DE102008001226A1 - Bauteil mit einem metallisierten Keramikkörper - Google Patents

Bauteil mit einem metallisierten Keramikkörper Download PDF

Info

Publication number
DE102008001226A1
DE102008001226A1 DE102008001226A DE102008001226A DE102008001226A1 DE 102008001226 A1 DE102008001226 A1 DE 102008001226A1 DE 102008001226 A DE102008001226 A DE 102008001226A DE 102008001226 A DE102008001226 A DE 102008001226A DE 102008001226 A1 DE102008001226 A1 DE 102008001226A1
Authority
DE
Germany
Prior art keywords
layer
ceramic body
copper
metallization
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102008001226A
Other languages
German (de)
English (en)
Inventor
Claus Peter Dr. Kluge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramtec GmbH
Original Assignee
Ceramtec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec GmbH filed Critical Ceramtec GmbH
Priority to DE102008001226A priority Critical patent/DE102008001226A1/de
Publication of DE102008001226A1 publication Critical patent/DE102008001226A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/005—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of glass or ceramic material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/025—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of glass or ceramic material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • C04B41/90—Coating or impregnation for obtaining at least two superposed coatings having different compositions at least one coating being a metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/06—Oxidic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/06—Oxidic interlayers
    • C04B2237/064—Oxidic interlayers based on alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/121—Metallic interlayers based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/123—Metallic interlayers based on iron group metals, e.g. steel
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/124—Metallic interlayers based on copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Products (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
DE102008001226A 2007-04-24 2008-04-17 Bauteil mit einem metallisierten Keramikkörper Withdrawn DE102008001226A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102008001226A DE102008001226A1 (de) 2007-04-24 2008-04-17 Bauteil mit einem metallisierten Keramikkörper

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007019632 2007-04-24
DE102007019632.8 2007-04-24
DE102008001226A DE102008001226A1 (de) 2007-04-24 2008-04-17 Bauteil mit einem metallisierten Keramikkörper

Publications (1)

Publication Number Publication Date
DE102008001226A1 true DE102008001226A1 (de) 2008-10-30

Family

ID=39777665

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008001226A Withdrawn DE102008001226A1 (de) 2007-04-24 2008-04-17 Bauteil mit einem metallisierten Keramikkörper

Country Status (7)

Country Link
US (1) US20100147571A1 (https=)
EP (1) EP2155628A2 (https=)
JP (1) JP5538212B2 (https=)
KR (1) KR101476343B1 (https=)
CN (1) CN101687717A (https=)
DE (1) DE102008001226A1 (https=)
WO (1) WO2008128948A2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009025033A1 (de) 2009-06-10 2010-12-16 Behr Gmbh & Co. Kg Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung
EP2947687A3 (de) * 2014-05-19 2015-12-16 Powersem GmbH Leistungshalbleitermodul
WO2017220817A1 (de) * 2016-06-24 2017-12-28 Ceramtec Gmbh Bauteile für steckverbinder
DE102021106952A1 (de) 2021-03-22 2022-09-22 Infineon Technologies Austria Ag Dbc-substrat für leistungshalbleitervorrichtungen, verfahren zum herstellen eines dbc-substrats und leistungshalbleitervorrichtung mit dbc-substrat

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2514181Y2 (ja) 1990-12-26 1996-10-16 トリニティ工業株式会社 押圧機
AU2013323472B2 (en) 2012-09-28 2018-07-05 Ellis KLINE Glycosidase regimen for treatment of infectious disease
JP6307832B2 (ja) * 2013-01-22 2018-04-11 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール
JP6111764B2 (ja) * 2013-03-18 2017-04-12 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
JP5672324B2 (ja) 2013-03-18 2015-02-18 三菱マテリアル株式会社 接合体の製造方法及びパワーモジュール用基板の製造方法
JP5751357B1 (ja) * 2014-02-03 2015-07-22 トヨタ自動車株式会社 セラミック部材および金属部材の接合構造
FR3054721B1 (fr) * 2016-07-29 2018-12-07 Safran Module electronique de puissance d'un aeronef et procede de fabrication associe
DE102017122575B3 (de) * 2017-09-28 2019-02-28 Rogers Germany Gmbh Kühlvorrichtung zum Kühlen eines elektrischen Bauteils und Verfahren zur Herstellung einer Kühlvorrichtung
CN114974990A (zh) * 2021-02-25 2022-08-30 天津首瑞智能电气有限公司 一种电瓷质气密壳体及其制造方法、灭弧室、电的开关
EP4719030A1 (en) * 2024-09-29 2026-04-01 Shenzhen STS Microelectronics Co., Ltd. Intra-cooling devices for power modules, methods for manufacturing same, power modules and electrical systems

