WO2021192916A1 - 複合材料、及び放熱部材 - Google Patents

複合材料、及び放熱部材 Download PDF

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Publication number
WO2021192916A1
WO2021192916A1 PCT/JP2021/008634 JP2021008634W WO2021192916A1 WO 2021192916 A1 WO2021192916 A1 WO 2021192916A1 JP 2021008634 W JP2021008634 W JP 2021008634W WO 2021192916 A1 WO2021192916 A1 WO 2021192916A1
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Prior art keywords
composite material
particles
atomic
content
metal phase
Prior art date
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PCT/JP2021/008634
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English (en)
French (fr)
Japanese (ja)
Inventor
亮太 松儀
功 岩山
貴洋 西水
智恵子 曽田
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ALMT Corp
Sumitomo Electric Industries Ltd
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ALMT Corp
Sumitomo Electric Industries Ltd
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Application filed by ALMT Corp, Sumitomo Electric Industries Ltd filed Critical ALMT Corp
Priority to CN202180024227.8A priority Critical patent/CN115427599A/zh
Priority to US17/912,508 priority patent/US20230126268A1/en
Priority to KR1020227032447A priority patent/KR20220152386A/ko
Priority to JP2022509488A priority patent/JP7672390B2/ja
Priority to EP21775180.9A priority patent/EP4130309A1/en
Publication of WO2021192916A1 publication Critical patent/WO2021192916A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
    • C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal

Definitions

  • heat dissipation members for semiconductor elements include heat spreaders and heat sinks.
  • a material suitable for the heat radiating member a composite material of a carbon-based material such as diamond and a metal is known.
  • the composite material comprises a metal phase and a plurality of particles dispersed in the metal phase.
  • Each of the plurality of particles (each particle) is made of a carbon-based material such as diamond having excellent thermal conductivity.
  • the surface of each particle is provided with a coating layer made of carbide. The coating layer improves the wettability of the particles with the metal phase and suppresses the formation of voids in the composite material.
  • the metal phase of the composite material examples include the metal phases described in Patent Documents 1 to 3.
  • the metal phase in the composite material of Patent Document 1 is composed of a eutectic alloy of silver (Ag) and copper (Cu). Since the eutectic alloy contains about 72% by mass of Ag, it can be said that the eutectic alloy is an alloy containing Ag as a main component.
  • the metal phase in the composite material of Patent Document 2 contains Ag as a main component.
  • the metal phase in the composite material of Patent Document 3 contains Cu as a main component.
  • the composite materials of the present disclosure are Metal phase and With a plurality of particles dispersed in the metal phase, Each particle (each particle) of the plurality of particles is a composite material having a coating layer covering the surface of each particle (each particle).
  • the plurality of particles are carbon-based materials and are
  • the metal phase contains a main element, a first element, and a second element.
  • the coating layer is a carbide of the second element, and is The main element is copper.
  • the first element is a metal element having a surface tension lower than that of copper.
  • the second element is at least one selected from the group consisting of beryllium, silicon, titanium, chromium, zirconium, niobium, hafnium, and tantalum.
  • the content of the first element in the total of the main element, the first element and the second element is 0.25 atomic% or more and 10.0 atomic% or less.
  • the content of the second element in the total of the main element, the first element and the second element is 1.5 atomic% or more and 14.0 atomic% or less.
  • the heat dissipation member of the present disclosure is The base material made of the composite material of the present disclosure and It includes a copper layer that covers at least a part of the surface of the base material.
  • FIG. 1 is a schematic cross-sectional view of a composite material according to an embodiment.
  • FIG. 2 is a schematic view of the surface of the particles contained in the composite material shown in FIG.
  • FIG. 3 is a schematic configuration diagram of a heat radiating member according to another embodiment.
  • the coefficient of linear expansion of Cu is lower than the coefficient of linear expansion of Ag
  • the main component of the metal phase of the composite material is Cu rather than Ag from the viewpoint of lowering the coefficient of linear expansion of the composite material.
  • Cu has an advantage that it is lighter than Ag and has an advantage that it is cheaper than Ag. Therefore, a composite material having a metal phase containing Cu as a main component is desired.
  • the composite material used for the heat radiating member may be required to have heat resistance at a high temperature in addition to being excellent in thermal conductivity.
  • an Ag—Cu alloy brazing material is used. It is required that the composite material is not deformed at the temperature at which the brazing material is melted.
  • the composite material of Patent Document 1 having a metal phase containing an Ag—Cu alloy as a main component has room for improvement in terms of heat resistance. This is because the melting point of the Ag—Cu alloy constituting the metal phase is close to the melting point of the brazing material.
  • the composite material having a metal phase containing Cu as a main component has excellent heat resistance.
  • the particles of the carbon-based material have a coating layer that improves the wettability of the particles and the metal phase, the wettability of the particles of the carbon-based material and Cu is not good. Therefore, when a plurality of particles made of a carbon-based material and Cu are combined, a plurality of voids are likely to be formed in the composite material. These voids can reduce the thermal conductivity of the composite.
  • one of the purposes of the present disclosure is to provide a composite material having excellent thermal conductivity and heat resistance.
