JP2010524831A5 - - Google Patents
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- Publication number
- JP2010524831A5 JP2010524831A5 JP2010504633A JP2010504633A JP2010524831A5 JP 2010524831 A5 JP2010524831 A5 JP 2010524831A5 JP 2010504633 A JP2010504633 A JP 2010504633A JP 2010504633 A JP2010504633 A JP 2010504633A JP 2010524831 A5 JP2010524831 A5 JP 2010524831A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- mass
- ceramic body
- component
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 30
- 239000000919 ceramic Substances 0.000 claims 26
- 239000000463 material Substances 0.000 claims 18
- 229910052751 metal Inorganic materials 0.000 claims 16
- 239000002184 metal Substances 0.000 claims 16
- 229910052802 copper Inorganic materials 0.000 claims 15
- 239000010949 copper Substances 0.000 claims 15
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims 13
- 239000005751 Copper oxide Substances 0.000 claims 13
- 229910000431 copper oxide Inorganic materials 0.000 claims 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 12
- 229910000679 solder Inorganic materials 0.000 claims 12
- 239000000203 mixture Substances 0.000 claims 11
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 11
- 238000001465 metallisation Methods 0.000 claims 8
- 239000000376 reactant Substances 0.000 claims 8
- 230000003647 oxidation Effects 0.000 claims 7
- 238000007254 oxidation reaction Methods 0.000 claims 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 6
- 229910052760 oxygen Inorganic materials 0.000 claims 6
- 239000001301 oxygen Substances 0.000 claims 6
- 239000000126 substance Substances 0.000 claims 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 5
- 150000002739 metals Chemical class 0.000 claims 5
- 229910000831 Steel Inorganic materials 0.000 claims 4
- 229910052782 aluminium Inorganic materials 0.000 claims 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 4
- 238000001816 cooling Methods 0.000 claims 4
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims 4
- 229910052759 nickel Inorganic materials 0.000 claims 4
- 229910052763 palladium Inorganic materials 0.000 claims 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 4
- 229910052709 silver Inorganic materials 0.000 claims 4
- 239000007787 solid Substances 0.000 claims 4
- 239000010959 steel Substances 0.000 claims 4
- 229910052725 zinc Inorganic materials 0.000 claims 4
- 239000011888 foil Substances 0.000 claims 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 229910052796 boron Inorganic materials 0.000 claims 2
- 239000011575 calcium Substances 0.000 claims 2
- 229940043430 calcium compound Drugs 0.000 claims 2
- 150000001674 calcium compounds Chemical group 0.000 claims 2
- 229910010293 ceramic material Inorganic materials 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 239000012535 impurity Substances 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- 229910052745 lead Inorganic materials 0.000 claims 2
- 229910052749 magnesium Inorganic materials 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 239000010944 silver (metal) Substances 0.000 claims 2
- 229910052712 strontium Inorganic materials 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- 239000011135 tin Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- 229910052727 yttrium Inorganic materials 0.000 claims 2
- 239000011701 zinc Substances 0.000 claims 2
- 229910052726 zirconium Inorganic materials 0.000 claims 2
- 229910052791 calcium Inorganic materials 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 230000007423 decrease Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000005304 joining Methods 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007019632 | 2007-04-24 | ||
| DE102007019632.8 | 2007-04-24 | ||
| PCT/EP2008/054630 WO2008128948A2 (de) | 2007-04-24 | 2008-04-17 | Bauteil mit einem metallisierten keramikkörper |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010524831A JP2010524831A (ja) | 2010-07-22 |
| JP2010524831A5 true JP2010524831A5 (https=) | 2013-09-12 |
| JP5538212B2 JP5538212B2 (ja) | 2014-07-02 |
Family
ID=39777665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010504633A Expired - Fee Related JP5538212B2 (ja) | 2007-04-24 | 2008-04-17 | メタライズされたセラミックボディを有するコンポーネント |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100147571A1 (https=) |
| EP (1) | EP2155628A2 (https=) |
| JP (1) | JP5538212B2 (https=) |
| KR (1) | KR101476343B1 (https=) |
| CN (1) | CN101687717A (https=) |
| DE (1) | DE102008001226A1 (https=) |
| WO (1) | WO2008128948A2 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2514181Y2 (ja) | 1990-12-26 | 1996-10-16 | トリニティ工業株式会社 | 押圧機 |