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19603822C2 (de) 1996-02-02 1998-10-29 Curamik Electronics Gmbh Verfahren zur Herstellung eines Keramik-Substrat sowie Keramik-Substrat

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4072771A (en) * 1975-11-28 1978-02-07 Bala Electronics Corporation Copper thick film conductor
US4182412A (en) * 1978-01-09 1980-01-08 Uop Inc. Finned heat transfer tube with porous boiling surface and method for producing same
US4359086A (en) * 1981-05-18 1982-11-16 The Trane Company Heat exchange surface with porous coating and subsurface cavities
EP0153737B1 (en) * 1984-02-27 1993-07-28 Kabushiki Kaisha Toshiba Circuit substrate having high thermal conductivity
JPS62113783A (ja) * 1985-11-13 1987-05-25 日本セメント株式会社 窒化けい素焼結体のメタライズ方法
US5352482A (en) * 1987-01-22 1994-10-04 Ngk Spark Plug Co., Ltd. Process for making a high heat-conductive, thick film multi-layered circuit board
US5418002A (en) * 1990-12-24 1995-05-23 Harris Corporation Direct bonding of copper to aluminum nitride substrates
US5395679A (en) * 1993-03-29 1995-03-07 Delco Electronics Corp. Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuits
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US6861290B1 (en) * 1995-12-19 2005-03-01 Micron Technology, Inc. Flip-chip adaptor package for bare die
US5981085A (en) * 1996-03-21 1999-11-09 The Furukawa Electric Co., Inc. Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same
JPH10284808A (ja) * 1997-04-08 1998-10-23 Denki Kagaku Kogyo Kk 回路基板
JP2000281460A (ja) * 1999-03-31 2000-10-10 Tokuyama Corp 金属粉末ろう材および窒化アルミニウム部材と金属部材との接合方法
MXPA03006498A (es) * 2001-01-22 2003-10-15 Parker Hannifin Corp Entrecara termica de cambio de fase, de liberacion limpia.
JP3931855B2 (ja) * 2003-08-08 2007-06-20 株式会社日立製作所 電子回路装置
DE102004033933B4 (de) * 2004-07-08 2009-11-05 Electrovac Ag Verfahren zum Herstellen eines Metall-Keramik-Substrates
US7332807B2 (en) * 2005-12-30 2008-02-19 Intel Corporation Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
TWI449137B (zh) * 2006-03-23 2014-08-11 製陶技術創新製陶工程股份公司 構件或電路用的攜帶體

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19603822C2 (de) 1996-02-02 1998-10-29 Curamik Electronics Gmbh Verfahren zur Herstellung eines Keramik-Substrat sowie Keramik-Substrat

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009025033A1 (de) 2009-06-10 2010-12-16 Behr Gmbh & Co. Kg Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung
EP2947687A3 (de) * 2014-05-19 2015-12-16 Powersem GmbH Leistungshalbleitermodul
WO2017220817A1 (de) * 2016-06-24 2017-12-28 Ceramtec Gmbh Bauteile für steckverbinder
DE102021106952A1 (de) 2021-03-22 2022-09-22 Infineon Technologies Austria Ag Dbc-substrat für leistungshalbleitervorrichtungen, verfahren zum herstellen eines dbc-substrats und leistungshalbleitervorrichtung mit dbc-substrat
US12119284B2 (en) 2021-03-22 2024-10-15 Infineon Technologies Austria Ag DBC substrate for power semiconductor devices, method for fabricating a DBC substrate and power semiconductor device having a DBC substrate

Also Published As

Publication number Publication date
KR101476343B1 (ko) 2014-12-24
WO2008128948A2 (de) 2008-10-30
JP5538212B2 (ja) 2014-07-02
KR20100017327A (ko) 2010-02-16
EP2155628A2 (de) 2010-02-24
CN101687717A (zh) 2010-03-31
JP2010524831A (ja) 2010-07-22
WO2008128948A3 (de) 2009-05-14
US20100147571A1 (en) 2010-06-17

Similar Documents

Publication Publication Date Title
DE102008001226A1 (de) Bauteil mit einem metallisierten Keramikkörper
DE102008001220A1 (de) Bauteil mit einem Keramikkörper, dessen Oberfläche metallisiert ist
DE102010049499A1 (de) Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines solchen Substrates
EP2449586A2 (de) Elektronische vorrichtung
EP1989741A2 (de) Verfahren zum herstellen von peltier-modulen sowie peltier-modul
EP4021869B1 (de) Verfahren zur herstellung eines metall-keramik-substrats und metall-keramik-substrat, hergestellt mit einem solchen verfahren
DE102008001221A1 (de) Bauteil mit einem keramischen Körper mit metallisierter Oberfläche
DE102009015520A1 (de) Metall-Keramik-Substrat
DE112017000426T5 (de) Leistungshalbleitervorrichtung und verfahren zum herstellen einer leistungshalbleitervorrichtung
DE102013113736A1 (de) Verfahren zum Herstellen eines Metall-Keramik-Substrates sowie Metall-Keramik-Substrat
DE102005042554B4 (de) Metall-Keramik-Substrat und Verfahren zur Herstellung eines Metall-Keramik-Substrats
WO2021122036A1 (de) Lotmaterial, verfahren zur herstellung eines solchen lotmaterials und verwendung eines solchen lotmaterials zur anbindung einer metallschicht an eine keramikschicht
DE102008001224A1 (de) Verfahren zur Herstellung eines metallisierten Bauteils, Bauteil sowie einen Träger zur Auflage des Bauteils bei der Metallisierung
EP4047648A1 (de) Leistungsmodul mit einem mittels sintern und löten mit einem substrat verbundenen leistungs-bauelement und entsprechendes herstellungsverfahren
EP4237390B1 (de) Kupfer-keramik-substrat
DE102012216546A1 (de) Halbleiterchip, verfahren zur herstellung eines halbleiterchips und verfahren zum verlöten eines halbleiterchips mit einem träger
EP0170012A2 (de) Metall-Keramik-Verbundelement und Verfahren zu dessen Herstellung
EP2928844B1 (de) Verfahren zur herstellung von substraten für halbleiterbauelemente
EP1129048A1 (de) Kompositplatte sowie verfahren zur herstellung und anwendung einer solchen kompositplatte
EP2287899A1 (de) Lötverbindung mit einer mehrschichtigen lötbaren Schicht
DE102006011743A1 (de) Verfahren zum Herstellen von Peltier-Modulen sowie Peltier-Modul
DE102014114132B4 (de) Metall-Keramik-Substrat und Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102020111697A1 (de) Trägersubstrat und Verfahren zur Herstellung eines Trägersubstrats
DE102006060899A1 (de) Anschlussdraht, Verfahren zur Herstellung eines solchen und Baugruppe
JPS6360537A (ja) 金属積層体及びその製造方法

Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: CERAMTEC GMBH, 73207 PLOCHINGEN, DE

R081 Change of applicant/patentee

Owner name: CERAMTEC GMBH, DE

Free format text: FORMER OWNER: CERAMTEC AG, 73207 PLOCHINGEN, DE

Effective date: 20110216

R012 Request for examination validly filed
R012 Request for examination validly filed

Effective date: 20150326

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
R016 Response to examination communication