CN121531930A - 半导体封装体 - Google Patents

半导体封装体

Info

Publication number
CN121531930A
CN121531930A CN202511760989.0A CN202511760989A CN121531930A CN 121531930 A CN121531930 A CN 121531930A CN 202511760989 A CN202511760989 A CN 202511760989A CN 121531930 A CN121531930 A CN 121531930A
Authority
CN
China
Prior art keywords
hall element
semiconductor package
external terminals
viewed
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202511760989.0A
Other languages
English (en)
Chinese (zh)
Inventor
冈田启太
坂元亮太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Microdevices Corp
Original Assignee
Asahi Kasei Microdevices Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Microdevices Corp filed Critical Asahi Kasei Microdevices Corp
Publication of CN121531930A publication Critical patent/CN121531930A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45—Differential amplifiers
    • H03F3/45071—Differential amplifiers with semiconductor devices only
    • H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
    • H03F3/45475—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using IC blocks as the active amplifying circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N52/00—Hall-effect devices
    • H10N52/101—Semiconductor Hall-effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N52/00—Hall-effect devices
    • H10N52/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N59/00—Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/261—Functions other than electrical connecting
    • H10W72/267—Multiple bump connectors having different functions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Hall/Mr Elements (AREA)
  • Measuring Magnetic Variables (AREA)
  • Adjustment Of Camera Lenses (AREA)
CN202511760989.0A 2022-06-30 2023-04-11 半导体封装体 Pending CN121531930A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022106345A JP7138261B1 (ja) 2022-06-30 2022-06-30 半導体パッケージ、及び駆動装置
JP2022-106345 2022-06-30
CN202310378736.1A CN117337128A (zh) 2022-06-30 2023-04-11 半导体封装体和驱动装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202310378736.1A Division CN117337128A (zh) 2022-06-30 2023-04-11 半导体封装体和驱动装置

Publications (1)

Publication Number Publication Date
CN121531930A true CN121531930A (zh) 2026-02-13

Family

ID=83282303

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202511760989.0A Pending CN121531930A (zh) 2022-06-30 2023-04-11 半导体封装体
CN202310378736.1A Pending CN117337128A (zh) 2022-06-30 2023-04-11 半导体封装体和驱动装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202310378736.1A Pending CN117337128A (zh) 2022-06-30 2023-04-11 半导体封装体和驱动装置

Country Status (4)

Country Link
US (1) US12543510B2 (https=)
JP (2) JP7138261B1 (https=)
KR (1) KR102677824B1 (https=)
CN (2) CN121531930A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7190604B1 (ja) 2022-05-31 2022-12-15 旭化成エレクトロニクス株式会社 カメラモジュールおよびｉｃチップ
JP2024078667A (ja) 2022-11-30 2024-06-11 旭化成エレクトロニクス株式会社 Ｉｃチップ、カメラモジュールおよび位置制御システム

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5941514Y2 (ja) 1979-10-04 1984-11-30 株式会社音戸工作所 穀類乾燥装置における輸送路切替装置
JPS6371338U (https=) 1986-10-27 1988-05-13
JP2516820Y2 (ja) * 1988-04-15 1996-11-13 日本ビクター株式会社 磁気センサー
JP2002313988A (ja) * 2002-04-05 2002-10-25 Oki Electric Ind Co Ltd チップサイズパッケージの製造方法
KR100541677B1 (ko) * 2003-05-24 2006-01-10 주식회사 하이닉스반도체 반도체 패키지장치 및 그 제조 방법
JP4547956B2 (ja) * 2004-03-24 2010-09-22 ヤマハ株式会社 半導体装置、及び、チップサイズパッケージ
US7808073B2 (en) * 2004-03-31 2010-10-05 Casio Computer Co., Ltd. Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both
US20060006529A1 (en) * 2004-07-08 2006-01-12 Min-Jer Lin Semiconductor package and method for manufacturing the same
EP1796160A1 (en) 2004-08-20 2007-06-13 Rohm Co., Ltd. Semiconductor device, power supply apparatus using the same, and electronic device
US8559139B2 (en) 2007-12-14 2013-10-15 Intel Mobile Communications GmbH Sensor module and method for manufacturing a sensor module
JP5688251B2 (ja) * 2010-08-31 2015-03-25 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー モータ制御用半導体装置
KR101718011B1 (ko) * 2010-11-01 2017-03-21 삼성전자주식회사 반도체 패키지 및 그 제조방법
CN104303065B (zh) 2012-06-29 2017-04-12 旭化成微电子株式会社 霍尔电动势校正装置以及霍尔电动势校正方法
US8618795B1 (en) * 2012-06-29 2013-12-31 General Electric Company Sensor assembly for use in medical position and orientation tracking
JP5658715B2 (ja) 2012-07-25 2015-01-28 旭化成エレクトロニクス株式会社 ホール起電力信号検出装置
WO2014091714A1 (ja) 2012-12-14 2014-06-19 旭化成エレクトロニクス株式会社 磁気センサ及び磁気センサ装置、磁気センサの製造方法
JP3189365U (ja) 2012-12-19 2014-03-13 旭化成エレクトロニクス株式会社 位置検出装置及びそれを用いた電子機器
JP6301823B2 (ja) 2014-12-18 2018-03-28 アルプス電気株式会社 磁気検知装置
GB2539681A (en) 2015-06-23 2016-12-28 Melexis Tech Sa Stress and temperature compensated hall sensor, and method
JP6839938B2 (ja) 2016-07-25 2021-03-10 旭化成エレクトロニクス株式会社 半導体装置、磁気検出装置、半導体装置の製造方法および電子コンパス
JP6826088B2 (ja) 2017-11-28 2021-02-03 旭化成エレクトロニクス株式会社 半導体パッケージ及びカメラモジュール
US10790328B2 (en) * 2017-11-28 2020-09-29 Asahi Kasei Microdevices Corporation Semiconductor package and camera module
JP1640626S (https=) 2018-10-31 2019-09-02
JP1641808S (https=) 2018-10-31 2019-09-24
JP1640409S (https=) 2018-10-31 2019-09-02
JP7215454B2 (ja) 2020-04-08 2023-01-31 Tdk株式会社 磁気センサ、磁気式エンコーダおよびレンズ位置検出装置
JP7501654B2 (ja) 2020-10-21 2024-06-18 株式会社村田製作所 磁気センサパッケージ
KR102516774B1 (ko) * 2020-10-28 2023-03-31 삼성전기주식회사 홀 센서 출력값 검출 장치 및 렌즈 모듈 제어 장치
KR102407367B1 (ko) 2021-08-11 2022-06-10 엘지이노텍 주식회사 렌즈 구동장치 및 이를 포함하는 카메라 장치

Also Published As

Publication number Publication date
JP7763154B2 (ja) 2025-10-31
KR102677824B1 (ko) 2024-06-25
KR20240002896A (ko) 2024-01-08
JP7138261B1 (ja) 2022-09-15
JP2024006850A (ja) 2024-01-17
US20240008371A1 (en) 2024-01-04
JP2024005900A (ja) 2024-01-17
US12543510B2 (en) 2026-02-03
CN117337128A (zh) 2024-01-02

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