Lenses (AREA)
JP2022106345A 2022-06-30 2022-06-30 半導体パッケージ、及び駆動装置 Active JP7138261B1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2022106345A JP7138261B1 (ja) 2022-06-30 2022-06-30 半導体パッケージ、及び駆動装置
JP2022140946A JP7763154B2 (ja) 2022-06-30 2022-09-05 半導体パッケージ、及び駆動装置
KR1020230019313A KR102677824B1 (ko) 2022-06-30 2023-02-14 반도체 패키지 및 구동 장치
US18/295,269 US12543510B2 (en) 2022-06-30 2023-04-04 Semiconductor package and drive apparatus
CN202511760989.0A CN121531930A (zh) 2022-06-30 2023-04-11 半导体封装体
CN202310378736.1A CN117337128A (zh) 2022-06-30 2023-04-11 半导体封装体和驱动装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022106345A JP7138261B1 (ja) 2022-06-30 2022-06-30 半導体パッケージ、及び駆動装置

Related Child Applications (1)

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JP2022140946A Division JP7763154B2 (ja) 2022-06-30 2022-09-05 半導体パッケージ、及び駆動装置

Publications (2)

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JP7138261B1 true JP7138261B1 (ja) 2022-09-15
JP2024005900A JP2024005900A (ja) 2024-01-17

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JP2022140946A Active JP7763154B2 (ja) 2022-06-30 2022-09-05 半導体パッケージ、及び駆動装置

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JP (2) JP7138261B1 (https=)
KR (1) KR102677824B1 (https=)
CN (2) CN121531930A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12375793B2 (en) 2022-05-31 2025-07-29 Asahi Kasei Microdevices Corporation Camera module and IC chip
US12587743B2 (en) 2022-11-30 2026-03-24 Asahi Kasei Microdevices Corporation Position detection and control of a movable body including an optical element

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006018939A1 (ja) 2004-08-20 2006-02-23 Rohm Co., Ltd 半導体装置およびそれを用いた電源装置、ならびに電子機器
US20090153138A1 (en) 2007-12-14 2009-06-18 Infineon Technologies Ag Sensor module and method for manufacturing a sensor module
WO2014091714A1 (ja) 2012-12-14 2014-06-19 旭化成エレクトロニクス株式会社 磁気センサ及び磁気センサ装置、磁気センサの製造方法
JP2016118409A (ja) 2014-12-18 2016-06-30 アルプス電気株式会社 磁気検知装置
WO2022085319A1 (ja) 2020-10-21 2022-04-28 株式会社村田製作所 磁気センサパッケージ

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5941514Y2 (ja) 1979-10-04 1984-11-30 株式会社音戸工作所 穀類乾燥装置における輸送路切替装置
JPS6371338U (https=) 1986-10-27 1988-05-13
JP2516820Y2 (ja) * 1988-04-15 1996-11-13 日本ビクター株式会社 磁気センサー
JP2002313988A (ja) * 2002-04-05 2002-10-25 Oki Electric Ind Co Ltd チップサイズパッケージの製造方法
KR100541677B1 (ko) * 2003-05-24 2006-01-10 주식회사 하이닉스반도체 반도체 패키지장치 및 그 제조 방법
JP4547956B2 (ja) * 2004-03-24 2010-09-22 ヤマハ株式会社 半導体装置、及び、チップサイズパッケージ
US7808073B2 (en) * 2004-03-31 2010-10-05 Casio Computer Co., Ltd. Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both
US20060006529A1 (en) * 2004-07-08 2006-01-12 Min-Jer Lin Semiconductor package and method for manufacturing the same
JP5688251B2 (ja) * 2010-08-31 2015-03-25 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー モータ制御用半導体装置
KR101718011B1 (ko) * 2010-11-01 2017-03-21 삼성전자주식회사 반도체 패키지 및 그 제조방법
CN104303065B (zh) 2012-06-29 2017-04-12 旭化成微电子株式会社 霍尔电动势校正装置以及霍尔电动势校正方法
US8618795B1 (en) * 2012-06-29 2013-12-31 General Electric Company Sensor assembly for use in medical position and orientation tracking
JP5658715B2 (ja) 2012-07-25 2015-01-28 旭化成エレクトロニクス株式会社 ホール起電力信号検出装置
JP3189365U (ja) 2012-12-19 2014-03-13 旭化成エレクトロニクス株式会社 位置検出装置及びそれを用いた電子機器
GB2539681A (en) 2015-06-23 2016-12-28 Melexis Tech Sa Stress and temperature compensated hall sensor, and method
JP6839938B2 (ja) 2016-07-25 2021-03-10 旭化成エレクトロニクス株式会社 半導体装置、磁気検出装置、半導体装置の製造方法および電子コンパス
JP6826088B2 (ja) 2017-11-28 2021-02-03 旭化成エレクトロニクス株式会社 半導体パッケージ及びカメラモジュール
US10790328B2 (en) * 2017-11-28 2020-09-29 Asahi Kasei Microdevices Corporation Semiconductor package and camera module
JP1640626S (https=) 2018-10-31 2019-09-02
JP1641808S (https=) 2018-10-31 2019-09-24
JP1640409S (https=) 2018-10-31 2019-09-02
JP7215454B2 (ja) 2020-04-08 2023-01-31 Tdk株式会社 磁気センサ、磁気式エンコーダおよびレンズ位置検出装置
KR102516774B1 (ko) * 2020-10-28 2023-03-31 삼성전기주식회사 홀 센서 출력값 검출 장치 및 렌즈 모듈 제어 장치
KR102407367B1 (ko) 2021-08-11 2022-06-10 엘지이노텍 주식회사 렌즈 구동장치 및 이를 포함하는 카메라 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006018939A1 (ja) 2004-08-20 2006-02-23 Rohm Co., Ltd 半導体装置およびそれを用いた電源装置、ならびに電子機器
US20090153138A1 (en) 2007-12-14 2009-06-18 Infineon Technologies Ag Sensor module and method for manufacturing a sensor module
WO2014091714A1 (ja) 2012-12-14 2014-06-19 旭化成エレクトロニクス株式会社 磁気センサ及び磁気センサ装置、磁気センサの製造方法
JP2016118409A (ja) 2014-12-18 2016-06-30 アルプス電気株式会社 磁気検知装置
WO2022085319A1 (ja) 2020-10-21 2022-04-28 株式会社村田製作所 磁気センサパッケージ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12375793B2 (en) 2022-05-31 2025-07-29 Asahi Kasei Microdevices Corporation Camera module and IC chip
US12587743B2 (en) 2022-11-30 2026-03-24 Asahi Kasei Microdevices Corporation Position detection and control of a movable body including an optical element

Also Published As

Publication number Publication date
JP7763154B2 (ja) 2025-10-31
KR102677824B1 (ko) 2024-06-25
KR20240002896A (ko) 2024-01-08
CN121531930A (zh) 2026-02-13
JP2024006850A (ja) 2024-01-17
US20240008371A1 (en) 2024-01-04
JP2024005900A (ja) 2024-01-17
US12543510B2 (en) 2026-02-03
CN117337128A (zh) 2024-01-02

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