JP2020117742A5 - - Google Patents
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- JP2020117742A5 JP2020117742A5 JP2019007135A JP2019007135A JP2020117742A5 JP 2020117742 A5 JP2020117742 A5 JP 2020117742A5 JP 2019007135 A JP2019007135 A JP 2019007135A JP 2019007135 A JP2019007135 A JP 2019007135A JP 2020117742 A5 JP2020117742 A5 JP 2020117742A5
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- JP
- Japan
- Prior art keywords
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010410 layer Substances 0.000 description 16
- 239000002344 surface layer Substances 0.000 description 11
- 239000010931 gold Substances 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 5
- 229910000846 In alloy Inorganic materials 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019007135A JP7135880B2 (ja) | 2019-01-18 | 2019-01-18 | 接続端子 |
| US17/422,364 US20220077616A1 (en) | 2019-01-18 | 2020-01-17 | Metal material and connection terminal |
| PCT/JP2020/001479 WO2020149401A1 (ja) | 2019-01-18 | 2020-01-17 | 金属材および接続端子 |
| DE112020000450.3T DE112020000450T5 (de) | 2019-01-18 | 2020-01-17 | Metallmaterial und Anschlussklemme |
| CN202080008901.9A CN113286918B (zh) | 2019-01-18 | 2020-01-17 | 金属材料及连接端子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019007135A JP7135880B2 (ja) | 2019-01-18 | 2019-01-18 | 接続端子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020117742A JP2020117742A (ja) | 2020-08-06 |
| JP2020117742A5 true JP2020117742A5 (https=) | 2021-10-07 |
| JP7135880B2 JP7135880B2 (ja) | 2022-09-13 |
Family
ID=71613345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019007135A Active JP7135880B2 (ja) | 2019-01-18 | 2019-01-18 | 接続端子 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20220077616A1 (https=) |
| JP (1) | JP7135880B2 (https=) |
| CN (1) | CN113286918B (https=) |
| DE (1) | DE112020000450T5 (https=) |
| WO (1) | WO2020149401A1 (https=) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63168028A (ja) * | 1986-12-29 | 1988-07-12 | Matsushita Electric Ind Co Ltd | 微細接続構造 |
| JPH03112078A (ja) * | 1989-09-27 | 1991-05-13 | Tanaka Kikinzoku Kogyo Kk | 電気・電子部品対向接触用接触子 |
| JPH03297593A (ja) * | 1990-04-18 | 1991-12-27 | Meidensha Corp | ロウ材とロウ付け方法 |
| JPH088299A (ja) * | 1994-06-23 | 1996-01-12 | Sony Corp | 電子回路装置 |
| US6734568B2 (en) * | 2001-08-29 | 2004-05-11 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
| JP2003277979A (ja) * | 2002-01-16 | 2003-10-02 | Seiko Epson Corp | 装飾品の表面処理方法、装飾品および時計 |
| KR100841245B1 (ko) * | 2006-12-19 | 2008-06-25 | 삼성전기주식회사 | 진동모터용 정류자, 진동모터 및 이에 사용되는 도금액 |
| JP2010245266A (ja) * | 2009-04-06 | 2010-10-28 | Seiko Epson Corp | 電子部品及びその製造方法 |
| JP2011021217A (ja) | 2009-07-14 | 2011-02-03 | Ne Chemcat Corp | 電解硬質金めっき液及びこれを用いるめっき方法 |
| WO2011093162A1 (ja) * | 2010-01-29 | 2011-08-04 | 住友ベークライト株式会社 | 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器 |
| TWI493798B (zh) * | 2012-02-03 | 2015-07-21 | Jx日鑛日石金屬股份有限公司 | Push-in terminals and electronic parts for their use |
| KR101797660B1 (ko) * | 2016-04-25 | 2017-11-15 | (주)인광 | 내흑변성이 우수한 인듐합금 전해도금층을 갖는 전기, 전자기기 부품 및 그 제조방법 |
| JP7016627B2 (ja) | 2017-06-20 | 2022-02-07 | 積水化学工業株式会社 | 雨水排水装置 |
-
2019
- 2019-01-18 JP JP2019007135A patent/JP7135880B2/ja active Active
-
2020
- 2020-01-17 DE DE112020000450.3T patent/DE112020000450T5/de not_active Ceased
- 2020-01-17 US US17/422,364 patent/US20220077616A1/en not_active Abandoned
- 2020-01-17 CN CN202080008901.9A patent/CN113286918B/zh not_active Expired - Fee Related
- 2020-01-17 WO PCT/JP2020/001479 patent/WO2020149401A1/ja not_active Ceased
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