JP7135880B2 - 接続端子 - Google Patents
接続端子 Download PDFInfo
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- JP7135880B2 JP7135880B2 JP2019007135A JP2019007135A JP7135880B2 JP 7135880 B2 JP7135880 B2 JP 7135880B2 JP 2019007135 A JP2019007135 A JP 2019007135A JP 2019007135 A JP2019007135 A JP 2019007135A JP 7135880 B2 JP7135880 B2 JP 7135880B2
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/111—Resilient sockets co-operating with pins having a circular transverse section
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- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
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Description
本発明の一実施形態にかかる金属材は、金属材料を積層したものよりなる。本発明の一実施形態にかかる金属材は、いかなる金属部材を構成するものであってもよいが、接続端子等、電気接続部材を構成する材料として、好適に利用することができる。
図1(a),(b)に、本発明の一実施形態にかかる金属材1の積層構造の例を示す。金属材1は、下地材10と、下地材10の表面に形成され、最表面に露出した表面層11と、を有している。後に説明するように、表面層11は、AuとInを含んでおり、図1(a)のように複層構造をとっても、図1(b)のように単層構造をとってもよい。表面層11の特性を損なわない範囲において、金属材1の最表面に露出した表面層11の上に、有機層等の薄膜(不図示)を設けてもよい。
本実施形態にかかる金属材1においては、上記のように、表面層11がAuとInの両方を含んでいる。そのため、表面層11は、低い接触抵抗を示し、さらに、加熱を経ても、接触抵抗の低い状態を維持することができる。
本実施形態にかかる金属材1は、基材10aの表面に、適宜、めっき法等によって、中間層10bを形成したうえで、表面層11を形成することにより、製造することができる。
本発明の一実施形態にかかる接続端子は、上記実施形態にかかる金属材1よりなっており、少なくとも、相手方導電部材と電気的に接触する接点部において、下地材10の表面に、AuとInを含んだ表面層11が形成されている。接続端子の具体的な形状や種類は、特に限定されるものではない。
(試料の作製)
清浄なCu基板の表面に、表1に示すように、所定の厚さの原料層を積層した。具体的には、最初に、電解めっき法により、厚さ1.0μmのNi中間層を形成した。さらに、その表面に、電解めっき法により、Au層を形成した。Au層の形成には、Coを0.2%含有する硬質金めっき液を用いた。Au層の厚さは、0.4μmとした。
・実施例1:めっき法にて、厚さ0.05μmのIn層を形成した。
・実施例2:浸漬法にて、厚さ0.01μmのIn層を形成した。
・比較例1:In層は形成せず、Au層のみを形成した試料とした。
各試料に対して、大気中で、170℃にて、120時間加熱した後、Ar+スパッタリングを用いた深さ分析AES測定を行い、表面層における構成元素の深さ方向の分布を評価した。測定は、40nmのスパッタ深さまで行った。
各試料(加熱前)に対して、接触抵抗の測定を行った。この際、Auめっきを施したR=1mmのエンボスを、各実施例および比較例にかかる板状の試料の表面に接触させ、40Nまでの接触荷重を印加しながら、接触抵抗の測定を行った。測定は四端子法によって行った。開放電圧は20mV、通電電流は10mAとした。
(表面層の状態)
表1に、各実施例および比較例について、各原料層の厚さと、加熱後のAES測定によって得られた最表面における金属元素の濃度を示す。また、図3(a)~(c)に、それぞれ実施例1,2および比較例1について、加熱後のAESによって得られた、各元素の濃度分布を示す。ここで、横軸に示した深さは、SiO2換算値である。図中に、「検出限界未満」と記載している各元素は、検出限界以上の濃度では検出されなかった。図中の深さ0nmの位置におけるAu、In,Co,Niの濃度比を、それらの元素の合計量を100原子%として表現したものが、表1に示す元素濃度比となっている。
図5(a)~(c)に、それぞれ実施例1,2および比較例1の試料に対して得られた加熱前後の接触抵抗の測定結果を示している。それらを比較すると、初期状態については、各試料で、ほぼ同程度の値となっており、いずれも低い接触抵抗が得られている。Auが非常に高い電気伝導性を有する一方、Inの酸化膜の易破壊性により、Inを最表面に有する実施例1,2においても、Inを含有しない比較例1の場合と比較して、Inの含有に起因する接触抵抗の上昇はほぼ起こっていないと言える。
10 下地材
10a 基材
10b 中間層
11 表面層
11a Au部
11b 高濃度In部
20 メス型コネクタ端子
21 弾性接触片
21a エンボス部
22 内部対向接触面
23 挟圧部
Claims (12)
- 金属材料より構成された下地材と、
前記下地材上に形成された表面層と、を有し、