  • Another object of the present disclosure is to provide a heat radiating member having excellent heat radiating properties and heat resistance.
  • the composite material of the present disclosure is excellent in thermal conductivity and heat resistance.
  • the heat radiating member of the present disclosure is excellent in heat radiating property and heat resistance.
  • the composite material is obtained by combining a plurality of particles of a carbon-based material with a molten metal as a raw material for a metal phase.
  • the present inventors have diligently studied a configuration for improving the wettability between particles of a carbon-based material and a metal phase in a composite material having a metal phase containing Cu as a main component.
  • the present inventors have found that the wettability between the particles of the carbon-based material and the metal phase can be improved by containing an element having a surface tension smaller than that of Cu in the molten metal of the metal phase.
  • the first element tends to be concentrated on the surface of the molten metal in contact with particles. It is considered that this first element improves the wettability between the particles of the carbon-based material and the molten metal. Based on this finding, the present inventors have completed the composite material according to the present embodiment. First, embodiments of the present disclosure will be listed and described. Here, in the present specification, an aggregate of a plurality of particles of a carbon-based material is referred to as a "carbon-based powder".
  • the composite material according to this embodiment is Metal phase and With a plurality of particles dispersed in the metal phase, Each particle of the plurality of particles is a composite material having a coating layer covering the surface of each of the particles.
  • the plurality of particles are carbon-based materials and are
  • the metal phase contains a main element, a first element, and a second element.
  • the coating layer is a carbide of the second element, and is The main element is copper.
  • the first element is a metal element having a surface tension lower than that of copper.
  • the second element is at least one selected from the group consisting of beryllium, silicon, titanium, chromium, zirconium, niobium, hafnium, and tantalum.
  • the content of the first element in the total of the main element, the first element and the second element is 0.25 atomic% or more and 10.0 atomic% or less.
  • the content of the second element in the total of the main element, the first element and the second element is 1.5 atomic% or more and 14.0 atomic% or less.
  • the main element is a metal element that is the main component of the metal phase, that is, a metal element that occupies the majority of the metal phase.
  • the composite material of ⁇ 1> has the following constitution. "Metal phase and With a plurality of particles dispersed in the metal phase, Each particle of the plurality of particles is a composite material having a coating layer covering the surface of each of the particles. Each of the above particles is a carbon-based material and is Ingredients other than carbon
  • the first element is 0.25 atomic% or more and 10.0 atomic% or less, Contains 1.5 atomic% or more and 14.0 atomic% or less of the second element
  • the rest is copper and unavoidable impurities,
  • the first element is a metal element having a surface tension lower than that of copper.
  • the second element is a composite material which is at least one selected from the group consisting of beryllium, silicon, titanium, chromium, zirconium, niobium, hafnium, and tantalum.
  • the composite material according to this embodiment has excellent thermal conductivity. Particles of carbon-based materials such as diamond have excellent thermal conductivity. Further, Cu, which is the main component of the metal phase, has excellent thermal conductivity. Therefore, the composite material according to this embodiment has excellent thermal conductivity. Further, a coating layer made of a carbide of the second element is provided on the surface of each of the plurality of particles (each particle) in the composite material according to the present embodiment. This coating layer improves the wettability of the particles and the molten metal phase during the production of the composite material. Further, the metal phase in the composite material contains a first element having a surface tension smaller than that of Cu.
  • This first element concentrates on the surface of the molten metal of the metal phase during the production of the composite material, and improves the wettability between the molten metal of the metal phase and the particles. Voids are less likely to be formed in the composite material due to the improvement of the wettability by the coating layer and the improvement of the wettability by the first element. Therefore, the composite material according to this embodiment has excellent thermal conductivity.
  • the composite material according to this embodiment has excellent heat resistance.
  • the metal phase in the composite material according to the present embodiment contains Cu as a main component.
  • Cu has a higher melting point than the Ag alloy. Therefore, when the composite material and ceramics or the like are brazed, the composite material is unlikely to be deformed at a temperature near the melting point of the brazed material.
  • the composite material according to this embodiment has a small coefficient of linear expansion.
  • the coefficient of linear expansion of Cu is smaller than the coefficient of linear expansion of Ag. Therefore, the coefficient of linear expansion of the composite material of the present embodiment having a metal phase containing Cu as a main component tends to be lower than the coefficient of linear expansion of the composite material having a metal phase containing Ag as a main component.
  • the coefficient of linear expansion of a composite material having a metal phase containing Cu as a main component is close to the coefficient of linear expansion of a heating element such as a semiconductor element. Therefore, peeling between the composite material and the heating element due to the difference in the coefficient of linear expansion is likely to be suppressed.
  • the composite material according to this embodiment is inexpensive and lightweight.
  • the metal phase in the composite material according to this embodiment contains Cu as a main element.
  • Cu is lighter and cheaper than Ag. Therefore, the composite material of the present disclosure is lighter and cheaper than the composite material containing Ag as a main component.
  • the carbon-based material may be in the form of diamond.
  • Diamond has extremely excellent thermal conductivity. Therefore, if the particles dispersed in the metal phase are diamond, the thermal conductivity of the composite material is improved. In addition, diamond powders having various particle sizes are commercially available, and diamond powders are easily available.
