JPWO2021192916A5 - - Google Patents

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JPWO2021192916A5
JPWO2021192916A5 JP2022509488A JP2022509488A JPWO2021192916A5 JP WO2021192916 A5 JPWO2021192916 A5 JP WO2021192916A5 JP 2022509488 A JP2022509488 A JP 2022509488A JP 2022509488 A JP2022509488 A JP 2022509488A JP WO2021192916 A5 JPWO2021192916 A5 JP WO2021192916A5
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JP7672390B2 (ja
JPWO2021192916A1 (https=
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JP2022509488A 2020-03-24 2021-03-05 複合材料、及び放熱部材 Active JP7672390B2 (ja)

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Application Number Priority Date Filing Date Title
JP2020053219 2020-03-24
JP2020053219 2020-03-24
PCT/JP2021/008634 WO2021192916A1 (ja) 2020-03-24 2021-03-05 複合材料、及び放熱部材

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JPWO2021192916A1 JPWO2021192916A1 (https=) 2021-09-30
JPWO2021192916A5 true JPWO2021192916A5 (https=) 2022-11-30
JP7672390B2 JP7672390B2 (ja) 2025-05-07

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JP2022509488A Active JP7672390B2 (ja) 2020-03-24 2021-03-05 複合材料、及び放熱部材

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US (1) US20230126268A1 (https=)
EP (1) EP4130309A1 (https=)
JP (1) JP7672390B2 (https=)
KR (1) KR20220152386A (https=)
CN (1) CN115427599A (https=)
WO (1) WO2021192916A1 (https=)

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Publication number Priority date Publication date Assignee Title
US12351753B2 (en) * 2018-02-21 2025-07-08 Sumitomo Electric Industries, Ltd. Composite material and composite material manufacturing method

Family Cites Families (26)

* Cited by examiner, † Cited by third party
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AT245269B (de) * 1962-11-20 1966-02-25 Plansee Metallwerk Hochtemperatur-Werkstoff
JP3617232B2 (ja) * 1997-02-06 2005-02-02 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法ならびにそれを用いた半導体パッケージ
JP3893681B2 (ja) * 1997-08-19 2007-03-14 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法
JP2002080280A (ja) * 2000-06-23 2002-03-19 Sumitomo Electric Ind Ltd 高熱伝導性複合材料及びその製造方法
JP2003201528A (ja) * 2001-10-26 2003-07-18 Ngk Insulators Ltd ヒートシンク材
EP1452614B1 (en) * 2001-11-09 2017-12-27 Sumitomo Electric Industries, Ltd. Sintered diamond having high thermal conductivity
JP2004197153A (ja) * 2002-12-18 2004-07-15 Allied Material Corp ダイヤモンド−金属複合材料およびその製造方法
AT7522U1 (de) * 2004-04-29 2005-04-25 Plansee Ag Wärmesenke aus borhaltigem diamant-kupfer-verbundwerkstoff
AT7492U1 (de) * 2004-06-01 2005-04-25 Ceratizit Austria Gmbh Verschleissteil aus einem diamanthaltigen verbundwerkstoff
WO2007053571A2 (en) * 2005-11-01 2007-05-10 Techfilm, Llc Thermal interface material with multiple size distribution thermally conductive fillers
JP2008066379A (ja) * 2006-09-05 2008-03-21 Sumitomo Electric Ind Ltd 複合材料
GB0810542D0 (en) * 2008-06-09 2008-07-16 Element Six Production Pty Ltd Cubic boron nitride compact
WO2010038483A1 (ja) * 2008-10-03 2010-04-08 住友電気工業株式会社 複合部材
CN101831584A (zh) * 2009-03-10 2010-09-15 北京有色金属研究总院 高导热铜基复合材料及其制备方法
CN101985702B (zh) * 2010-06-29 2013-02-06 北京科技大学 一种超高导热、低热膨胀系数金刚石复合材料及制备方法
JP2013144763A (ja) * 2012-01-16 2013-07-25 Shin-Etsu Chemical Co Ltd 半導体封止用熱硬化性樹脂組成物及び該組成物で封止された半導体装置
WO2016029162A1 (en) * 2014-08-21 2016-02-25 Materion Corporation Composite articles comprising spinodal copper-nickel-tin-manganese-phosphorus alloy matrix material
CN110656259A (zh) * 2014-09-02 2020-01-07 联合材料公司 金刚石复合材料和散热部件
KR101611435B1 (ko) 2014-09-24 2016-04-12 경일산업 주식회사 태양전지 패널용 정션박스
EP3227399B1 (en) * 2014-12-05 2021-07-14 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
EP3369831A4 (en) * 2015-10-30 2019-06-05 Sumitomo Electric Industries, Ltd. SINTERING PART AND METHOD FOR THE PRODUCTION THEREOF
JP6257575B2 (ja) * 2015-11-25 2018-01-10 株式会社アライドマテリアル 半導体パッケージ、及び半導体装置
CN105624505B (zh) * 2015-12-25 2017-09-22 富耐克超硬材料股份有限公司 一种金属基超硬复合材料及其制备方法
US12351753B2 (en) * 2018-02-21 2025-07-08 Sumitomo Electric Industries, Ltd. Composite material and composite material manufacturing method
JP7089383B2 (ja) 2018-03-20 2022-06-22 ミネベアミツミ株式会社 送風機
JP7188957B2 (ja) 2018-09-26 2022-12-13 古河機械金属株式会社 硫化物系無機固体電解質材料、固体電解質、固体電解質膜およびリチウムイオン電池

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