前記表面層は、AuとInとを含有し、少なくともInが最表面に存在している金属材よりなり、
前記表面層は、前記金属材の最表面に露出し、少なくとも、相手方導電部材と電気的に接触する接点部において、前記下地材の表面上に形成されており、
前記表面層および前記下地材の少なくとも一方には、CoとNiの少なくとも一方よりなる易酸化性金属が含有されており、
前記表面層において、Inの少なくとも一部は、Au-In合金を構成し、
前記Au-In合金の少なくとも一部は、InがAuに固溶した固溶体であることを特徴とする接続端子。 - 前記金属材を170℃で加熱した際に、最表面における前記易酸化性金属の濃度の増加が、オージェ電子分光による検出限界未満であることを特徴とする請求項1に記載の接続端子。
- X線回折によって、In単体、およびAu-In金属間化合物に対応するピークは検出されないことを特徴とする請求項1または2に記載の接続端子。
- 前記表面層において、AuとInの両方が最表面に存在していることを特徴とする請求項1から3のいずれか1項に記載の接続端子。
- 前記表面層は、Auを主成分とするAu部と、前記Au部よりも高濃度のInを含有する高濃度In部と、を含んでいることを特徴とする請求項1から4のいずれか1項に記載の接続端子。
- 前記表面層において、前記高濃度In部は、前記Au部の表面上に形成され、最表面に露出していることを特徴とする請求項5に記載の接続端子。
- 前記表面層は、全体が単一の層よりなる単層構造をとっており、
前記単層構造において、前記Au部と前記高濃度In部が、ともに、前記表面層の最表面に露出していることを特徴とする請求項5に記載の接続端子。 - 前記表面層において、最表面から少なくとも深さ0.01μmまでの領域に、Inが分布していることを特徴とする請求項1から7のいずれか1項に記載の接続端子。
- 前記表面層において、最表面から少なくとも深さ0.05μmまでの領域に、Inが分布していることを特徴とする請求項1から8のいずれか1項に記載の接続端子。
- 前記下地材は、基材上に形成された中間層を有し、
前記中間層は、Ni,Cr,Mn,Fe,Co,Cuのいずれか少なくとも1種を含むことを特徴とする請求項1から9のいずれか1項に記載の接続端子。 - 前記表面層は、Coを含有することを特徴とする請求項1から10のいずれか1項に記載の接続端子。
- 前記表面層は、Coを5原子%以下の添加量で含有することを特徴とする請求項11に記載の接続端子。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2019007135A JP7135880B2 (ja) | 2019-01-18 | 2019-01-18 | 接続端子 |
PCT/JP2020/001479 WO2020149401A1 (ja) | 2019-01-18 | 2020-01-17 | 金属材および接続端子 |
CN202080008901.9A CN113286918B (zh) | 2019-01-18 | 2020-01-17 | 金属材料及连接端子 |
DE112020000450.3T DE112020000450T5 (de) | 2019-01-18 | 2020-01-17 | Metallmaterial und Anschlussklemme |
US17/422,364 US20220077616A1 (en) | 2019-01-18 | 2020-01-17 | Metal material and connection terminal |
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JP2019007135A JP7135880B2 (ja) | 2019-01-18 | 2019-01-18 | 接続端子 |
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JP2020117742A JP2020117742A (ja) | 2020-08-06 |
JP2020117742A5 JP2020117742A5 (ja) | 2021-10-07 |
JP7135880B2 true JP7135880B2 (ja) | 2022-09-13 |
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JP (1) | JP7135880B2 (ja) |
CN (1) | CN113286918B (ja) |
DE (1) | DE112020000450T5 (ja) |
WO (1) | WO2020149401A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003277979A (ja) | 2002-01-16 | 2003-10-02 | Seiko Epson Corp | 装飾品の表面処理方法、装飾品および時計 |
KR100841245B1 (ko) | 2006-12-19 | 2008-06-25 | 삼성전기주식회사 | 진동모터용 정류자, 진동모터 및 이에 사용되는 도금액 |
JP2010245266A (ja) | 2009-04-06 | 2010-10-28 | Seiko Epson Corp | 電子部品及びその製造方法 |
WO2013115276A1 (ja) | 2012-02-03 | 2013-08-08 | Jx日鉱日石金属株式会社 | 圧入型端子及びそれを用いた電子部品 |
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