  • the first element may be at least one selected from the group consisting of silver, magnesium, aluminum, tin, zinc, and manganese.
  • the surface tension of the molten metal of Ag, magnesium (Mg), aluminum (Al), tin (Sn), zinc (Zn), and manganese (Mn) is smaller than the surface tension of the molten metal of Cu. Further, the metals listed in ⁇ 3> above are easily available.
  • the first element may be in the form of silver.
  • Ag has excellent wettability with particles having a coating layer. Therefore, Ag is suitable as the first element contained in the metal phase.
  • the second element may be in the form of titanium.
  • the second element is selected from the group consisting of beryllium (Be), silicon (Si), titanium (Ti), chromium (Cr), zirconium (Zr), niobium (Nb), hafnium (Hf), and tantalum (Ta). At least one species to be used. Of these candidates for the second element, Ti is readily available. Further, titanium carbide tends to improve the wettability of the molten metal of the metal phase with respect to particles made of a carbon-based material.
  • Examples of the content of the plurality of particles include a form in which the content is 40% by volume or more and 80% by volume or less.
  • the content of the carbon-based powder, which is superior in thermal conductivity to the metal phase is within the above range, a composite material having excellent thermal conductivity can be obtained. Further, since the amount of carbon-based powder is not too large during the production of the composite material, the molten metal of the metal phase easily penetrates between the particles of the carbon-based powder. Therefore, a composite material having few voids and excellent thermal conductivity can be obtained.
  • the plurality of particles include a plurality of fine particles and a plurality of coarse particles.
  • the particle size of each of the plurality of fine particles is less than 30 ⁇ m.
  • the particle size of each of the plurality of coarse particles is 30 ⁇ m or more, and the particle size is 30 ⁇ m or more.
  • the volume ratio of the plurality of fine particles to all the particles of the plurality of particles may be 20% by volume or more and 50% by volume or less.
  • the content of the carbon-based powder in the composite material tends to be high.
  • the volume ratio of the plurality of fine particles to all the particles of the plurality of particles is within the above range, the content of the carbon-based powder in the composite material tends to be high.
  • the heat radiating member according to this embodiment is The base material made of the composite material according to any one of ⁇ 1> to ⁇ 7> above, It includes a copper layer that covers at least a part of the surface of the base material.
  • the heat radiating member according to this embodiment has excellent heat radiating properties.
  • the base material provided for the heat radiating member according to the present embodiment is made of the composite material according to the above embodiment.
  • the particles of the carbon-based material contained in the composite material and Cu, which is the main component of the metal phase, have excellent thermal conductivity. Therefore, the heat radiating member according to the present embodiment including the base material made of the composite material according to the above embodiment can effectively dissipate the heat of the heating element such as the semiconductor element.
  • the heat radiating member according to this embodiment is suitable as a heat radiating member for a semiconductor element.
  • the composite material substrate provided in the heat radiating member according to the present embodiment has an intermediate linear expansion coefficient between the carbon-based substance and Cu.
  • the coefficient of linear expansion of this substrate is close to the coefficient of linear expansion of the semiconductor element and the coefficient of linear expansion of the insulating substrate of the semiconductor element. Therefore, when the semiconductor element is used, the peeling between the semiconductor element and the heat radiating member due to the difference in the coefficient of linear expansion is suppressed.
  • the heat radiating member according to the present embodiment is easily bonded to a heating element such as a semiconductor element.
  • the heat radiating member according to the present embodiment includes a copper layer on at least a part of the surface of the base material. Since the copper atom, which is the main component of the copper layer, is easily bonded to the copper atom, which is the main component of the metal phase of the base material, the copper layer is easily bonded to the base material of the composite material. In addition, the copper layer smoothes the surface of the base material.
  • This copper layer can be easily bonded to a heating element such as a semiconductor element. Therefore, when the heat radiating member and the heating element are solder-bonded, it is difficult for a void to be formed between the heat radiating member and the heating element. Therefore, by arranging the copper layer with respect to the heating element, the heating element can be satisfactorily solder-bonded to the heat radiating member.
  • the composite material 1 of the present embodiment includes a metal phase 2 and a plurality of particles 3 dispersed in the metal phase 2. As shown in FIG. 2, a coating layer 4 is provided on the surface of each of the plurality of particles 3 (each particle 3).
  • each configuration of the composite material 1 will be described in detail.
  • the metal phase 2 contains Cu as a main element.
  • the main element is a metal element that is the main component of the metal phase 2, that is, a metal element that occupies a majority of the metal phase 2.
  • the thermal conductivity of Cu is about 400 W / m ⁇ K. Therefore, the metal phase 2 containing Cu as a main component contributes to the improvement of the thermal conductivity of the composite material 1.
  • the metal phase 2 contains a first element and a second element in addition to Cu.
  • the first element is a metal element having a surface tension lower than that of Cu. That is, the surface tension of the molten metal of the first element is lower than the surface tension of the molten metal of Cu.
  • the surface tension of metal elements is known. Specific examples of the first element include at least one selected from the group consisting of Ag, Mg, Al, Sn, Zn, and Mn.
  • the first element is concentrated on the surface of the molten metal of the metal phase 2 during the production of the composite material 1.
