JPWO2021192916A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2021192916A5 JPWO2021192916A5 JP2022509488A JP2022509488A JPWO2021192916A5 JP WO2021192916 A5 JPWO2021192916 A5 JP WO2021192916A5 JP 2022509488 A JP2022509488 A JP 2022509488A JP 2022509488 A JP2022509488 A JP 2022509488A JP WO2021192916 A5 JPWO2021192916 A5 JP WO2021192916A5
- Authority
- JP
- Japan
- Prior art keywords
- atomic
- sample
- content
- less
- test example
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020053219 | 2020-03-24 | ||
| JP2020053219 | 2020-03-24 | ||
| PCT/JP2021/008634 WO2021192916A1 (ja) | 2020-03-24 | 2021-03-05 | 複合材料、及び放熱部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021192916A1 JPWO2021192916A1 (https=) | 2021-09-30 |
| JPWO2021192916A5 true JPWO2021192916A5 (https=) | 2022-11-30 |
| JP7672390B2 JP7672390B2 (ja) | 2025-05-07 |
Family
ID=77891318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022509488A Active JP7672390B2 (ja) | 2020-03-24 | 2021-03-05 | 複合材料、及び放熱部材 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230126268A1 (https=) |
| EP (1) | EP4130309A1 (https=) |
| JP (1) | JP7672390B2 (https=) |
| KR (1) | KR20220152386A (https=) |
| CN (1) | CN115427599A (https=) |
| WO (1) | WO2021192916A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12351753B2 (en) * | 2018-02-21 | 2025-07-08 | Sumitomo Electric Industries, Ltd. | Composite material and composite material manufacturing method |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT245269B (de) * | 1962-11-20 | 1966-02-25 | Plansee Metallwerk | Hochtemperatur-Werkstoff |
| JP3617232B2 (ja) * | 1997-02-06 | 2005-02-02 | 住友電気工業株式会社 | 半導体用ヒートシンクおよびその製造方法ならびにそれを用いた半導体パッケージ |
| JP3893681B2 (ja) * | 1997-08-19 | 2007-03-14 | 住友電気工業株式会社 | 半導体用ヒートシンクおよびその製造方法 |
| JP2002080280A (ja) * | 2000-06-23 | 2002-03-19 | Sumitomo Electric Ind Ltd | 高熱伝導性複合材料及びその製造方法 |
| JP2003201528A (ja) * | 2001-10-26 | 2003-07-18 | Ngk Insulators Ltd | ヒートシンク材 |
| EP1452614B1 (en) * | 2001-11-09 | 2017-12-27 | Sumitomo Electric Industries, Ltd. | Sintered diamond having high thermal conductivity |
| JP2004197153A (ja) * | 2002-12-18 | 2004-07-15 | Allied Material Corp | ダイヤモンド−金属複合材料およびその製造方法 |
| AT7522U1 (de) * | 2004-04-29 | 2005-04-25 | Plansee Ag | Wärmesenke aus borhaltigem diamant-kupfer-verbundwerkstoff |
| AT7492U1 (de) * | 2004-06-01 | 2005-04-25 | Ceratizit Austria Gmbh | Verschleissteil aus einem diamanthaltigen verbundwerkstoff |
| WO2007053571A2 (en) * | 2005-11-01 | 2007-05-10 | Techfilm, Llc | Thermal interface material with multiple size distribution thermally conductive fillers |
| JP2008066379A (ja) * | 2006-09-05 | 2008-03-21 | Sumitomo Electric Ind Ltd | 複合材料 |
| GB0810542D0 (en) * | 2008-06-09 | 2008-07-16 | Element Six Production Pty Ltd | Cubic boron nitride compact |
| WO2010038483A1 (ja) * | 2008-10-03 | 2010-04-08 | 住友電気工業株式会社 | 複合部材 |
| CN101831584A (zh) * | 2009-03-10 | 2010-09-15 | 北京有色金属研究总院 | 高导热铜基复合材料及其制备方法 |
| CN101985702B (zh) * | 2010-06-29 | 2013-02-06 | 北京科技大学 | 一种超高导热、低热膨胀系数金刚石复合材料及制备方法 |
| JP2013144763A (ja) * | 2012-01-16 | 2013-07-25 | Shin-Etsu Chemical Co Ltd | 半導体封止用熱硬化性樹脂組成物及び該組成物で封止された半導体装置 |
