CN115427599A - 复合材料以及散热构件 - Google Patents

复合材料以及散热构件 Download PDF

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Publication number
CN115427599A
CN115427599A CN202180024227.8A CN202180024227A CN115427599A CN 115427599 A CN115427599 A CN 115427599A CN 202180024227 A CN202180024227 A CN 202180024227A CN 115427599 A CN115427599 A CN 115427599A
Authority
CN
China
Prior art keywords
composite material
particles
atomic
metal phase
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180024227.8A
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English (en)
Chinese (zh)
Inventor
松仪亮太
岩山功
西水贵洋
曾田智惠子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ALMT Corp
Sumitomo Electric Industries Ltd
Original Assignee
ALMT Corp
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ALMT Corp, Sumitomo Electric Industries Ltd filed Critical ALMT Corp
Publication of CN115427599A publication Critical patent/CN115427599A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
    • C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Ceramic Engineering (AREA)
CN202180024227.8A 2020-03-24 2021-03-05 复合材料以及散热构件 Pending CN115427599A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020053219 2020-03-24
JP2020-053219 2020-03-24
PCT/JP2021/008634 WO2021192916A1 (ja) 2020-03-24 2021-03-05 複合材料、及び放熱部材

Publications (1)

Publication Number Publication Date
CN115427599A true CN115427599A (zh) 2022-12-02

Family

ID=77891318

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180024227.8A Pending CN115427599A (zh) 2020-03-24 2021-03-05 复合材料以及散热构件

Country Status (6)

Country Link
US (1) US20230126268A1 (https=)
EP (1) EP4130309A1 (https=)
JP (1) JP7672390B2 (https=)
KR (1) KR20220152386A (https=)
CN (1) CN115427599A (https=)
WO (1) WO2021192916A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12351753B2 (en) * 2018-02-21 2025-07-08 Sumitomo Electric Industries, Ltd. Composite material and composite material manufacturing method

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1200724B (de) * 1962-11-20 1965-09-09 Plansee Metallwerk Hochtemperatur-Werkstoff
JPH1167991A (ja) * 1997-08-19 1999-03-09 Sumitomo Electric Ind Ltd 半導体用ヒートシンクおよびその製造方法
GB0224893D0 (en) * 2001-10-26 2002-12-04 Ngk Insulators Ltd Heat sink material
JP2004197153A (ja) * 2002-12-18 2004-07-15 Allied Material Corp ダイヤモンド−金属複合材料およびその製造方法
CN1961090A (zh) * 2004-06-01 2007-05-09 森拉天时奥地利有限公司 含金刚石的复合材料组成的磨损件
JP2008066379A (ja) * 2006-09-05 2008-03-21 Sumitomo Electric Ind Ltd 複合材料
WO2009150601A1 (en) * 2008-06-09 2009-12-17 Element Six (Production) (Pty) Ltd Cubic boron nitride compact
CN101831584A (zh) * 2009-03-10 2010-09-15 北京有色金属研究总院 高导热铜基复合材料及其制备方法
CN101985702A (zh) * 2010-06-29 2011-03-16 北京科技大学 一种超高导热、低热膨胀系数金刚石复合材料及制备方法
CN102170986A (zh) * 2008-10-03 2011-08-31 住友电气工业株式会社 复合构件
US20160053349A1 (en) * 2014-08-21 2016-02-25 Materion Corporation Composite articles comprising spinodal copper-nickel-tin-manganese-phosphorus alloy matrix material
CN105624505A (zh) * 2015-12-25 2016-06-01 富耐克超硬材料股份有限公司 一种金属基超硬复合材料及其制备方法
CN108350529A (zh) * 2015-10-30 2018-07-31 住友电气工业株式会社 烧结材料及其制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3617232B2 (ja) * 1997-02-06 2005-02-02 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法ならびにそれを用いた半導体パッケージ
JP2002080280A (ja) * 2000-06-23 2002-03-19 Sumitomo Electric Ind Ltd 高熱伝導性複合材料及びその製造方法
EP1452614B1 (en) * 2001-11-09 2017-12-27 Sumitomo Electric Industries, Ltd. Sintered diamond having high thermal conductivity
AT7522U1 (de) * 2004-04-29 2005-04-25 Plansee Ag Wärmesenke aus borhaltigem diamant-kupfer-verbundwerkstoff
WO2007053571A2 (en) * 2005-11-01 2007-05-10 Techfilm, Llc Thermal interface material with multiple size distribution thermally conductive fillers
JP2013144763A (ja) * 2012-01-16 2013-07-25 Shin-Etsu Chemical Co Ltd 半導体封止用熱硬化性樹脂組成物及び該組成物で封止された半導体装置
CN110656259A (zh) * 2014-09-02 2020-01-07 联合材料公司 金刚石复合材料和散热部件
KR101611435B1 (ko) 2014-09-24 2016-04-12 경일산업 주식회사 태양전지 패널용 정션박스
EP3227399B1 (en) * 2014-12-05 2021-07-14 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
JP6257575B2 (ja) * 2015-11-25 2018-01-10 株式会社アライドマテリアル 半導体パッケージ、及び半導体装置
US12351753B2 (en) * 2018-02-21 2025-07-08 Sumitomo Electric Industries, Ltd. Composite material and composite material manufacturing method
JP7089383B2 (ja) 2018-03-20 2022-06-22 ミネベアミツミ株式会社 送風機
JP7188957B2 (ja) 2018-09-26 2022-12-13 古河機械金属株式会社 硫化物系無機固体電解質材料、固体電解質、固体電解質膜およびリチウムイオン電池