  • the first element concentrated on the surface of the molten metal improves the wettability between the molten metal in contact with the particles 3 and the particles 3.
  • the second element is at least one selected from the group consisting of Be, Si, Ti, Cr, Zr, Nb, Hf, and Ta.
  • the second element is contained in a predetermined amount in the raw material of the composite material 1 at the time of producing the composite material 1. Most of the second element in the raw material is consumed in the formation of the coating layer 4 of the particles 3. Therefore, the amount of the second element contained in the metal phase 2 is very small.
  • (particle) -Material Particle 3 is a carbon-based material.
  • the carbon-based material is preferably at least one selected from the group consisting of diamond, graphite, carbon nanotubes, and carbon fibers.
  • Diamond has substantially no anisotropy with respect to thermal conductivity, and typically has a high thermal conductivity of 1000 W / m ⁇ K or more.
  • diamond powders having various particle sizes are commercially available, and diamond powders are easily available. In these respects, the composite material 1 containing diamond is easy to use as a material for a heat radiating member and is also excellent in manufacturability.
  • Graphite is soft and has excellent workability. Therefore, the composite material 1 containing graphite is excellent in processability.
  • the axial thermal conductivity of carbon nanotubes may be higher than the axial thermal conductivity of diamond. Therefore, the composite material 1 containing carbon nanotubes is expected to be more excellent in thermal conductivity.
  • Carbon fiber has excellent mechanical strength. Therefore, the composite material 1 containing carbon fibers is excellent in mechanical strength.
  • the composite material 1 containing a plurality of different types of carbon-based materials has the effects brought about by each carbon-based material.
  • the composite material 1 mainly containing diamond and partially containing graphite is expected to be excellent in thermal conductivity and easy to perform processing such as cutting.
  • the content of all the particles 3 in the composite material 1, that is, the content of the carbon-based powder is, for example, 40% by volume or more and 85% by volume or less.
  • the composite material 1 contains a large amount of particles 3 having excellent thermal conductivity. Therefore, the thermal conductivity of the composite material 1 is improved. Further, the coefficient of linear expansion of the composite material 1 tends to be smaller than that of Cu.
  • the metal phase 2 is likely to spread in the gaps between the particles 3 when the composite material 1 is produced.
  • the lower limit of the content of the particles 3 may be, for example, 45% by volume, further 50% by volume, 55% by volume, or 60% by volume. Further, the upper limit of the content may be, for example, 80% by volume, further 75% by volume or less.
  • the content of the plurality of particles 3 in the composite material 1 is determined as follows, for example. First, the volume of the composite material 1 is determined by the Archimedes method. Next, the composite material 1 is dissolved in dilute nitric acid to separate the carbon-based powder. The mass of the carbon-based powder is measured, and the volume of the carbon-based powder is calculated based on the theoretical density of the carbon-based material constituting the carbon-based powder. Then, by dividing the volume of the carbon-based powder by the volume of the composite material 1, the content of the plurality of particles 3 in the composite material 1 can be obtained.
  • the average particle size of the particles 3 in the composite material 1 is preferably, for example, 10 ⁇ m or more and 120 ⁇ m or less.
  • the average particle size of the particles 3 may be 15 ⁇ m or more, and further 20 ⁇ m or more. Further, the average particle size may be 100 ⁇ m or less, further 90 ⁇ m or less, 80 ⁇ m or less, 70 ⁇ m or less, and 60 ⁇ m or less.
  • the average particle size of the particles 3 is obtained from the equivalent circle diameter obtained by observing the cross section of the composite material 1. Specifically, the equivalent circle diameter is obtained for k or more particles 3 in the cross section of the composite material 1.
  • the average of the k circle-equivalent diameters is the average particle size of the particles 3.
  • k is 10 or more.
  • k is preferably 20 or more, and more preferably 50 or more.
  • SEM Sccanning Electron Microscope
  • the diameter of a circle having the same cross-sectional area as the cross-sectional area is the equivalent circle diameter.
  • the threshold value of the binarization process is adjusted so that each particle 3 can be clearly identified.
  • the carbon-based powder may be a mixture of a plurality of fine particles 31 and a plurality of coarse particles 32.
  • the fine particles 31 in the present specification are particles 3 having a circle-equivalent diameter of less than 30 ⁇ m obtained by observing the cross section of the composite material 1.
  • the average particle size of the fine particles 31 is preferably 10 ⁇ m or more and 25 ⁇ m or less.
  • the average particle size is the average of the equivalent circle diameters of n fine particles 31.
  • n is 10 or more.
  • n is preferably 20 or more, and more preferably 50 or more.
  • the coarse particles 32 in the present specification are particles 3 having a circle-equivalent diameter of 30 ⁇ m or more obtained by observing the cross section of the composite material 1.
  • the average particle size of the coarse particles 32 is preferably 80 ⁇ m or more and 120 ⁇ m or less.
  • the average particle size is the average of the equivalent circle diameters of m coarse grains 32.
  • m is 10 or more.
  • m is preferably 20 or more, and more preferably 50 or more.
  • the volume ratio of the plurality of fine particles 31 to all the particles 3 of the plurality of particles 3 is preferably 20% by volume or more and 50% by volume or less.
