JP7135880B2 - 接続端子 - Google Patents
接続端子 Download PDFInfo
- Publication number
- JP7135880B2 JP7135880B2 JP2019007135A JP2019007135A JP7135880B2 JP 7135880 B2 JP7135880 B2 JP 7135880B2 JP 2019007135 A JP2019007135 A JP 2019007135A JP 2019007135 A JP2019007135 A JP 2019007135A JP 7135880 B2 JP7135880 B2 JP 7135880B2
- Authority
- JP
- Japan
- Prior art keywords
- surface layer
- layer
- connection terminal
- concentration
- terminal according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002344 surface layer Substances 0.000 claims description 170
- 239000010410 layer Substances 0.000 claims description 98
- 229910052751 metal Inorganic materials 0.000 claims description 66
- 239000002184 metal Substances 0.000 claims description 61
- 239000000463 material Substances 0.000 claims description 48
- 239000007769 metal material Substances 0.000 claims description 46
- 229910052737 gold Inorganic materials 0.000 claims description 37
- 229910052738 indium Inorganic materials 0.000 claims description 32
- 229910000846 In alloy Inorganic materials 0.000 claims description 25
- 239000002356 single layer Substances 0.000 claims description 23
- 229910052759 nickel Inorganic materials 0.000 claims description 21
- 239000006104 solid solution Substances 0.000 claims description 15
- 238000001514 detection method Methods 0.000 claims description 14
- 238000000682 scanning probe acoustic microscopy Methods 0.000 claims description 14
- 238000002441 X-ray diffraction Methods 0.000 claims description 6
- 229910000765 intermetallic Inorganic materials 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 description 143
- 238000010438 heat treatment Methods 0.000 description 42
- 150000002739 metals Chemical class 0.000 description 28
- 238000009792 diffusion process Methods 0.000 description 24
- 230000003647 oxidation Effects 0.000 description 20
- 238000007254 oxidation reaction Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 16
- 239000000523 sample Substances 0.000 description 15
- 229910045601 alloy Inorganic materials 0.000 description 14
- 239000000956 alloy Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 238000009826 distribution Methods 0.000 description 11
- 238000007747 plating Methods 0.000 description 11
- 239000000654 additive Substances 0.000 description 10
- 230000000996 additive effect Effects 0.000 description 10
- 230000001965 increasing effect Effects 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 238000005275 alloying Methods 0.000 description 6
- 238000007654 immersion Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000000470 constituent Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000905 alloy phase Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/111—Resilient sockets co-operating with pins having a circular transverse section
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Contacts (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019007135A JP7135880B2 (ja) | 2019-01-18 | 2019-01-18 | 接続端子 |
| US17/422,364 US20220077616A1 (en) | 2019-01-18 | 2020-01-17 | Metal material and connection terminal |
| PCT/JP2020/001479 WO2020149401A1 (ja) | 2019-01-18 | 2020-01-17 | 金属材および接続端子 |
| DE112020000450.3T DE112020000450T5 (de) | 2019-01-18 | 2020-01-17 | Metallmaterial und Anschlussklemme |
| CN202080008901.9A CN113286918B (zh) | 2019-01-18 | 2020-01-17 | 金属材料及连接端子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019007135A JP7135880B2 (ja) | 2019-01-18 | 2019-01-18 | 接続端子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020117742A JP2020117742A (ja) | 2020-08-06 |
| JP2020117742A5 JP2020117742A5 (https=) | 2021-10-07 |
| JP7135880B2 true JP7135880B2 (ja) | 2022-09-13 |
Family
ID=71613345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019007135A Active JP7135880B2 (ja) | 2019-01-18 | 2019-01-18 | 接続端子 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20220077616A1 (https=) |
| JP (1) | JP7135880B2 (https=) |
| CN (1) | CN113286918B (https=) |
| DE (1) | DE112020000450T5 (https=) |
| WO (1) | WO2020149401A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003277979A (ja) | 2002-01-16 | 2003-10-02 | Seiko Epson Corp | 装飾品の表面処理方法、装飾品および時計 |
| KR100841245B1 (ko) | 2006-12-19 | 2008-06-25 | 삼성전기주식회사 | 진동모터용 정류자, 진동모터 및 이에 사용되는 도금액 |
| JP2010245266A (ja) | 2009-04-06 | 2010-10-28 | Seiko Epson Corp | 電子部品及びその製造方法 |
| WO2013115276A1 (ja) | 2012-02-03 | 2013-08-08 | Jx日鉱日石金属株式会社 | 圧入型端子及びそれを用いた電子部品 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63168028A (ja) * | 1986-12-29 | 1988-07-12 | Matsushita Electric Ind Co Ltd | 微細接続構造 |
| JPH03112078A (ja) * | 1989-09-27 | 1991-05-13 | Tanaka Kikinzoku Kogyo Kk | 電気・電子部品対向接触用接触子 |
| JPH03297593A (ja) * | 1990-04-18 | 1991-12-27 | Meidensha Corp | ロウ材とロウ付け方法 |
| JPH088299A (ja) * | 1994-06-23 | 1996-01-12 | Sony Corp | 電子回路装置 |
| US6734568B2 (en) * | 2001-08-29 | 2004-05-11 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
| JP2011021217A (ja) | 2009-07-14 | 2011-02-03 | Ne Chemcat Corp | 電解硬質金めっき液及びこれを用いるめっき方法 |
| WO2011093162A1 (ja) * | 2010-01-29 | 2011-08-04 | 住友ベークライト株式会社 | 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器 |
| KR101797660B1 (ko) * | 2016-04-25 | 2017-11-15 | (주)인광 | 내흑변성이 우수한 인듐합금 전해도금층을 갖는 전기, 전자기기 부품 및 그 제조방법 |
| JP7016627B2 (ja) | 2017-06-20 | 2022-02-07 | 積水化学工業株式会社 | 雨水排水装置 |
-
2019
- 2019-01-18 JP JP2019007135A patent/JP7135880B2/ja active Active
-
2020
- 2020-01-17 DE DE112020000450.3T patent/DE112020000450T5/de not_active Ceased
- 2020-01-17 US US17/422,364 patent/US20220077616A1/en not_active Abandoned
- 2020-01-17 CN CN202080008901.9A patent/CN113286918B/zh not_active Expired - Fee Related
- 2020-01-17 WO PCT/JP2020/001479 patent/WO2020149401A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003277979A (ja) | 2002-01-16 | 2003-10-02 | Seiko Epson Corp | 装飾品の表面処理方法、装飾品および時計 |
| KR100841245B1 (ko) | 2006-12-19 | 2008-06-25 | 삼성전기주식회사 | 진동모터용 정류자, 진동모터 및 이에 사용되는 도금액 |
| JP2010245266A (ja) | 2009-04-06 | 2010-10-28 | Seiko Epson Corp | 電子部品及びその製造方法 |
| WO2013115276A1 (ja) | 2012-02-03 | 2013-08-08 | Jx日鉱日石金属株式会社 | 圧入型端子及びそれを用いた電子部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020149401A1 (ja) | 2020-07-23 |
| DE112020000450T5 (de) | 2021-10-21 |
| JP2020117742A (ja) | 2020-08-06 |
| US20220077616A1 (en) | 2022-03-10 |
| CN113286918B (zh) | 2024-01-23 |
| CN113286918A (zh) | 2021-08-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5696811B2 (ja) | コネクタ用めっき端子および端子対 | |
| CN108886212B (zh) | 电触点及连接器端子对 | |
| CN105723018B (zh) | 基板用端子及其制造方法以及基板连接器 | |
| JP2010144252A (ja) | めっき材料とその製造方法、それを用いた電気・電子部品 | |
| WO2013153832A1 (ja) | 電子部品用金属材料 | |
| JP5803793B2 (ja) | コネクタ用めっき端子 | |
| CN113597480B (zh) | 金属材料及连接端子 | |
| US10804633B2 (en) | Electrical contact point, connector terminal pair and connector pair | |
| JP7151499B2 (ja) | 金属材および接続端子 | |
| JP7135880B2 (ja) | 接続端子 | |
| JP6503159B2 (ja) | 電子部品用金属材料、それを用いたコネクタ端子、コネクタ及び電子部品 | |
| JP2005344188A (ja) | めっき材料の製造方法、そのめっき材料を用いた電気・電子部品 | |
| JP6733491B2 (ja) | 接続端子および接続端子の製造方法 | |
| JP7111000B2 (ja) | 金属材および接続端子 | |
| JP4978286B2 (ja) | 銀系薄膜合金 | |
| JP6553333B2 (ja) | 電子部品用金属材料、それを用いたコネクタ端子、コネクタ及び電子部品 | |
| JP2003328157A (ja) | めっき材料とその製造方法、それを用いた電気・電子部品 | |
| JP7676806B2 (ja) | 金属材、接続端子、および金属材の製造方法 | |
| JP2007204854A (ja) | めっき材料とその製造方法、それを用いた電気・電子部品 | |
| WO2021182240A1 (ja) | 金属材、接続端子、および金属材の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210422 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210827 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220329 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220530 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220802 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220815 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7135880 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |