JP1640626S - - Google Patents

Info

Publication number
JP1640626S
JP1640626S JPD2018-23984F JP2018023984F JP1640626S JP 1640626 S JP1640626 S JP 1640626S JP 2018023984 F JP2018023984 F JP 2018023984F JP 1640626 S JP1640626 S JP 1640626S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2018-23984F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2018-23984F priority Critical patent/JP1640626S/ja
Priority to US29/696,264 priority patent/USD933618S1/en
Application granted granted Critical
Publication of JP1640626S publication Critical patent/JP1640626S/ja
Priority to US29/807,156 priority patent/USD1046799S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2018-23984F 2018-10-31 2018-10-31 Active JP1640626S (https=)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2018-23984F JP1640626S (https=) 2018-10-31 2018-10-31
US29/696,264 USD933618S1 (en) 2018-10-31 2019-06-26 Semiconductor module
US29/807,156 USD1046799S1 (en) 2018-10-31 2021-09-09 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-23984F JP1640626S (https=) 2018-10-31 2018-10-31

Publications (1)

Publication Number Publication Date
JP1640626S true JP1640626S (https=) 2019-09-02

Family

ID=67769600

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2018-23984F Active JP1640626S (https=) 2018-10-31 2018-10-31

Country Status (1)

Country Link
JP (1) JP1640626S (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12543510B2 (en) 2022-06-30 2026-02-03 Asahi Kasei Microdevices Corporation Semiconductor package and drive apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12543510B2 (en) 2022-06-30 2026-02-03 Asahi Kasei Microdevices Corporation Semiconductor package and drive apparatus

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