| WO2016029162A1 (en) * | 2014-08-21 | 2016-02-25 | Materion Corporation | Composite articles comprising spinodal copper-nickel-tin-manganese-phosphorus alloy matrix material |
| CN110656259A (zh) * | 2014-09-02 | 2020-01-07 | 联合材料公司 | 金刚石复合材料和散热部件 |
| KR101611435B1 (ko) | 2014-09-24 | 2016-04-12 | 경일산업 주식회사 | 태양전지 패널용 정션박스 |
| EP3227399B1 (en) * | 2014-12-05 | 2021-07-14 | Honeywell International Inc. | High performance thermal interface materials with low thermal impedance |
| EP3369831A4 (en) * | 2015-10-30 | 2019-06-05 | Sumitomo Electric Industries, Ltd. | SINTERING PART AND METHOD FOR THE PRODUCTION THEREOF |
| JP6257575B2 (ja) * | 2015-11-25 | 2018-01-10 | 株式会社アライドマテリアル | 半導体パッケージ、及び半導体装置 |
| CN105624505B (zh) * | 2015-12-25 | 2017-09-22 | 富耐克超硬材料股份有限公司 | 一种金属基超硬复合材料及其制备方法 |
| US12351753B2 (en) * | 2018-02-21 | 2025-07-08 | Sumitomo Electric Industries, Ltd. | Composite material and composite material manufacturing method |
| JP7089383B2 (ja) | 2018-03-20 | 2022-06-22 | ミネベアミツミ株式会社 | 送風機 |
| JP7188957B2 (ja) | 2018-09-26 | 2022-12-13 | 古河機械金属株式会社 | 硫化物系無機固体電解質材料、固体電解質、固体電解質膜およびリチウムイオン電池 |
-
2021
- 2021-03-05 EP EP21775180.9A patent/EP4130309A1/en not_active Withdrawn
- 2021-03-05 US US17/912,508 patent/US20230126268A1/en not_active Abandoned
- 2021-03-05 CN CN202180024227.8A patent/CN115427599A/zh active Pending
- 2021-03-05 WO PCT/JP2021/008634 patent/WO2021192916A1/ja not_active Ceased
- 2021-03-05 KR KR1020227032447A patent/KR20220152386A/ko not_active Withdrawn
- 2021-03-05 JP JP2022509488A patent/JP7672390B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Bai et al. | Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix | |
| Zhang et al. | Preparation of graphene nanoplatelets-copper composites by a modified semi-powder method and their mechanical properties | |
| JP2006519928A5 (https=) | ||
| Jiang et al. | Copper–graphite–copper sandwich: superior heat spreader with excellent heat-dissipation ability and good weldability | |
| TW200902737A (en) | Brittle metal alloy sputtering targets and method of fabricating same | |
| CN106795596A (zh) | 金刚石复合材料和散热部件 | |
| JPS59134665A (ja) | 立方窒化ホウ素コンパクトの結合方法 | |
| Nguyen et al. | Enhancement of thermoelectric properties of bismuth telluride composite with gold nano-particles inclusions using electrochemical co-deposition | |
| JP2010531742A5 (https=) | ||
| JPWO2021192916A5 (https=) | ||
| Kotadia et al. | Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction | |
| Nguyen et al. | Diffusion bonding at the interface of Bi2Te3 thermoelectric modules | |
| JP2008044009A (ja) | 熱膨張係数が異なる部材の接合方法 | |
| JP2005517626A (ja) | 被覆済みダイヤモンド粒子 | |
| JP2019104021A (ja) | クラッド材およびその製造方法 | |
| US10315387B2 (en) | High content PCBN compact including W—Re binder | |
| JPS6053721B2 (ja) | 切削工具用複合焼結部材 | |
| Mouez | Fabrication and characterization copper/diamond composites for heat sink application using powder metallurgy | |
| JP7350058B2 (ja) | 複合材料 | |
| JP2007105795A (ja) | WC−Coをチタン合金にろう付けするための金/ニッケル/銅/チタンろう合金 | |
| JP7672390B2 (ja) | 複合材料、及び放熱部材 | |
| JP4772611B2 (ja) | 熱膨張係数が異なる部材の接合方法 | |
| TW201829799A (zh) | 適於積層製程的硬質合金 | |
| Yamakami et al. | Solid-state reactive diffusion between sn and electroless Ni–P at 473 K | |
| JP2020117742A5 (https=) |