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1200724B (de) * 1962-11-20 1965-09-09 Plansee Metallwerk Hochtemperatur-Werkstoff
JPH1167991A (ja) * 1997-08-19 1999-03-09 Sumitomo Electric Ind Ltd 半導体用ヒートシンクおよびその製造方法
GB0224893D0 (en) * 2001-10-26 2002-12-04 Ngk Insulators Ltd Heat sink material
JP2004197153A (ja) * 2002-12-18 2004-07-15 Allied Material Corp ダイヤモンド−金属複合材料およびその製造方法
CN1961090A (zh) * 2004-06-01 2007-05-09 森拉天时奥地利有限公司 含金刚石的复合材料组成的磨损件
JP2008066379A (ja) * 2006-09-05 2008-03-21 Sumitomo Electric Ind Ltd 複合材料
WO2009150601A1 (en) * 2008-06-09 2009-12-17 Element Six (Production) (Pty) Ltd Cubic boron nitride compact
CN102170986A (zh) * 2008-10-03 2011-08-31 住友电气工业株式会社 复合构件
CN101831584A (zh) * 2009-03-10 2010-09-15 北京有色金属研究总院 高导热铜基复合材料及其制备方法
CN101985702A (zh) * 2010-06-29 2011-03-16 北京科技大学 一种超高导热、低热膨胀系数金刚石复合材料及制备方法
US20160053349A1 (en) * 2014-08-21 2016-02-25 Materion Corporation Composite articles comprising spinodal copper-nickel-tin-manganese-phosphorus alloy matrix material
CN108350529A (zh) * 2015-10-30 2018-07-31 住友电气工业株式会社 烧结材料及其制造方法
CN105624505A (zh) * 2015-12-25 2016-06-01 富耐克超硬材料股份有限公司 一种金属基超硬复合材料及其制备方法

Also Published As

Publication number Publication date
KR20220152386A (ko) 2022-11-15
JP7672390B2 (ja) 2025-05-07
JPWO2021192916A1 (https=) 2021-09-30
US20230126268A1 (en) 2023-04-27
EP4130309A1 (en) 2023-02-08
WO2021192916A1 (ja) 2021-09-30

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