  • the volume ratio of the fine particles 31 and the coarse particles 32 is within the above range, a sufficient number of fine particles 31 are likely to be arranged between the adjacent coarse particles 32. As a result, the volume of the particles 3 occupying the composite material 1 becomes large, and the thermal conductivity of the composite material 1 tends to increase.
  • the volume ratio of the fine particles 31 to all the particles 3 is more preferably 25% by volume or more and 40% by volume or less.
  • the coating layer 4 covers at least a part of the surface of each particle 3 of the plurality of particles 3, typically substantially the entire surface.
  • the coating layer 4 is a carbide of the second element.
  • the coating layer 4 improves the wettability between the particles 3 and the molten metal of the metal phase 2 at the time of producing the composite material 1.
  • the coating layer 4 made of titanium carbide contributes to the improvement of the wettability between the particles 3 and the molten metal of the metal phase 2.
  • the thermal conductivity of the coating layer 4 is lower than that of Cu and carbon-based materials. Therefore, it is preferable that the coating layer 4 is thin as long as the effect of improving the wettability can be obtained.
  • the thickness of the coating layer 4 is adjusted by the amount of the second element added at the time of producing the composite material 1. The smaller the amount added, the thinner the thickness of the coating layer 4 tends to be.
  • the content of the first element in the composite material 1 is 0.25 atomic% or more and 10.0 atomic% or less.
  • the content of the first element is 0.25 atomic% or more, the effect of improving the wettability of the first element can be sufficiently obtained. Therefore, the composite material 1 having the content of the first element of 0.25 atomic% or more is excellent in thermal conductivity.
  • the content of the first element is 10.0 atomic% or less, the decrease in heat resistance of the composite material 1 is suppressed.
  • the content of the first element in the composite material 1 of the present embodiment is more preferably 0.5 atomic% or more and 4.5 atomic% or less.
  • the content of the first element in the composite material 1 is determined by the following formula. ⁇ (Number of atoms of the first element) / (Number of atoms of the main element + Atomic number of the first element + Number of atoms of the second element) ⁇ x 100
  • the number of atoms of each element in composite material 1 is measured as follows. First, the composite material 1 is dissolved with dilute nitric acid, and the solution is filtered to separate the particles 3 and others. The concentration of dilute nitric acid is about 70%. Next, an ICP emission spectrometry (Inductively Coupled Plasma Atomic Emission Spectrometry) is used to analyze the solution containing the metal phase 2 other than the particles 3 and the coating layer 4. Then, the number of atoms of each element obtained by the analysis is substituted into the above formula to obtain the content (atomic%) of the first element in the composite material 1.
  • ICP emission spectrometry Inductively Coupled Plasma Atomic Emission Spectrometry
  • the content of the second element in the composite material 1 is 1.5 atomic% or more and 14.0 atomic% or less.
  • the coating layer 4 which is a carbide of the second element is sufficiently present on the surface of each particle 3. Since the coating layer 4 improves the wettability between the metal phase 2 and the particles 3, the composite material 1 having a second element content of 1.5 atomic% or more is excellent in thermal conductivity.
  • the content of the second element is 14.0 atomic% or less, it can be said that the coating layer 4 existing on the surface of each particle 3 is not too thick. Therefore, the composite material 1 having the content of the second element of 14.0 atomic% or less is excellent in thermal conductivity.
  • a more preferable content of the second element is 2.5 atomic% or more and 10.0 atomic% or less.
  • the content of the second element in the composite material 1 is determined by the following formula.
  • the method of obtaining the atomic number of each element is the same as the method of obtaining the atomic number of each element when determining the content of the first element. ⁇ (Number of atoms of the second element) / (Number of atoms of the main element + Atomic number of the first element + Number of atoms of the second element) ⁇ x 100
  • the composite material 1 may contain a third element as long as the thermal conductivity and heat resistance of the composite material 1 do not deteriorate.
  • the third element is sulfur (S), phosphorus (P), nickel (Ni), cobalt (Co), iron (Fe) and the like. These elements are elements that may be mixed in during the production of the composite material 1.
  • the content of the third element in the composite material 1 is determined by the following formula in terms of atomic ratio. ⁇ (Atom number of third element) / (Atom number of main element + Atom number of first element + Atom number of second element + Atom number of third element) ⁇ ⁇ 100
  • the content of the third element is 0 atomic% or more and 2.0 atomic% or less. With this content of the third element, the thermal conductivity and heat resistance of the composite material 1 do not deteriorate.
  • the composite material of the present embodiment including the third element can also be defined as follows. "Metal phase and With a plurality of particles dispersed in the metal phase, Each particle of the plurality of particles is a composite material having a coating layer covering the surface of each of the particles.
  • the plurality of particles are carbon-based materials and are
  • the metal phase contains a main element, a first element, a second element, and a third element.
  • the coating layer is a carbide of the second element, and is The main element is copper.
  • the first element is a metal element having a surface tension lower than that of copper.
  • the second element is at least one selected from the group consisting of beryllium, silicon, titanium, chromium, zirconium, niobium, hafnium, and tantalum.
  • the third element is at least one selected from the group consisting of sulfur, phosphorus, nickel, cobalt, and iron.
