KR102677824B1 - 반도체 패키지 및 구동 장치 - Google Patents

반도체 패키지 및 구동 장치 Download PDF

Info

Publication number
KR102677824B1
KR102677824B1 KR1020230019313A KR20230019313A KR102677824B1 KR 102677824 B1 KR102677824 B1 KR 102677824B1 KR 1020230019313 A KR1020230019313 A KR 1020230019313A KR 20230019313 A KR20230019313 A KR 20230019313A KR 102677824 B1 KR102677824 B1 KR 102677824B1
Authority
KR
South Korea
Prior art keywords
hall element
semiconductor package
plan
external terminal
viewed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020230019313A
Other languages
English (en)
Korean (ko)
Other versions
KR20240002896A (ko
Inventor
게이따 오까다
료따 사까모또
Original Assignee
아사히 가세이 일렉트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아사히 가세이 일렉트로닉스 가부시끼가이샤 filed Critical 아사히 가세이 일렉트로닉스 가부시끼가이샤
Publication of KR20240002896A publication Critical patent/KR20240002896A/ko
Application granted granted Critical
Publication of KR102677824B1 publication Critical patent/KR102677824B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N59/00—Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H01L25/16—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • H01L23/3107—
    • H01L23/522—
    • H01L23/58—
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45—Differential amplifiers
    • H03F3/45071—Differential amplifiers with semiconductor devices only
    • H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
    • H03F3/45475—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using IC blocks as the active amplifying circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N52/00—Hall-effect devices
    • H10N52/101—Semiconductor Hall-effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N52/00—Hall-effect devices
    • H10N52/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H01L2224/023—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/261—Functions other than electrical connecting
    • H10W72/267—Multiple bump connectors having different functions

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Hall/Mr Elements (AREA)
  • Measuring Magnetic Variables (AREA)
  • Adjustment Of Camera Lenses (AREA)
KR1020230019313A 2022-06-30 2023-02-14 반도체 패키지 및 구동 장치 Active KR102677824B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2022-106345 2022-06-30
JP2022106345A JP7138261B1 (ja) 2022-06-30 2022-06-30 半導体パッケージ、及び駆動装置

Publications (2)

Publication Number Publication Date
KR20240002896A KR20240002896A (ko) 2024-01-08
KR102677824B1 true KR102677824B1 (ko) 2024-06-25

Family

ID=83282303

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230019313A Active KR102677824B1 (ko) 2022-06-30 2023-02-14 반도체 패키지 및 구동 장치

Country Status (4)

Country Link
US (1) US12543510B2 (https=)
JP (2) JP7138261B1 (https=)
KR (1) KR102677824B1 (https=)
CN (2) CN121531930A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7190604B1 (ja) 2022-05-31 2022-12-15 旭化成エレクトロニクス株式会社 カメラモジュールおよびｉｃチップ
JP2024078667A (ja) 2022-11-30 2024-06-11 旭化成エレクトロニクス株式会社 Ｉｃチップ、カメラモジュールおよび位置制御システム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019102803A (ja) 2017-11-28 2019-06-24 旭化成エレクトロニクス株式会社 半導体パッケージ及びカメラモジュール
JP2021165698A (ja) 2020-04-08 2021-10-14 Tdk株式会社 磁気センサ、磁気式エンコーダおよびレンズ位置検出装置
KR102407367B1 (ko) 2021-08-11 2022-06-10 엘지이노텍 주식회사 렌즈 구동장치 및 이를 포함하는 카메라 장치

