JPWO2021192916A1 - - Google Patents

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Publication number
JPWO2021192916A1
JPWO2021192916A1 JP2022509488A JP2022509488A JPWO2021192916A1 JP WO2021192916 A1 JPWO2021192916 A1 JP WO2021192916A1 JP 2022509488 A JP2022509488 A JP 2022509488A JP 2022509488 A JP2022509488 A JP 2022509488A JP WO2021192916 A1 JPWO2021192916 A1 JP WO2021192916A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022509488A
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Japanese (ja)
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JP7672390B2 (ja
JPWO2021192916A5 (https=
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Publication of JPWO2021192916A1 publication Critical patent/JPWO2021192916A1/ja
Publication of JPWO2021192916A5 publication Critical patent/JPWO2021192916A5/ja
Application granted granted Critical
Publication of JP7672390B2 publication Critical patent/JP7672390B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
    • C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Ceramic Engineering (AREA)
JP2022509488A 2020-03-24 2021-03-05 複合材料、及び放熱部材 Active JP7672390B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020053219 2020-03-24
JP2020053219 2020-03-24
PCT/JP2021/008634 WO2021192916A1 (ja) 2020-03-24 2021-03-05 複合材料、及び放熱部材

Publications (3)

Publication Number Publication Date
JPWO2021192916A1 true JPWO2021192916A1 (https=) 2021-09-30
JPWO2021192916A5 JPWO2021192916A5 (https=) 2022-11-30
JP7672390B2 JP7672390B2 (ja) 2025-05-07

Family

ID=77891318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022509488A Active JP7672390B2 (ja) 2020-03-24 2021-03-05 複合材料、及び放熱部材

Country Status (6)

Country Link
US (1) US20230126268A1 (https=)
EP (1) EP4130309A1 (https=)
JP (1) JP7672390B2 (https=)
KR (1) KR20220152386A (https=)
CN (1) CN115427599A (https=)
WO (1) WO2021192916A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12351753B2 (en) * 2018-02-21 2025-07-08 Sumitomo Electric Industries, Ltd. Composite material and composite material manufacturing method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167991A (ja) * 1997-08-19 1999-03-09 Sumitomo Electric Ind Ltd 半導体用ヒートシンクおよびその製造方法
WO2003040420A1 (fr) * 2001-11-09 2003-05-15 Sumitomo Electric Industries, Ltd. Diamant fritte presentant une conductivite thermique elevee et procede de production d'un tel diamant et puits thermique utilisant un tel diamant
JP2004197153A (ja) * 2002-12-18 2004-07-15 Allied Material Corp ダイヤモンド−金属複合材料およびその製造方法
JP2007535151A (ja) * 2004-04-29 2007-11-29 プランゼー エスエー ホウ素を含むダイヤモンドと銅複合材料から成るヒートシンク
JP2017095766A (ja) * 2015-11-25 2017-06-01 株式会社アライドマテリアル 半導体パッケージ、及び半導体装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT245269B (de) * 1962-11-20 1966-02-25 Plansee Metallwerk Hochtemperatur-Werkstoff
JP3617232B2 (ja) * 1997-02-06 2005-02-02 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法ならびにそれを用いた半導体パッケージ
JP2002080280A (ja) * 2000-06-23 2002-03-19 Sumitomo Electric Ind Ltd 高熱伝導性複合材料及びその製造方法
JP2003201528A (ja) * 2001-10-26 2003-07-18 Ngk Insulators Ltd ヒートシンク材
AT7492U1 (de) * 2004-06-01 2005-04-25 Ceratizit Austria Gmbh Verschleissteil aus einem diamanthaltigen verbundwerkstoff
WO2007053571A2 (en) * 2005-11-01 2007-05-10 Techfilm, Llc Thermal interface material with multiple size distribution thermally conductive fillers
JP2008066379A (ja) * 2006-09-05 2008-03-21 Sumitomo Electric Ind Ltd 複合材料
GB0810542D0 (en) * 2008-06-09 2008-07-16 Element Six Production Pty Ltd Cubic boron nitride compact
WO2010038483A1 (ja) * 2008-10-03 2010-04-08 住友電気工業株式会社 複合部材
CN101831584A (zh) * 2009-03-10 2010-09-15 北京有色金属研究总院 高导热铜基复合材料及其制备方法
CN101985702B (zh) * 2010-06-29 2013-02-06 北京科技大学 一种超高导热、低热膨胀系数金刚石复合材料及制备方法
JP2013144763A (ja) * 2012-01-16 2013-07-25 Shin-Etsu Chemical Co Ltd 半導体封止用熱硬化性樹脂組成物及び該組成物で封止された半導体装置
WO2016029162A1 (en) * 2014-08-21 2016-02-25 Materion Corporation Composite articles comprising spinodal copper-nickel-tin-manganese-phosphorus alloy matrix material
CN110656259A (zh) * 2014-09-02 2020-01-07 联合材料公司 金刚石复合材料和散热部件
KR101611435B1 (ko) 2014-09-24 2016-04-12 경일산업 주식회사 태양전지 패널용 정션박스
EP3227399B1 (en) * 2014-12-05 2021-07-14 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
EP3369831A4 (en) * 2015-10-30 2019-06-05 Sumitomo Electric Industries, Ltd. SINTERING PART AND METHOD FOR THE PRODUCTION THEREOF
CN105624505B (zh) * 2015-12-25 2017-09-22 富耐克超硬材料股份有限公司 一种金属基超硬复合材料及其制备方法
US12351753B2 (en) * 2018-02-21 2025-07-08 Sumitomo Electric Industries, Ltd. Composite material and composite material manufacturing method
JP7089383B2 (ja) 2018-03-20 2022-06-22 ミネベアミツミ株式会社 送風機
JP7188957B2 (ja) 2018-09-26 2022-12-13 古河機械金属株式会社 硫化物系無機固体電解質材料、固体電解質、固体電解質膜およびリチウムイオン電池

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167991A (ja) * 1997-08-19 1999-03-09 Sumitomo Electric Ind Ltd 半導体用ヒートシンクおよびその製造方法
WO2003040420A1 (fr) * 2001-11-09 2003-05-15 Sumitomo Electric Industries, Ltd. Diamant fritte presentant une conductivite thermique elevee et procede de production d'un tel diamant et puits thermique utilisant un tel diamant
JP2004197153A (ja) * 2002-12-18 2004-07-15 Allied Material Corp ダイヤモンド−金属複合材料およびその製造方法
JP2007535151A (ja) * 2004-04-29 2007-11-29 プランゼー エスエー ホウ素を含むダイヤモンドと銅複合材料から成るヒートシンク
JP2017095766A (ja) * 2015-11-25 2017-06-01 株式会社アライドマテリアル 半導体パッケージ、及び半導体装置

Also Published As

Publication number Publication date
CN115427599A (zh) 2022-12-02
KR20220152386A (ko) 2022-11-15
JP7672390B2 (ja) 2025-05-07
US20230126268A1 (en) 2023-04-27
EP4130309A1 (en) 2023-02-08
WO2021192916A1 (ja) 2021-09-30

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