  • the content of the first element in the total of the main element, the first element, the second element, and the third element is 0.25 atomic% or more and 10.0 atomic% or less.
  • the content of the second element in the total of the main element, the first element, the second element, and the third element is 1.5 atomic% or more and 14.0 atomic% or less.
  • a composite material in which the content of the third element in the total of the main element, the first element, the second element, and the third element is 0 atomic% or more and 2.0 atomic% or less.
  • the composite material in parentheses includes the following configurations. "Metal phase and With a plurality of particles dispersed in the metal phase, Each particle of the plurality of particles is a composite material having a coating layer covering the surface of each of the particles.
  • Each of the above particles is a carbon-based material and is Ingredients other than carbon
  • the first element is 0.25 atomic% or more and 10.0 atomic% or less
  • the second element is 1.5 atomic% or more and 14.0 atomic% or less
  • the rest is copper and unavoidable impurities
  • the first element is a metal element having a surface tension lower than that of copper.
  • the second element is at least one selected from the group consisting of beryllium, silicon, titanium, chromium, zirconium, niobium, hafnium, and tantalum.
  • the third element is a composite material that is at least one selected from the group consisting of sulfur, phosphorus, nickel, cobalt, and iron.
  • the thermal conductivity of the composite material 1 of the present embodiment is, for example, 600 W / m ⁇ K or more.
  • the composite material 1 of the present embodiment has an intermediate linear expansion coefficient between the carbon-based substance and Cu.
  • the coefficient of linear expansion of the composite material 1 is 4 ⁇ 10 -6 / K or more and 15 ⁇ 10 -6 / K or less.
  • the coefficient of linear expansion of the composite material 1 is 4.5 ⁇ 10-6 / K or more and 13 ⁇ 10-6 / K or less, or 4.5 ⁇ 10-6 / K or more. It can be 10 ⁇ 10-6 / K or less. If the difference between the coefficient of linear expansion of the composite material 1 and the coefficient of linear expansion of the heating element becomes small, it becomes difficult for the composite material 1 bonded to the heating element with a brazing material or the like to be separated from the heating element.
  • the relative density of composite material 1 In the composite material 1 of this example, the wettability between the metal phase 2 and the particles 3 is good. Therefore, the composite material 1 of this example has few pores and the relative density of the composite material 1 is high.
  • the relative density of the composite material 1 in this example is, for example, 90% or more. The higher the relative density of the composite material 1, the less likely it is that the thermal conductivity of the composite material 1 will decrease due to pores. Therefore, the relative density of the composite material 1 is preferably 95% or more, further 96% or more, 97% or more, 98% or more, 99% or more.
  • the relative density is a value obtained by dividing the actual density of the composite material 1 by the theoretical density of the composite material 1.
  • the actual density of the composite material 1 is determined by dividing the mass of the composite material 1 by the volume.
  • the volume of the composite material 1 is determined by the Archimedes method or the like.
  • the theoretical density of the composite material 1 is obtained according to the following steps 1 to 5. -Step 1 ...
  • the volume of the composite material 1 is determined by the Archimedes method.
  • -Step 2 Obtain the weight of each element contained in the composite material 1. First, the composite material 1 is dissolved with dilute nitric acid, and the weight of the particles 3 separated from the composite material 1, that is, the weight of the carbon-based powder is measured.
  • the weight of each element contained in the dilute nitric acid solution is determined.
  • the weight of each element contained in the solution is obtained from the number of atoms of each element obtained by ICP emission analysis of the solution.
  • Step 3 The weight of each element obtained in step 2 is divided by the theoretical density of each element to obtain the volume of each element in the composite material 1.
  • the volume ratio of each element in the composite material 1 is calculated based on the volume of each element.
  • Step 4 ... Calculate the volume of each element so that the volume of the composite material 1 obtained in step 1 is satisfied by the volume ratio obtained in step 3.
  • Step 5 The volume of each element obtained in step 4 is multiplied by the theoretical density of each element to calculate the weight of each element in the composite material 1.
  • the value obtained by dividing the total weight of each element by the volume of the composite material 1 obtained in step 1 is defined as the theoretical density of the composite material 1.
  • the composite material 1 of the present embodiment having excellent thermal conductivity is suitable as a material for a heat radiating member.
  • the composite material 1 having excellent consistency of linear expansion coefficient with the semiconductor element and its peripheral parts is suitable as a material for the heat radiating member of the semiconductor element.
  • the semiconductor device including the heat radiating member made of the composite material 1 of the present embodiment include a high frequency power device such as LDMOS (Laterally Diffused Metal Oxide Semiconductor).
  • Other semiconductor devices include semiconductor laser devices, light emitting diode devices, central processing units (Central Processing Units) for various computers, graphics processing units (Graphics Processing Units), high-electron mobile transistors (HEMTs), chipsets, and memory. Examples include chips.
  • the composite material 1 of the present embodiment is lightweight and inexpensive.
  • the metal phase 2 in the composite material 1 contains Cu as a main component.
  • Cu is lighter and cheaper than Ag. Therefore, the composite material 1 of the present embodiment is lighter and cheaper than the composite material containing Ag as a main component.