| DE102009025033A1 (de) | 2009-06-10 | 2010-12-16 | Behr Gmbh & Co. Kg | Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung |
| AU2013323472B2 (en) | 2012-09-28 | 2018-07-05 | Ellis KLINE | Glycosidase regimen for treatment of infectious disease |
| JP6307832B2 (ja) * | 2013-01-22 | 2018-04-11 | 三菱マテリアル株式会社 | パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール |
| JP6111764B2 (ja) * | 2013-03-18 | 2017-04-12 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
| JP5672324B2 (ja) | 2013-03-18 | 2015-02-18 | 三菱マテリアル株式会社 | 接合体の製造方法及びパワーモジュール用基板の製造方法 |
| JP5751357B1 (ja) * | 2014-02-03 | 2015-07-22 | トヨタ自動車株式会社 | セラミック部材および金属部材の接合構造 |
| DE102014107217A1 (de) * | 2014-05-19 | 2015-11-19 | Ceram Tec Gmbh | Leistungshalbleitermodul |
| WO2017220817A1 (de) * | 2016-06-24 | 2017-12-28 | Ceramtec Gmbh | Bauteile für steckverbinder |
| FR3054721B1 (fr) * | 2016-07-29 | 2018-12-07 | Safran | Module electronique de puissance d'un aeronef et procede de fabrication associe |
| DE102017122575B3 (de) * | 2017-09-28 | 2019-02-28 | Rogers Germany Gmbh | Kühlvorrichtung zum Kühlen eines elektrischen Bauteils und Verfahren zur Herstellung einer Kühlvorrichtung |
| CN114974990A (zh) * | 2021-02-25 | 2022-08-30 | 天津首瑞智能电气有限公司 | 一种电瓷质气密壳体及其制造方法、灭弧室、电的开关 |
| DE102021106952A1 (de) | 2021-03-22 | 2022-09-22 | Infineon Technologies Austria Ag | Dbc-substrat für leistungshalbleitervorrichtungen, verfahren zum herstellen eines dbc-substrats und leistungshalbleitervorrichtung mit dbc-substrat |
| EP4719030A1 (en) * | 2024-09-29 | 2026-04-01 | Shenzhen STS Microelectronics Co., Ltd. | Intra-cooling devices for power modules, methods for manufacturing same, power modules and electrical systems |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4072771A (en) * | 1975-11-28 | 1978-02-07 | Bala Electronics Corporation | Copper thick film conductor |
| US4182412A (en) * | 1978-01-09 | 1980-01-08 | Uop Inc. | Finned heat transfer tube with porous boiling surface and method for producing same |
| US4359086A (en) * | 1981-05-18 | 1982-11-16 | The Trane Company | Heat exchange surface with porous coating and subsurface cavities |
| EP0153737B1 (en) * | 1984-02-27 | 1993-07-28 | Kabushiki Kaisha Toshiba | Circuit substrate having high thermal conductivity |
| JPS62113783A (ja) * | 1985-11-13 | 1987-05-25 | 日本セメント株式会社 | 窒化けい素焼結体のメタライズ方法 |
| US5352482A (en) * | 1987-01-22 | 1994-10-04 | Ngk Spark Plug Co., Ltd. | Process for making a high heat-conductive, thick film multi-layered circuit board |
| US5418002A (en) * | 1990-12-24 | 1995-05-23 | Harris Corporation | Direct bonding of copper to aluminum nitride substrates |
| US5395679A (en) * | 1993-03-29 | 1995-03-07 | Delco Electronics Corp. | Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuits |
| US5545473A (en) * | 1994-02-14 | 1996-08-13 | W. L. Gore & Associates, Inc. | Thermally conductive interface |
| US6861290B1 (en) * | 1995-12-19 | 2005-03-01 | Micron Technology, Inc. | Flip-chip adaptor package for bare die |
| DE19603822C2 (de) * | 1996-02-02 | 1998-10-29 | Curamik Electronics Gmbh | Verfahren zur Herstellung eines Keramik-Substrat sowie Keramik-Substrat |
| US5981085A (en) * | 1996-03-21 | 1999-11-09 | The Furukawa Electric Co., Inc. | Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same |
| JPH10284808A (ja) * | 1997-04-08 | 1998-10-23 | Denki Kagaku Kogyo Kk | 回路基板 |
| JP2000281460A (ja) * | 1999-03-31 | 2000-10-10 | Tokuyama Corp | 金属粉末ろう材および窒化アルミニウム部材と金属部材との接合方法 |
| MXPA03006498A (es) * | 2001-01-22 | 2003-10-15 | Parker Hannifin Corp | Entrecara termica de cambio de fase, de liberacion limpia. |
| JP3931855B2 (ja) * | 2003-08-08 | 2007-06-20 | 株式会社日立製作所 | 電子回路装置 |
| DE102004033933B4 (de) * | 2004-07-08 | 2009-11-05 | Electrovac Ag | Verfahren zum Herstellen eines Metall-Keramik-Substrates |
| US7332807B2 (en) * | 2005-12-30 | 2008-02-19 | Intel Corporation | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same |
| TWI449137B (zh) * | 2006-03-23 | 2014-08-11 | 製陶技術創新製陶工程股份公司 | 構件或電路用的攜帶體 |
-
2008
- 2008-04-17 CN CN200880021667A patent/CN101687717A/zh active Pending
- 2008-04-17 US US12/596,875 patent/US20100147571A1/en not_active Abandoned
- 2008-04-17 KR KR1020097024483A patent/KR101476343B1/ko not_active Expired - Fee Related
- 2008-04-17 EP EP08736302A patent/EP2155628A2/de not_active Ceased
- 2008-04-17 WO PCT/EP2008/054630 patent/WO2008128948A2/de not_active Ceased
- 2008-04-17 DE DE102008001226A patent/DE102008001226A1/de not_active Withdrawn
- 2008-04-17 JP JP2010504633A patent/JP5538212B2/ja not_active Expired - Fee Related
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