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5941514Y2 (ja) 1979-10-04 1984-11-30 株式会社音戸工作所 穀類乾燥装置における輸送路切替装置
JPS6371338U (https=) 1986-10-27 1988-05-13
JP2516820Y2 (ja) * 1988-04-15 1996-11-13 日本ビクター株式会社 磁気センサー
JP2002313988A (ja) * 2002-04-05 2002-10-25 Oki Electric Ind Co Ltd チップサイズパッケージの製造方法
KR100541677B1 (ko) * 2003-05-24 2006-01-10 주식회사 하이닉스반도체 반도체 패키지장치 및 그 제조 방법
JP4547956B2 (ja) * 2004-03-24 2010-09-22 ヤマハ株式会社 半導体装置、及び、チップサイズパッケージ
US7808073B2 (en) * 2004-03-31 2010-10-05 Casio Computer Co., Ltd. Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both
US20060006529A1 (en) * 2004-07-08 2006-01-12 Min-Jer Lin Semiconductor package and method for manufacturing the same
EP1796160A1 (en) 2004-08-20 2007-06-13 Rohm Co., Ltd. Semiconductor device, power supply apparatus using the same, and electronic device
US8559139B2 (en) 2007-12-14 2013-10-15 Intel Mobile Communications GmbH Sensor module and method for manufacturing a sensor module
JP5688251B2 (ja) * 2010-08-31 2015-03-25 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー モータ制御用半導体装置
KR101718011B1 (ko) * 2010-11-01 2017-03-21 삼성전자주식회사 반도체 패키지 및 그 제조방법
CN104303065B (zh) 2012-06-29 2017-04-12 旭化成微电子株式会社 霍尔电动势校正装置以及霍尔电动势校正方法
US8618795B1 (en) * 2012-06-29 2013-12-31 General Electric Company Sensor assembly for use in medical position and orientation tracking
JP5658715B2 (ja) 2012-07-25 2015-01-28 旭化成エレクトロニクス株式会社 ホール起電力信号検出装置
WO2014091714A1 (ja) 2012-12-14 2014-06-19 旭化成エレクトロニクス株式会社 磁気センサ及び磁気センサ装置、磁気センサの製造方法
JP3189365U (ja) 2012-12-19 2014-03-13 旭化成エレクトロニクス株式会社 位置検出装置及びそれを用いた電子機器
JP6301823B2 (ja) 2014-12-18 2018-03-28 アルプス電気株式会社 磁気検知装置
GB2539681A (en) 2015-06-23 2016-12-28 Melexis Tech Sa Stress and temperature compensated hall sensor, and method
JP6839938B2 (ja) 2016-07-25 2021-03-10 旭化成エレクトロニクス株式会社 半導体装置、磁気検出装置、半導体装置の製造方法および電子コンパス
US10790328B2 (en) * 2017-11-28 2020-09-29 Asahi Kasei Microdevices Corporation Semiconductor package and camera module
JP1640626S (https=) 2018-10-31 2019-09-02
JP1641808S (https=) 2018-10-31 2019-09-24
JP1640409S (https=) 2018-10-31 2019-09-02
JP7501654B2 (ja) 2020-10-21 2024-06-18 株式会社村田製作所 磁気センサパッケージ
KR102516774B1 (ko) * 2020-10-28 2023-03-31 삼성전기주식회사 홀 센서 출력값 검출 장치 및 렌즈 모듈 제어 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019102803A (ja) 2017-11-28 2019-06-24 旭化成エレクトロニクス株式会社 半導体パッケージ及びカメラモジュール
JP2021165698A (ja) 2020-04-08 2021-10-14 Tdk株式会社 磁気センサ、磁気式エンコーダおよびレンズ位置検出装置
KR102407367B1 (ko) 2021-08-11 2022-06-10 엘지이노텍 주식회사 렌즈 구동장치 및 이를 포함하는 카메라 장치

Also Published As

Publication number Publication date
JP7763154B2 (ja) 2025-10-31
KR20240002896A (ko) 2024-01-08
CN121531930A (zh) 2026-02-13
JP7138261B1 (ja) 2022-09-15
JP2024006850A (ja) 2024-01-17
US20240008371A1 (en) 2024-01-04
JP2024005900A (ja) 2024-01-17
US12543510B2 (en) 2026-02-03
CN117337128A (zh) 2024-01-02

Similar Documents

Publication Publication Date Title
KR102677824B1 (ko) 반도체 패키지 및 구동 장치
US9900539B2 (en) Solid-state image pickup element, and image pickup system
JP7192053B2 (ja) 撮像装置
KR101240906B1 (ko) 촬상 장치의 제어 회로
KR20130108283A (ko) 카메라 장치
JP7789722B2 (ja) 磁気センサ装置
WO2020189477A1 (ja) コイルモジュール、コイルモジュールを備えたアクチュエータ、およびコイルモジュールの製造方法
JP2019028340A (ja) アクチュエータドライバ及びこれを用いた撮像装置
JP7789721B2 (ja) 磁気センサ装置
JP4530691B2 (ja) 像ブレ補正装置
JP2018146655A (ja) 撮像装置およびアクチュエータドライバ
US20250280199A1 (en) Piezo-actuated platforms for image sensor stabilization
US20260123291A1 (en) Semiconductor package and drive apparatus
US20240036437A1 (en) Camera module
KR20220003550A (ko) 홀 바 센서 보정을 위한 온도 제어
JP5879025B2 (ja) ホール素子
JP7124856B2 (ja) 位置検出信号の補正方法及び位置検出装置
CN101446737B (zh) 半导体装置和摄像装置
CN121240568B (zh) 半导体封装体、摄像头模组及电子设备
CN223428515U (zh) 磁位置传感器和防抖相机
US20250227369A1 (en) Shake correction device
US12401928B2 (en) Photoelectric conversion apparatus and equipment including the same
JP4786986B2 (ja) 電子部品
TWM470962U (zh) 鏡頭防震裝置
CN101446736A (zh) 半导体装置及摄像装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000