  • the composite material 1 of this embodiment is excellent in thermal conductivity and heat resistance. This effect will be described in detail in Test Examples 1 and 2 described later.
  • the composite material of this embodiment is obtained, for example, by the infiltration method shown below.
  • a raw material powder containing a carbon-based powder is filled in a molding die.
  • the raw material powder may be, for example, only a carbon-based powder, or may be a mixed powder of the carbon-based powder and a powder containing a second element as a raw material of the coating layer 4.
  • the copper material to be the metal phase 2 is placed on the raw material powder.
  • the copper material may be a powder or a small section.
  • the copper material contains Cu, a first element and a second element.
  • the raw material powder and the copper material may be mixed and filled in a molding die.
  • the copper material is melted by heating the molding mold in which the raw material powder and the copper material are placed. As a result, the molten copper material is impregnated into the raw material powder, and the raw material powder and the molten copper material are combined.
  • the infiltration temperature that is, the heating temperature of the raw material powder and the copper material, is equal to or higher than the melting point of Cu, which is the temperature at which the copper material can be melted.
  • the infiltration temperature is 1100 ° C. or higher, and further 1150 ° C. or higher.
  • the infiltration temperature is preferably 1300 ° C. or lower.
  • the retention time of the infiltration temperature changes depending on the size of the composite material 1.
  • the retention time of the infiltration temperature is, for example, about 10 minutes or more and 120 minutes or less.
  • the atmosphere at the time of immersion is a vacuum atmosphere of 1 Pa or less, a reducing atmosphere, or an inert atmosphere. Oxidation of Cu and the like is reduced by creating the vacuum atmosphere, the reducing atmosphere, or the inert atmosphere.
  • the pressure in the vacuum atmosphere is 0.1 Pa or less, and further 0.01 Pa or less.
  • the inert atmosphere includes an inert gas atmosphere such as argon or nitrogen.
  • the reducing atmosphere includes a hydrogen atmosphere, a mixed atmosphere of hydrogen and an inert gas, and the like. In any atmosphere, the oxygen concentration is preferably low.
  • the molten metal takes in the second element contained in the raw material powder and comes into contact with the particles 3, so that the coating layer 4 is formed on the surface of the particles 3.
  • the coating layer 4 improves the wettability between the particles 3 and the molten metal.
  • the first element is concentrated on the surface of the molten metal in contact with the particles 3, and the concentrated first element improves the wettability between the particles 3 and the molten metal. As a result, the particles 3 and the molten metal are combined. At that time, it is difficult for voids to be formed in the vicinity of the particles 3.
  • the raw material in the molding mold is cooled.
  • a composite material 1 in which a plurality of particles 3 having a coating layer 4 are dispersed in a metal phase 2 containing Cu as a main component can be obtained.
  • the heat radiating member 5 shown in FIG. 3 is an example of a heat radiating member using the composite material 1 according to the present embodiment.
  • the heat radiating member 5 of FIG. 3 includes a base material 6 and a copper layer 7.
  • the base material 6 is made of the composite material 1.
  • the copper layer 7 is provided on at least a part of the base material 6. In this example, copper layers 7 are provided on each of the first surface and the second surface of the base material 6.
  • the copper layer 7 Since the copper atom, which is the main component of the copper layer 7, is easily bonded to the copper atom, which is the main component of the metal phase 2 in the composite material 1 constituting the base material 6, the copper layer 7 is difficult to peel off from the base material 6. Further, in order to smooth the surface of the heat radiating member 5, the copper layer 7 is between the heat radiating member 5 and the heating element when the heat radiating member 5 provided with the copper layer 7 is solder-bonded to a heating element such as a semiconductor element. Voids are unlikely to occur. Therefore, heat is easily transferred from the heating element to the heat radiating member 5, and the temperature rise of the heating element is suppressed.
  • the copper layer 7 is formed by joining a copper foil to the surface of the base material 6 with a brazing material such as an Ag—Cu alloy.
  • the copper layer 7 may be formed by vapor deposition, Cu plating, or the like.
  • a plating layer may be further provided on the surface of the copper layer 7.
  • the material of the plating layer is, for example, nickel (Ni).
  • Test Example 1 In Test Example 1, the effects of the contents of the first element and the second element in the composite material on the thermal conductivity and heat resistance of the composite material were investigated.
  • a raw material powder of diamond powder containing the second element Ti was prepared.
  • a copper material containing Ag, which is the first element, and Ti, which is the second element was prepared.
  • the raw material powder was filled in a carbon mold, and the copper material was filled on the filling.
  • the raw material powder and the copper material were heat-treated together with the molding die in an argon atmosphere, and the diamond powder and the molten metal were combined.
  • the heat treatment temperature was either 1100 ° C. to 1200 ° C., and the heat treatment time was either 10 minutes to 120 minutes. After the heat treatment, the mold was cooled to obtain a composite material.
  • Test Example 1 Sample No. obtained by the above preparation procedure. The composition and properties of the composite materials 1-28 were measured. The results are shown in Table 1. The composite material of the sample having "*" or "**" after the sample number in Table 1 satisfies the requirement of the composite material 1 according to the first embodiment.
  • the measurement items in Test Example 1 are as follows.
