JP4786986B2 - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- JP4786986B2 JP4786986B2 JP2005285001A JP2005285001A JP4786986B2 JP 4786986 B2 JP4786986 B2 JP 4786986B2 JP 2005285001 A JP2005285001 A JP 2005285001A JP 2005285001 A JP2005285001 A JP 2005285001A JP 4786986 B2 JP4786986 B2 JP 4786986B2
- Authority
- JP
- Japan
- Prior art keywords
- hall sensor
- lead frame
- hall
- sensors
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Magnetic Variables (AREA)
- Wire Bonding (AREA)
Description
例えば、デジタルカメラの手ブレ補正機構では、瞬時に高精度な位置検出を行う必要があり、それと同時に機器全体の小型化の要求が強いので、センサ自体の小型化が要求されている。さらには、長寿命化、埃や油(グリース)などの影響を受けにくいなど様々な要求がある。
図3に示すように、規定の間隔を隔てて配置された2個のホールセンサ11、12に対向して配置された永久磁石23の側方移動による磁束密度の変化に応じて、2個のホールセンサ11、12のホール出力電圧がそれぞれ変化する。そのホール出力電圧の差を、図2で示すように差動信号処理回路21により処理することで、永久磁石23の位置検出を行うことができる。
第1のホールセンサ11の正極出力端子11bと負極出力端子11dは、差動信号処理回路21の第1の差動増幅器21aに接続され、第2のホールセンサ12の正極出力端子12bと負極出力端子12dは、差動信号処理回路21の第2の差動増幅器21bに接続される。第1の差動増幅器21aと第2の差動増幅器21bの出力信号は、第3の差動増幅器21cに接続される。
12 第2のホールセンサ
11a、12a 正極入力端子
11b、12b 正極出力端子
11c、12c 負極入力端子
11d、12d 負極出力端子
21 差動信号処理回路
21a,21b,21c 差動増幅器
23 永久磁石
31 基板
32、33、34 ホールセンサ
35 ホールセンサの一方の端子対方向を示す矢印
36 ホールセンサの他方の端子対方向を示す矢印
51 正極入力電極
52 負極入力電極
53 第1のホールセンサの正極出力電極
54 第1のホールセンサの負極出力電極
55 第2のホールセンサの正極出力電極
56 第2のホールセンサの負極出力電極
57 第1のホールセンサ
58 第2のホールセンサ
59 パッケージ外形
61 複数の端子を備えた素子
62 正極入力端子
63 負極入力端子
71 正極入力電極
72 負極入力電極
73 第1の複数の端子を備えた素子
74 第2の複数の端子を備えた素子
75 電子部品のパッケージ外形
Claims (1)
- 1つのパッケージ内のリードフレームのダイパッド上に搭載され、かつワイヤボンドされた長方形または正方形の第1及び第2のホールセンサを有する電子部品において、
ワイヤ配線同士の交差を回避して該ワイヤ配線の引き回しを可能とするために、前記第1及び第2のホールセンサの各々の厚み方向以外の各辺が、少なくともパッケージの外形の厚さ方向以外の各辺に対して、平行または垂直以外の角度となるように回転されて配置され、かつ前記第1及び第2のホールセンサが、該第1及び第2のホールセンサの正極入力端子同士が対向するように前記リードフレームの前記ダイパッドにマウントされ、
前記第1及び第2のホールセンサの各々の前記正極入力端子が、前記リードフレーム上の共通の正極入力電極に直接接続されるとともに、前記第1及び第2のホールセンサの角部に配置された各々の負極入力端子が、前記リードフレーム上の共通の負極入力電極に直接接続されるように、前記各々の入力端子と前記各々の入力電極とがワイヤボンドされていることを特徴とする電子部品。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005285001A JP4786986B2 (ja) | 2005-09-29 | 2005-09-29 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005285001A JP4786986B2 (ja) | 2005-09-29 | 2005-09-29 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007093468A JP2007093468A (ja) | 2007-04-12 |
JP4786986B2 true JP4786986B2 (ja) | 2011-10-05 |
Family
ID=37979360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005285001A Active JP4786986B2 (ja) | 2005-09-29 | 2005-09-29 | 電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4786986B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN206558553U (zh) * | 2014-10-03 | 2017-10-13 | 旭化成微电子株式会社 | 霍尔传感器以及镜头模块 |
JP2019070563A (ja) * | 2017-10-06 | 2019-05-09 | 株式会社デンソー | 電流センサ |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5795685A (en) * | 1980-12-05 | 1982-06-14 | Toshiba Corp | Resin sealed type semiconductor magnetic sensitive device |
JPS58171683A (ja) * | 1981-12-08 | 1983-10-08 | Denki Onkyo Co Ltd | 磁気センサ装置 |