  • the thermal conductivity (W / m ⁇ K) of the composite material of each sample was measured.
  • the thermal conductivity was measured at room temperature by a flash method using a commercially available measuring device (NETZSCH LFA467).
  • the measurement conditions were based on ASTM E1461-13 "Standard Test Method for Thermal Diffusivity by the Flash Method".
  • ASTM E1461-13 Standard Test Method for Thermal Diffusivity by the Flash Method.
  • the sample No. In Nos. 22 and 23 the molten metal was not infiltrated into the diamond particles.
  • the thermal conductivity of 22 and 23 was not measured.
  • the heat resistance of the composite material of each sample was examined. Specifically, the composite material of each sample was heat-treated at 800 ° C. for 30 minutes, and it was visually confirmed whether or not dissolution marks were formed on the surface of the composite material.
  • a composite material having a dissolution mark is a composite material having insufficient heat resistance.
  • a composite material having no dissolution marks is a composite material having excellent heat resistance.
  • Table 1 "no good” indicates that the heat resistance is not sufficient, and "good” indicates that the heat resistance is excellent.
  • the cross section of the composite material of each sample was observed, and the average particle size of the diamond particles contained in the composite material was examined. Specifically, an SEM photograph of a cross section of the composite material was acquired, each diamond particle was identified by image analysis, and the equivalent circle diameter of each diamond particle was determined. Diamond particles having a circle-equivalent diameter of less than 30 ⁇ m were defined as fine particles, and diamond particles having a circle-equivalent diameter of 30 ⁇ m or more were defined as coarse particles.
  • the average particle size of the fine particles is the average value of the equivalent circle diameters of the diamond particles judged to be fine particles.
  • the average particle size of the coarse particles is the average value of the equivalent circle diameters of the diamond particles determined to be coarse particles.
  • diamond particles having a cross-sectional area of 3 ⁇ m 2 or less in the SEM photograph were not included in the calculation of the average value of the fine particles.
  • volume fraction of fine and coarse grains The volume fraction (volume%) of the fine particles and the coarse particles was determined from the SEM photograph. Specifically, the total area of the fine grains and the total area of the coarse grains in the SEM photograph were obtained, and the area ratio of the fine grains to the coarse grains was regarded as the volume ratio of the fine grains and the coarse grains. For example, the total area of the fine obtained from SEM photographs 3000 .mu.m 2, the total area of coarse particles if 7000Myuemu 2, volume ratio of particulate to total all of the particles are 30% by volume, the volume ratio of the coarse grains 70 volume %.
  • the particle content (%) in the composite material was determined as follows. First, the volume of the composite material of each sample was determined by the Archimedes method. The composite was then dissolved in 70% dilute nitric acid and the solution was filtered to separate the diamond powder. The mass of the separated diamond powder was measured, and the volume of the diamond powder was calculated based on the theoretical density of diamond. Then, the volume of the diamond powder was divided by the volume of the composite material to obtain the content of particles in the composite material.
  • the content of Ag is the ratio of the number of atoms of Ag to the total number of atoms of Cu, Ag and Ti in the solution.
  • Ti content in composite material The Ti content (atomic%) in the metal phase and the coating layer was measured.
  • the Ti content is the ratio of the number of Ti atoms to the total number of Cu, Ag, and Ti atoms in the solution.
  • the relative density (%) of the composite material was determined by the method described in the above-mentioned "Relative density of composite material" section. First, the mass of the composite material of each sample was measured, and the volume of the composite material of each sample was determined by the Archimedes method. The actual density of the composite material for each sample was determined by dividing the measured mass by volume. Next, the theoretical density of the composite material of each sample was obtained, and the actual density of the composite material 1 was divided by the theoretical density of the composite material 1 to obtain the relative density of the composite material. The theoretical density of the composite material was determined according to steps 1 to 5 shown in the item "Relative density of composite material".
  • the Ag content of the composite material is 0.25 atomic% or more and 10.0 atomic% or less, and the Ti content is 1.5 atomic% or more and 14.0 atomic%.
  • a sample No. 1-Sample No. The composite material of 19 had a thermal conductivity of 600 W / m ⁇ K or more and had good heat resistance.
  • the composite materials of 1, 2, 4, 10, 11, 15 to 19 had a thermal conductivity of 660 W / m ⁇ K or more and had good heat resistance.
  • Test Example 2 the sample No. in which the first element and the second element were changed was changed. 30 to 39 composite materials were prepared, and the thermal conductivity and heat resistance of each sample were examined. The measurement items and measurement methods of Test Example 2 are the same as those of Test Example 1. Table 2 shows the measurement results of samples Nos. 30 to 39.
  • the first element in Test Example 2 was either Ag, Mg, Al, Sn, Zn, or Mn.
  • the second element was either Ti, Zr, Cr, Si, Ta, or Nb.
  • the first element is represented by " ⁇ ” and the second element is represented by " ⁇ ".
  • the sample No. The 30-39 composite materials had excellent thermal conductivity and heat resistance. From this result, it was clarified that Mg, Al, Sn, Zn, and Mn function effectively as the first element instead of Ag. It was also revealed that Zr, Cr, Si, Ta, and Nb function effectively as a second element instead of Ti.

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