JPS62208683A (ja) * | 1986-03-07 | 1987-09-12 | Seiko Instr & Electronics Ltd | 磁気センサ |
JPH0382358A (ja) * | 1990-03-13 | 1991-04-08 | Murata Mfg Co Ltd | 磁電変換装置 |
JP3264962B2 (ja) * | 1992-02-06 | 2002-03-11 | 旭化成株式会社 | 磁電変換素子の製造方法 |
JPH11237395A (ja) * | 1998-02-23 | 1999-08-31 | Honda Motor Co Ltd | 回転センサ及び回転センサ用磁気検出ic |
JP2000252547A (ja) * | 1999-02-26 | 2000-09-14 | Victor Co Of Japan Ltd | ホール素子 |
JP4948719B2 (ja) * | 2001-08-27 | 2012-06-06 | 旭化成エレクトロニクス株式会社 | 磁電変換素子を用いた変位検出装置 |
JP4315759B2 (ja) * | 2002-07-25 | 2009-08-19 | 旭化成エレクトロニクス株式会社 | ポインティングデバイス用磁気センサ |
-
2005
- 2005-09-29 JP JP2005285001A patent/JP4786986B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2007093468A (ja) | 2007-04-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5165963B2 (ja) | 磁気センサ及びその製造方法 | |
US8320753B2 (en) | Handshake correction apparatus | |
TWI650587B (zh) | 鏡頭驅動裝置 | |
EP1880422B1 (en) | A device comprising a sensor module | |
JP6194372B2 (ja) | センサモジュール、並びに、これに用いるセンサチップ及び処理回路チップ | |
JP2007095788A (ja) | 磁気センサ | |
WO2013171977A1 (ja) | ブリッジ回路、及びこれを有する磁気センサ | |
JP4786986B2 (ja) | 電子部品 | |
JP5356793B2 (ja) | 磁気検出装置及びその製造方法 | |
JP5284024B2 (ja) | 磁気センサ | |
JPWO2019131816A1 (ja) | 磁気センサモジュール | |
JP2008170359A (ja) | 位置検出装置 | |
JP4940565B2 (ja) | 磁気センサの製造方法 | |
JP5879025B2 (ja) | ホール素子 | |
JP2009281784A (ja) | 磁気センサ | |
JP5593704B2 (ja) | 磁気検出素子、および、これを用いた回転角度検出装置ならびにストローク量検出装置 | |
US11553132B2 (en) | Method of correcting position detecting signal and position detecting device | |
WO2017077871A1 (ja) | 磁気センサ | |
JP5103158B2 (ja) | 磁気式座標位置検出装置 | |
JP7097671B2 (ja) | Ic化磁気センサおよびそれに使用するリードフレーム | |
TW202035943A (zh) | 旋轉角度感測裝置 | |
US10451646B2 (en) | Sensor with symmetrically embedded sensor elements | |
JP4301555B2 (ja) | 小型磁気センサモジュール | |
KR102677824B1 (ko) | 반도체 패키지 및 구동 장치 | |
JP2011043338A (ja) | 電流センサ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20070402 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080925 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100723 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100916 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101015 |
|
RD13 | Notification of appointment of power of sub attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7433 Effective date: 20101117 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20101117 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101213 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110401 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110511 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110708 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110714 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4786986 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140722 Year of fee payment: 3 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |