JP7120381B2 - Method for manufacturing multifaceted vapor deposition mask preparation - Google Patents

Description

The present invention relates to a method for manufacturing a multi-faceted vapor deposition mask preparation.

Conventionally, in the manufacture of an organic EL element, the organic layer or cathode electrode of the organic EL element is formed, for example, from a metal in which a large number of fine slits are arranged in parallel at minute intervals in the region to be vapor-deposited. A deposition mask was used. When using this vapor deposition mask, the vapor deposition mask is placed on the surface of the substrate to be vapor-deposited and held from the back side using a magnet. In addition, the slits tend to be distorted, which is an obstacle to high definition or upsizing of products requiring a long slit length.

Various studies have been made on vapor deposition masks for preventing the distortion of the slits. A vapor deposition mask has been proposed that includes a second metal mask having a large number of fine slits in its region and a mask pulling and holding means that pulls the second metal mask in the longitudinal direction of the slits and positions the second metal mask on the base plate. That is, a vapor deposition mask is proposed in which two types of metal masks are combined. According to this vapor deposition mask, it is said that slit accuracy can be ensured without causing distortion of the slit.

By the way, in recent years, with the increase in size of products using organic EL elements or the increase in substrate size, there is an increasing demand for large-sized vapor deposition masks. Metal plates are also becoming larger. However, with current metal processing technology, it is difficult to precisely form slits in a large metal plate. It is not possible to respond to high-definition slits. In addition, if the vapor deposition mask is made of only metal, the weight increases as the size increases, and the total mass including the frame also increases, resulting in difficulty in handling.

Furthermore, while the vapor deposition mask is usually used in a state of being fixed to the frame, when the vapor deposition mask is increased in size, there may arise a problem that the frame and the vapor deposition mask cannot be accurately aligned. . In particular, in the case of a multi-faceted vapor deposition mask in which a plurality of masks are arranged by partitioning the frame in the vertical and horizontal directions, the opening pattern of each mask must be aligned with high precision. However, the problem of accuracy in positioning becomes conspicuous.

Regarding the multi-faceted vapor deposition mask, in Patent Document 2, as a vapor deposition mask to which a frame is attached, a plurality of strip-shaped unit masks divided in the longitudinal direction of the frame opening (the unit mask has A plurality of unit masking patterns are formed at predetermined intervals along the edge of the frame. Arrangements have been proposed for fixed mounting as provided. According to this configuration, even if the multi-faceted vapor deposition mask (opening area of the frame) is increased in size, it is possible to suppress positional deviation of each unit masking pattern due to distortion caused by the mask's own weight or the like. ing.

By using a plurality of strip-shaped unit masks as in Patent Document 2, it is certainly possible to suppress positional deviation in one direction (transverse direction) in the frame opening to some extent, but the strip-shaped unit The problem of misalignment in the opening pattern in the other direction (longitudinal direction) cannot be resolved unless the masks are aligned accurately when each mask is attached to the frame. Therefore, the problem of misalignment of each unit masking pattern due to distortion due to the mask's own weight, etc., and the problem of difficulty in handling due to an increase in the total mass including the frame have not been fundamentally resolved.

JP-A-2003-332057 Japanese Patent Application Laid-Open No. 2003-217850

The present invention has been made in view of such circumstances, and provides a method for manufacturing a multi-faceted vapor deposition mask that can satisfy both high definition and weight reduction even when the mask is enlarged. To provide a multi-faceted vapor deposition mask obtained by the above method, a method for manufacturing an organic semiconductor device capable of manufacturing an organic semiconductor device with high precision, and a multi-faceted vapor deposition mask capable of manufacturing such a multi-faceted vapor deposition mask with high precision. The main object is to provide a preparation and a method for manufacturing this multi-faceted vapor deposition mask preparation.

The present invention for solving the above problems is a multi-faceted vapor deposition mask preparation body in which a plurality of vapor deposition mask preparation bodies are arranged in an open space within a frame, each of the vapor deposition mask preparation bodies having a through hole. It is characterized by a laminate structure in which a metal mask and a resin plate before the opening is formed are laminated.
The present invention for solving the above problems is a multi-face deposition mask preparation body in which a deposition mask preparation body is arranged in an opening space in a frame, wherein the deposition mask preparation body is a metal mask having through holes. It is characterized by a laminated structure in which a plurality of metal masks and one resin plate before forming openings overlapping the plurality of metal masks are laminated.
In the above invention, the frame and the metal mask may be joined by spot welding.
In the above invention, the frame and the metal mask are joined together, and a spot welded portion may be present at this joint portion.
In the above invention, when each vapor deposition mask preparation is viewed from the resin plate side, the metal mask is exposed from the resin plate, and the exposed portion of the metal mask and the frame are spot-welded. May be joined.
In the above invention, when each vapor deposition mask preparation is viewed from the resin plate side, the metal mask is exposed from the resin plate, and the exposed portion of the metal mask and the frame are joined. and spot welds may be present at this joint.
In the above invention, the frame and the metal mask may be point-bonded, and the metal mask and the resin plate may be surface-bonded.
In the above invention, a plurality of through holes may be provided in the metal mask. In the above invention, the through holes of the metal mask may be divided by bridges.
In the above invention, the metal mask may be a magnetic material.
In the above invention, the cross-sectional shape of the through-hole of the metal mask may be a shape that expands toward the vapor deposition source.
In the above invention, the metal mask may have a thickness of 5 μm or more and 100 μm or less.
Said invention WHEREIN: 3 micrometers or more and 25 micrometers or less may be sufficient as the thickness of the said resin board.
In the above invention, the thermal expansion coefficient of the resin plate may be 16 ppm/°C or less.
In the above invention, the resin plate may have a moisture absorption rate of 1% or less.
The present invention for solving the above-mentioned problems is a method for manufacturing a multi-faceted vapor deposition mask preparation body, comprising a step of attaching a plurality of metal masks having through holes to a frame having an open space; and attaching the resin plate to the mask before the opening is formed.
In the above invention, one or more resin plates may be attached, and at least one of the resin plates may overlap two or more of the metal masks.
The present invention for solving the above problems is a method for manufacturing a multi-faceted vapor deposition mask preparation body, comprising a step of attaching a plurality of metal plates before through holes are formed to a frame having an open space; The method includes a step of forming a through hole in the attached metal plate, and a step of attaching a resin plate before the opening is formed to the metal plate having the through hole.
In the above invention, one or a plurality of the resin plates may be attached, and at least one of the resin plates may overlap with two or more of the metal plates in which the through holes are formed.
The present invention for solving the above problems is a method for manufacturing a multifaceted vapor deposition mask preparation body, comprising a step of attaching a plurality of resin plates before openings are formed to a frame having an opening space; and attaching a metal mask having a through hole to the attached resin plate.
The present invention for solving the above problems is a method for manufacturing a multifaceted vapor deposition mask preparation body, comprising a step of attaching a plurality of resin plates before openings are formed to a frame having an opening space; The method includes a step of attaching a metal plate before the through holes are formed to the attached resin plate, and a step of forming the through holes in the metal plate attached to the frame.
The present invention for solving the above-mentioned problems is a method for manufacturing a multi-face deposition mask preparation body, comprising a step of preparing a deposition mask preparation body, and a step of fixing a plurality of deposition mask preparation bodies to a frame having an opening space. and wherein the vapor deposition mask preparation body has a laminated structure in which a metal mask having a through hole and a resin plate before the opening is formed are laminated.
The present invention for solving the above-mentioned problems is a method for manufacturing a multifaceted vapor deposition mask preparation body, comprising: a step of preparing a vapor deposition mask preparation body; and a step of fixing the vapor deposition mask preparation body to a frame having an opening space. The vapor deposition mask preparation body has a laminated structure in which a plurality of metal masks having through holes and one resin plate that overlaps with the plurality of metal masks and before the opening is formed are laminated. and

A method for manufacturing a multi-faceted vapor deposition mask in which a plurality of masks are arranged so as to partition an opening space in a frame in the vertical and horizontal directions, the frame, a plurality of metal masks provided with slits, and the Before and after the step of preparing a resin film material corresponding to each metal mask, the step of attaching the plurality of metal masks to the frame, and the step of attaching the metal masks to the frame, the resin film material is attached to the The method comprises a step of attaching a plurality of metal masks, and a step of fabricating resin masks by processing the resin film material to form openings corresponding to patterns to be deposited by vapor deposition. do. Alternatively, the present invention for solving the above problems is a method for manufacturing a multi-faceted vapor deposition mask in which a plurality of masks are arranged in an open space within a frame, partitioned in the vertical and horizontal directions, the frame being prepared. a step of attaching a plurality of metal masks provided with slits and a resin film material positioned on the surface side of the plurality of metal masks to the frame; and processing the resin film material. 1) forming a plurality of rows and columns of openings corresponding to a pattern to be produced by vapor deposition to produce a resin mask.
In the above invention, (1) the frame has crosspieces that divide the opening space into a plurality of pieces in the vertical and horizontal directions, and the resin film material has dimensions corresponding to each of the metal masks. A plurality of sheets may be used. In this case, before and after attaching each of the plurality of resin film materials to the crosspiece of the frame, metal masks can be arranged at predetermined positions on each of the resin film materials.

In the above invention, (2) the resin film material may be a single sheet covering substantially the entire opening space in the frame. In this case, the plurality of metal masks can be arranged at predetermined positions on the resin film material before and after the resin film material is attached to the frame.

In the above invention, (3) the resin film material has a length corresponding to the dimension of the open space in the frame in one of the vertical and horizontal directions, and has a length larger than the dimension of the open space in the other direction. A combination of a plurality of short lengths may also be used. Also in this case, the plurality of metal masks can be arranged at predetermined positions on the resin film material before and after the resin film material is attached to the frame.

Further, in the above invention, as the plurality of metal masks, some of the plurality of metal masks, for example, a metal mask aggregate member formed by integrally forming all or part of one row in the vertical and horizontal arrangement It is also possible to form and use a plurality of them.

Further, in the above invention, in arranging the metal mask in the frame, the maximum permissible error in the width direction of the slit between the designed arrangement position and the actual arrangement position is the pitch of the openings. , and the maximum permissible error in the length direction of the slit can be within 5 mm.

Further, in the above invention, instead of the step of attaching each metal mask and the resin film material for making the resin mask to the frame, a metal plate for making each metal mask, and , performing a step of attaching a resin film material for creating the resin mask, and processing the metal plate in a state in which the metal plate and the resin film material are attached to the frame to form a slit that penetrates only the metal plate is provided to form a metal mask, and then the resin film material is processed to form a plurality of rows and columns of openings corresponding to the pattern to be vapor-deposited.

Further, in the above invention, when forming a plurality of vertical and horizontal rows of openings corresponding to the pattern to be vapor-deposited by processing the resin film material, a reference plate on which the pattern corresponding to the openings is provided in advance is prepared. Then, this reference plate is attached to the side of the resin film material on which the metal mask is not provided, and while the pattern of the reference plate is recognized through the resin film material, the pattern of the reference plate is observed from the metal mask side. It is also possible to form an opening pattern in the resin film material by performing laser irradiation according to the method.

Further, the present invention for solving the above-mentioned problems is a multi-face deposition mask in which a plurality of masks are arranged so as to partition the opening space in the frame in the vertical and horizontal directions, each of the masks having a slit. and a resin mask having a plurality of rows and columns of openings corresponding to a pattern to be formed by vapor deposition located on the surface of the metal mask. Alternatively, the present invention for solving the above problems is a multi-faceted vapor deposition mask in which a plurality of masks are arranged in an opening space in a frame, and the frame has a rectangular outer shape. In addition to the frame portion, it has a crosspiece portion for partitioning the opening space formed by the outer frame portion into a plurality of pieces in the vertical and/or horizontal direction. It is characterized by comprising a metal mask, and a resin mask located on the surface of the metal mask and having openings corresponding to a pattern to be deposited by vapor deposition.

Moreover, the present invention for solving the above problems is a method for manufacturing an organic semiconductor device, and is characterized by using a multi-surface deposition mask manufactured by the manufacturing method having the above characteristics.

According to the method for manufacturing a multi-faceted vapor deposition mask of the present invention, each of the plurality of masks to be arranged in the frame is a metal mask provided with slits and a pattern to be formed by vapor deposition positioned on the surface of the metal mask. Since it is possible to reduce the weight by constructing the resin mask in which the corresponding openings are arranged in a plurality of rows and columns, the weight can be reduced even when the size is increased.

Furthermore, after the resin film material for forming the plurality of metal masks and the resin mask is arranged in the frame, the resin film material is processed to accurately provide openings corresponding to the pattern to be vapor-deposited. , fine precision is not required at the time of arranging the metal mask, and high definition of the mask is possible even if it is arranged relatively roughly. As described above, according to the present invention, it is possible to easily manufacture a multi-faceted vapor deposition mask that can satisfy both high definition and light weight with a high yield.

In addition, according to the multi-faceted vapor deposition mask of the present invention, as described above, both high definition and weight reduction can be achieved, so that vapor deposition processing in the manufacture of organic semiconductor elements and the like can be carried out with high accuracy. becomes.

Furthermore, according to the method for manufacturing an organic semiconductor element of the present invention, an organic semiconductor element can be manufactured with high accuracy.

BRIEF DESCRIPTION OF THE DRAWINGS It is drawing which shows typically the structure of one Embodiment of the multifaceted vapor deposition mask obtained by the manufacturing method of this invention. FIG. 2 is a schematic enlarged perspective view showing an exploded metal mask and a resin mask of the mask portion for explaining the configuration of each mask portion in one embodiment of the multi-faceted vapor deposition mask shown in FIG. 1, where (a) is the metal mask; , and (b) respectively show resin masks. (a) is a front view of each mask portion shown in FIG. 2 as seen from the metal mask side, (b) is a schematic cross-sectional view of the mask portion, and (c) and (d) are different embodiments. FIG. 2 is a front view of an example of a mask portion as seen from the metal mask side; It is an enlarged sectional view of the vapor deposition mask part shown in FIG.3(b). 1 is a front view of a vapor deposition mask viewed from the metal mask side, and (c) is a partially enlarged cross-sectional view of (b). (a) to (d) are schematic diagrams showing configuration examples of the frame of the multi-surface deposition mask obtained by the manufacturing method of the present invention. (a) to (d) are cross-sectional views schematically showing each step of the manufacturing method of the present invention. It is an expanded sectional view of the vapor deposition mask manufactured by the 2nd manufacturing method. 1(a) to 1(f) are schematic diagrams respectively showing examples of arrangement of a metal mask and a resin film material that can be used in the production method of the present invention. FIG. 4 is a schematic cross-sectional view showing the relationship between shadows and the thickness of a metal mask; FIG. 4 is a partial schematic cross-sectional view showing the relationship between slits in a metal mask and openings in a resin mask; FIG. 4 is a partial schematic cross-sectional view showing the relationship between slits in a metal mask and openings in a resin mask; FIG.

The present invention will be specifically described below with reference to the drawings.

First, before explaining the manufacturing method of the multi-imposition vapor deposition mask of the present invention, the configuration of the multi-imposition vapor deposition mask according to the present invention obtained by the manufacturing method will be described.

The multi-faceted vapor deposition mask of the present invention is a multi-faced vapor deposition mask in which a plurality of masks are arranged in an open space in a frame, each of which is divided in the vertical and horizontal directions. It is characterized by comprising a mask and a resin mask in which a plurality of rows of openings corresponding to a pattern to be formed by vapor deposition are arranged on the surface of the metal mask.

A multi-faceted vapor deposition mask 1 according to the present invention comprises, for example, as shown in FIG. 1, a plurality of masks 100 arranged in an open space 3 in a frame 2 divided in the vertical and horizontal directions.

Here, looking at the configuration of each of the masks 100 of the plurality of masks arranged in the frame 2, as shown in FIGS. A resin mask 20, which is positioned on the surface (the lower surface of the metal mask 10 in the case shown in FIG. 2(b)) and has openings 25 arranged in multiple rows and columns corresponding to the pattern to be produced by vapor deposition, is laminated. take configuration.

Here, when comparing the mass of the mask 100 and the mass of a conventionally known vapor deposition mask material composed only of metal, assuming that the thickness of the entire vapor deposition mask is the same, the metal of the conventionally known vapor deposition mask The mass of the vapor deposition mask 100 of the present invention is lightened by replacing a part of the material with the resin material. In addition, in order to reduce the weight of a vapor deposition mask composed only of metal, it is necessary to reduce the thickness of the vapor deposition mask. When the size is increased, the vapor deposition mask may be distorted or the durability may be lowered. On the other hand, according to the mask according to the present invention, even if the thickness of the entire vapor deposition mask is increased in order to satisfy distortion and durability when the size is increased, the presence of the resin mask 20 It can be made lighter than a vapor deposition mask made only of metal. Therefore, in the multi-faceted vapor deposition mask 1 of the present invention, which is formed by combining a plurality of vapor deposition masks 100 having such a structure, the weight reduction effect due to the use of the resin material as described above is particularly enhanced, and the size increases. However, the problem of misalignment of each unit masking pattern due to distortion due to its own weight, etc., and the problem of difficulty in handling due to an increase in the total mass including the frame can be resolved. In addition, by using a resin material, as will be described later, in the manufacturing process, after attaching a resin film (and a metal mask), which will be the original fabric of the resin mask, to the frame, the resin film is processed, Since the openings corresponding to the predetermined pattern can be formed, it is possible to solve the problem of misalignment of the openings when attaching the mask having the openings in advance to the frame. Furthermore, by using a resin film, as will be described later, for example, a reference plate having a pattern to be produced by vapor deposition, that is, a pattern corresponding to an opening to be formed, is prepared in advance, and this reference plate is attached to the resin film material. It is possible to form openings in the resin film material in a so-called face-to-face state, in which opening patterns are formed by laser irradiation or the like while observing the pattern of the reference plate in the bonded state, and the dimensional accuracy and position of the openings can be improved. A multi-faceted vapor deposition mask having extremely high-precision, high-definition openings can be obtained.

Each member constituting the multi-surface deposition mask of the present invention will be specifically described below.

(resin mask)
The resin mask 20 is made of resin, and as shown in FIG. 2B, a plurality of rows and columns of openings 25 corresponding to the pattern to be produced by vapor deposition are arranged. The opening 25 is formed after bonding the metal mask 10 and the resin film material 200, which is the original fabric of the resin mask 20, to the frame 2, as will be described later. Therefore, as shown in FIGS. 2 to 4, the openings 25 of the resin mask are formed at positions overlapping the slits 15 of the metal mask 10. FIG. In the specification of the present application, a pattern produced by vapor deposition means a pattern to be produced using the vapor deposition mask. It is the shape of the layer.

For the resin mask 20, a conventionally known resin material can be appropriately selected and used, and the material is not particularly limited. It is preferable to use a lightweight material with a small dimensional change rate and moisture absorption rate. Examples of such materials include polyimide resins, polyamide resins, polyamideimide resins, polyester resins, polyethylene resins, polyvinyl alcohol resins, polypropylene resins, polycarbonate resins, polystyrene resins, polyacrylonitrile resins, ethylene-vinyl acetate copolymer resins, ethylene- Examples include vinyl alcohol copolymer resin, ethylene-methacrylic acid copolymer resin, polyvinyl chloride resin, polyvinylidene chloride resin, cellophane, ionomer resin and the like. Among the materials exemplified above, a resin material having a coefficient of thermal expansion of 16 ppm/° C. or less is preferable, a resin material having a moisture absorption rate of 1.0% or less is preferable, and a resin material satisfying both conditions is particularly preferable. . In the present invention, as described above, the resin mask 20 is made of a resin material capable of forming the openings 25 with higher definition than metal materials. Therefore, the vapor deposition mask 100 having the highly precise openings 25 can be obtained.

The thickness of the resin mask 20 is not particularly limited, either. The resin mask 20 is preferably as thin as possible in order to prevent the formation of a film-thickness deposited portion, that is, a so-called shadow. However, if the thickness of the resin mask 20 is less than 3 μm, defects such as pinholes are likely to occur, and the risk of deformation increases. On the other hand, if it exceeds 25 μm, shadowing may occur. Considering this point, the thickness of the resin mask 20 is preferably 3 μm or more and 25 μm or less. By setting the thickness of the resin mask 20 within this range, it is possible to reduce the risk of defects such as pinholes and deformation, and to effectively prevent the occurrence of shadows. In particular, by setting the thickness of the resin mask 20 to 3 μm or more and 10 μm or less, more preferably 4 μm or more and 8 μm or less, it is possible to more effectively prevent the influence of shadows when forming a high-definition pattern exceeding 300 ppi. . In the mask 100, the metal mask 10 and the resin mask 20 may be joined directly or through an adhesive layer. When the resin mask 20 is bonded, the total thickness of the resin mask 20 and the pressure-sensitive adhesive layer should be 3 μm or more and 25 μm or less, preferably 3 μm or more and 10 μm, particularly preferably 4 μm, in consideration of the above shadow. It is preferable to set the thickness to be within the range of 8 μm or more.

The shape and size of the opening 25 are not particularly limited as long as the shape and size correspond to the pattern to be formed by vapor deposition. Further, as shown in FIG. 3A, the horizontal pitch P1 and the vertical pitch P2 of the adjacent openings 25 can also be appropriately set according to the pattern to be deposited.

The position of the opening 25 and the number of the openings 25 are not particularly limited. One opening may be provided at a position overlapping the slit 15, or a plurality of openings may be provided in the vertical or horizontal direction. For example, as shown in FIG. 3C, when the slit extends in the vertical direction, two or more openings 25 overlapping the slit 15 may be provided in the horizontal direction.

The cross-sectional shape of the opening 25 is not particularly limited, and the facing end surfaces of the resin mask forming the opening 25 may be substantially parallel to each other. 25 preferably has a cross-sectional shape that widens toward the vapor deposition source. In other words, it preferably has a tapered surface that widens toward the metal mask 10 side. When the vapor deposition mask of the present invention is used to perform vapor deposition using the vapor deposition mask of the present invention, it is possible to prevent the formation of shadows in the pattern formed by vapor deposition. The taper angle θ shown in FIG. 4 can be appropriately set in consideration of the thickness of the resin mask 20 and the like. is preferably within the range of 25° to 65°. In particular, within this range, it is preferable that the angle is smaller than the deposition angle of the deposition machine to be used. Furthermore, in FIGS. 3B and 4, the end surface 25a forming the opening 25 has a linear shape, but is not limited to this, and has an outwardly convex curved shape. In other words, the shape of the entire opening 25 may be bowl-shaped. The opening 25 having such a cross-sectional shape can be formed by, for example, adjusting the irradiation position of the laser and the irradiation energy of the laser when forming the opening 25, or by changing the irradiation position stepwise. It can be formed by irradiation.

Since the resin mask 20 is made of a resin material, the openings 25 can be formed without using a processing method used in conventional metal processing, such as etching or cutting. In other words, the method of forming the opening 25 is not particularly limited, and various processing methods such as laser processing, precision press processing, photolithography, etc., capable of forming the opening 25 with high definition are used. A portion 25 can be formed. A method of forming the openings 25 by laser processing or the like will be described later.

Examples of etching processing methods include a spray etching method in which an etchant is sprayed from a spray nozzle at a predetermined spray pressure, an immersion etching method in an etchant filled with an etchant, and a wet etching method in which an etchant is dropped. An etching method or a dry etching method using gas, plasma, or the like can be used.

(metal mask)
The metal mask 10 is made of metal, and when viewed from the front of the metal mask 10, the metal mask 10 has a vertical opening 25 at a position overlapping the openings 25, in other words, at a position where all the openings 25 arranged in the resin mask 20 can be seen. A plurality of rows of slits 15 extending in the direction or lateral direction are arranged. 2 and 3, the slits 15 extending in the vertical direction of the metal mask 10 are continuously arranged in the horizontal direction. Further, in the embodiment shown in FIGS. 2 and 3, an example in which the slits 15 extending in the vertical direction or the horizontal direction are arranged in a plurality of rows has been described. Only one row may be arranged in the horizontal direction.

Although the width W of the slit 15 is not particularly limited, it is preferably designed to be at least shorter than the pitch between adjacent openings 25 . Specifically, as shown in FIG. 3A, when the slits 15 extend vertically, the width W of the slits 15 in the horizontal direction is shorter than the pitch P1 of the openings 25 adjacent to each other in the horizontal direction. preferably. Similarly, although not shown, when the slits 15 extend laterally, the longitudinal width of the slits 15 is preferably shorter than the pitch P2 of the vertically adjacent openings 25 . On the other hand, when the slit 15 extends in the vertical direction, the length L in the vertical direction is not particularly limited. It may be appropriately designed according to the position.

Also, the slit 15 continuously extending in the vertical direction or the horizontal direction may be divided into a plurality of parts by the bridge 18 . 3(d) is a front view of the vapor deposition mask 100 viewed from the side of the metal mask 10, and one slit 15 extending continuously in the vertical direction shown in FIG. An example divided into (slits 15a and 15b) is shown. Although the width of the bridge 18 is not particularly limited, it is preferably about 5 μm to 20 μm. By setting the width of the bridge 18 within this range, the rigidity of the metal mask 10 can be effectively increased. The arrangement position of the bridge 18 is also not particularly limited, but it is preferable that the bridge 18 is arranged so that the slit after division overlaps two or more openings 25 .

The cross-sectional shape of the slit 15 formed in the metal mask 10 is also not particularly limited, but as with the opening 25 in the resin mask 20, as shown in FIG. It is preferable that the shape has a

The material of the metal mask 10 is not particularly limited, and conventionally known materials in the field of vapor deposition masks can be appropriately selected and used. Examples thereof include metal materials such as stainless steel, iron-nickel alloys, and aluminum alloys. . Among them, the Invar material, which is an iron-nickel alloy, can be suitably used because it is less deformed by heat.

Further, when performing vapor deposition on a substrate using the vapor deposition mask 100 of the present invention, if it is necessary to place a magnet or the like behind the substrate to attract the vapor deposition mask 100 in front of the substrate by magnetic force, the metal mask 10 can be used. is preferably made of a magnetic material. Examples of the magnetic metal mask 10 include pure iron, carbon steel, W steel, Cr steel, Co steel, KS steel, MK steel, NKS steel, Cunico steel, and Al--Fe alloy. If the material itself forming the metal mask 10 is not a magnetic material, the metal mask 10 may be magnetized by dispersing powder of the above magnetic material in the material.

Although the thickness of the metal mask 10 is not particularly limited, it is preferably about 5 μm to 100 μm. Considering the prevention of shadows during vapor deposition, the thickness of the metal mask 10 is preferably thin. However, in the present invention, since the metal mask 10 is integrated with the resin mask 20, even if the thickness of the metal mask 10 is as thin as 5 μm, the risk of breakage or deformation can be reduced. It can be used if it is 5 μm or more. If the thickness is more than 100 μm, shadows may occur, which is not preferable.

The relationship between the occurrence of shadows and the thickness of the metal mask 10 will be specifically described below with reference to FIGS. 8(a) to 8(c). As shown in FIG. 8A, when the thickness of the metal mask 10 is thin, the vapor deposition material emitted from the vapor deposition source toward the object to be vapor-deposited is the inner wall surface of the slit 15 of the metal mask 10 and the thickness of the metal mask. 10 passes through the slit 15 of the metal mask 10 and the opening 25 of the resin mask 20 without colliding with the surface on which the resin mask 20 is not provided, and reaches the vapor deposition object. As a result, it becomes possible to form a vapor deposition pattern with a uniform film thickness on the object to be vapor deposited. That is, it is possible to prevent the occurrence of shadows. On the other hand, as shown in FIG. 8B, when the thickness of the metal mask 10 is large, for example, when the thickness of the metal mask 10 exceeds 100 μm, part of the vapor deposition material discharged from the vapor deposition source collides with the inner wall surface of the slit 15 of the metal mask 10 and the surface of the metal mask 10 on which the resin mask 20 is not formed, and cannot reach the vapor deposition object. As the amount of the vapor deposition material that cannot reach the vapor deposition object increases, shadows are generated in which an undeposited portion having a thinner film thickness than the target vapor deposition film is generated on the vapor deposition object.

In order to sufficiently prevent the generation of shadows, it is preferable that the cross-sectional shape of the slit 15 be made to have a shape that widens toward the vapor deposition source, as shown in FIG. 8(c). With such a cross-sectional shape, even if the thickness of the entire deposition mask is increased for the purpose of preventing distortion that may occur in the deposition mask 100 or improving durability, the vapor is emitted from the deposition source. The deposited vapor deposition material can reach the vapor deposition object without colliding with the surface of the slit 15 or the inner wall surface of the slit 15 . More specifically, the angle between the bottom surface of the metal mask 10 and the bottom surface of the metal mask 10 is between 25° and 65°. preferably within the range. In particular, within this range, it is preferable that the angle is smaller than the deposition angle of the deposition machine to be used. With such a cross-sectional shape, even if the thickness of the metal mask 10 is made relatively thick for the purpose of preventing distortion that may occur in the vapor deposition mask 100 or improving durability, the The vapor deposition material can reach the object to be vapor deposited without colliding with the inner wall surface of the slit 15 . Thereby, shadow generation can be prevented more effectively. FIG. 8 is a partial schematic cross-sectional view for explaining the relationship between shadow generation and the slit 15 of the metal mask 10. As shown in FIG. In the form shown in FIG. 8C, the slit 15 of the metal mask 10 has a shape that widens toward the deposition source side, and the opposing end faces of the openings of the resin mask 20 are substantially parallel. However, in order to more effectively prevent the occurrence of shadows, both the slits of the metal mask 10 and the openings 25 of the resin mask 20 have cross-sectional shapes that widen toward the deposition source side. preferably. Therefore, in the method of manufacturing a multi-faceted vapor deposition mask of the present invention, the slits of the metal mask 10 and the slits 15 of the metal mask 10 and the cross-sectional shape of the openings of the resin mask are formed so as to widen toward the vapor deposition source side. , the opening 25 of the resin mask 20 is preferably manufactured.

9A to 9D are partial schematic cross-sectional views showing the relationship between the slits of the metal mask and the openings of the resin mask. The cross-sectional shape of the entire opening formed by 25 has a stepped shape. As shown in FIG. 9, the formation of a shadow can be effectively prevented by forming the cross-sectional shape of the entire opening into a stepped shape that widens toward the vapor deposition source.

Therefore, in the manufacturing method of the multi-surface deposition mask of the present invention, it is preferable to manufacture so that the cross-sectional shape of the entire opening formed by the slits of the metal mask and the openings 25 of the resin mask has a stepped shape.

The slit 15 of the metal mask and the cross-sectional shape of the resin mask 20 may be substantially parallel to each other as shown in FIG. 9(a). Alternatively, either the slit 15 of the metal mask or the opening of the resin mask may have a cross-sectional shape that widens toward the vapor deposition source. As described above, in order to more effectively prevent the occurrence of shadows, the slits 15 of the metal mask and the openings 25 of the resin mask should be arranged as shown in FIG. 4 and FIG. 9(d). In addition, it is preferable that both have cross-sectional shapes that widen toward the vapor deposition source side.

The width of the flat portion (marked (X) in FIG. 9) in the stepped cross section is not particularly limited, but when the width of the flat portion (X) is less than 1 μm, the slit of the metal mask Interference tends to reduce the effect of preventing the occurrence of shadows. Therefore, considering this point, the width of the flat portion (X) is preferably 1 μm or more. A preferable upper limit is not particularly limited, and can be appropriately set in consideration of the size of the openings of the resin mask, the interval between adjacent openings, and the like, and is about 20 μm as an example.

Note that FIGS. 9A to 9D show an example in which one opening 25 overlapping the slit 15 is provided in the horizontal direction when the slit extends in the vertical direction, but FIG. 2, when the slit extends in the vertical direction, two or more openings 25 overlapping the slit 15 may be provided in the horizontal direction. In FIG. 10, both the slit 15 of the metal mask and the opening 25 of the resin mask have cross-sectional shapes that widen toward the vapor deposition source side, and the opening 25 overlapping the slit 15 extends in the lateral direction. Two or more are provided.

(flame)
Next, the configuration of the frame 2 for holding a plurality of masks 100 configured by combining the metal mask 10 and the resin mask 20 as described above is not particularly limited. In the embodiment shown, the frame 2 has a rectangular outer frame portion 2a, and also longitudinal crosspiece portions 2b for dividing the opening space 3 formed by the outer frame portion into a plurality of sections in the vertical and horizontal directions. However, as long as the frame 2 has at least the outer frame portion 2a, the presence or absence of the vertical crosspiece portion 2b and the horizontal crosspiece portion 2c is optional. is. For example, as shown in FIG. 5(a), the frame 2 consists of only the outer frame portion 2a, and as shown in FIGS. It is also possible to configure the frame 2 or the like made up of any one of the portions 2c.

Further, for example, as shown in FIG. 5(d), a frame 2 having an outer frame portion 2a, a vertical crosspiece portion 2b, and a horizontal crosspiece portion 2c as shown in FIG. It is also possible to separately prepare a plurality of small frame members 3 that can be attached to the openings corresponding to the respective masks defined by the directional crosspiece portion 2b and the horizontal crosspiece portion 2c. In this case, a resin film material 200 and a metal mask 10 are placed on each of the plurality of small frame members 3, as will be described later, and then the small frame members are placed in the openings corresponding to the respective masks of the frame 2, which is the main body portion. 3 can be arranged and joined.

As shown in FIGS. 5(b) and 5(c), even if the frame 2 is composed of the outer frame portion 2a and either the vertical crosspiece portion 2b or the horizontal crosspiece portion 2c, these frames 2 are As the main body, it is also possible to separately prepare a plurality of small frame members 3 corresponding to each mask in the same manner as shown in FIG. In this case, the frame 2, which is the main body portion, has only the vertical crosspiece portion 2b or the horizontal crosspiece portion 2c. The pier will be made up.

(Manufacturing method of the present invention)
A method of manufacturing a multi-faceted vapor deposition mask according to the present invention is a method of manufacturing a multi-faced vapor deposition mask in which a plurality of masks 100 are arranged in an open space 3 in a frame 2, which is partitioned in the vertical and horizontal directions. As described above, each mask 100 is composed of a metal mask 10 provided with slits, and a resin mask 20 positioned on the surface of the metal mask and having a plurality of rows and columns of openings corresponding to the pattern to be produced by vapor deposition. In the configuration, after attaching each metal mask 10 and a resin film material 200 for creating the resin mask to the frame 2, the resin film material 200 is processed to create a pattern by vapor deposition A plurality of rows and columns of openings corresponding to .

FIG. 6 is a process drawing for explaining the method of manufacturing the multi-surface deposition mask of the present invention. Note that (a) to (d) are all cross-sectional views, and the thickness and dimensions of each member are exaggerated for ease of illustration.

As shown in FIG. 6(a), first, frame 2 is prepared.

To this frame 2, as shown in FIG. 6B, a plurality of metal masks 10 provided with slits and a resin film material 200 positioned on the surface side of the plurality of metal masks are attached.

Here, regarding the positional accuracy of the arrangement of the metal mask 10 with respect to the frame 2, of course there is no problem if the accuracy is high. 10 and the resin film material 200 for forming the resin mask, the resin film material 200 is processed to accurately provide openings corresponding to the pattern to be vapor-deposited. A particularly high precision is not required for the mask, and high definition of the mask is possible even if the mask is arranged relatively coarsely. For example, in arranging the metal mask 10 in the frame 2, the maximum permissible error in the width direction of the slit between the designed arrangement position and the actual arrangement position is 0.00 of the pitch P1 of the openings 25. It is within 2 times, preferably within 0.15 times, and even if the maximum allowable error in the length direction of the slit is within 5 mm, there is no risk of lowering the product yield, and work efficiency can be improved. can.

The method and order of attaching the plurality of metal masks 10 and the resin film members 200 to the frame 2 are not particularly limited, and various modes are possible. This point will be described in detail below.

After that, as shown in FIG. 6(c), a plurality of metal masks and the resin film material are all attached to the frame 2, and the resin film material 200 is processed to obtain the state shown in FIG. 6(d). As shown, a multi-faceted vapor deposition mask is manufactured by forming a plurality of rows and columns of openings corresponding to a pattern to be vapor deposited in a resin film to manufacture a resin mask 20 . The method of processing the resin film material 200 to form the openings is not particularly limited, but for example, it can be performed by pattern opening by a conventionally known laser processing method. to form a plurality of rows and columns of openings corresponding to the pattern to be vapor-deposited on the resin plate. In the specification of the present application, a pattern to be produced by vapor deposition means a pattern to be produced using the vapor deposition mask. It is the shape of the layer.

As described above, in a state in which all of the plurality of metal masks and the resin film material are attached and fixed to the frame 2, when the resin film material 200 is processed to form an opening, vapor deposition is performed. A reference plate having a pattern corresponding to the opening 25 to be formed was prepared in advance, and this reference plate was attached to the surface of the resin film material 200 on which the metal mask 10 was not provided. In this state, laser irradiation corresponding to the pattern of the reference plate may be performed from the metal mask 10 side. According to this method, the openings 25 can be formed in the resin film material 200 in a so-called face-to-face state in which laser irradiation is performed while viewing the pattern of the reference plate bonded to the resin film material 200. It is possible to form the resin mask 20 having the highly precise openings 25 with extremely high dimensional accuracy. Further, in this method, since the openings 25 are formed in a state of being fixed to the frame, it is possible to obtain a vapor deposition mask excellent not only in dimensional accuracy but also in positional accuracy.

When using the above method, it is necessary to be able to recognize the pattern of the reference plate from the metal mask 10 side through the resin film material 200 with a laser irradiation device or the like. As the resin film material 200, if it has a certain thickness, it is necessary to use a material having transparency. , the pattern of the reference plate can be recognized even with a colored resin film material.

The method of adhering the resin film 200 and the reference plate is also not particularly limited. It can be stuck together by pulling the plate. In addition to this, bonding can also be performed using an electrostatic adsorption method or the like. Examples of the reference plate include a TFT substrate having a predetermined pattern, a photomask, and the like.

(Optional items in the manufacturing method of the present invention: method and order of attaching metal mask and resin film material to frame)
As described above, in the manufacturing method of the present invention, the method and order of attaching the plurality of metal masks 10 and the resin film material 200 to the frame 2 are not particularly limited, and various aspects can be adopted. .

That is, as a method for supporting the metal mask 10 and the resin film material 200 with respect to the frame 2, (A) the metal mask 10 is joined to the frame 2 by, for example, spot welding, and is adhered to the metal mask 10; A method of supporting the resin film material 200 bonded by adhesive, adhesive, fusion, etc. to the frame 2 (In this case, the area of the resin film material is equal to or slightly smaller than the area of the metal mask.) Alternatively, (B) the resin film material 200 is joined to the frame 2 by adhesive, adhesive, welding (high-frequency fusion, etc.), or the like, and the adhesive or adhesive is similarly applied on the resin film material. , a method of supporting the metal mask 10 joined by welding (high-frequency welding, etc.) to the frame 2 (in this case, the metal mask has a smaller area than the resin film material, and It is also possible to arrange a plurality of metal masks.). Also, in both aspects (A) and (B), the bonding of the metal mask 10 or the resin film material 200 to the frame 2 and the bonding of the metal mask 10 and the resin film material 200 are determined first. may be

The resin film material may be a resin layer obtained by coating a metal plate, which is the original plate of the metal mask 10, with a resin liquid. In the aspect (A) above, the metal plate serving as the original plate of the metal mask 10 is coated with a resin liquid to form a resin film layer, or, for example, when the metal plate is spread, the resin is coated. It is also possible to use a resin film-coated metal plate manufactured by performing the above. Alternatively, a metal plate with a resin layer can be obtained by bonding a resin plate to a metal plate. As a method for bonding the metal plate and the resin plate, for example, various adhesives may be used, or a self-adhesive resin plate may be used. In this case, a metal mask 10 to which the resin film material 200 is bonded is formed by forming a slit penetrating only the metal plate with the resin film material coated on the surface thereof. This process is not particularly limited, and any process can be used as long as the desired slits can be formed only in the metal mask. For example, a known dry or wet etching method or the like can be employed. The formation of metal slits from such a metal plate can also be performed either before or after joining the resin film-coated metal plate to the frame 2 .

Since the resin film layer changes over time under the influence of temperature or humidity for a certain period after molding, it is preferable to provide a so-called aging period until the shape settles from the viewpoint of yield improvement.

Moreover, in the aspect (B) above, various aspects can be adopted as the method of arranging the metal mask on the resin film material 200 . Examples of such embodiments are shown in FIGS. 7(a)-(f).

The embodiment shown in FIG. 7A shows an example of using a plurality of resin film materials 200 corresponding to each of the plurality of metal masks 10 on a one-to-one basis.

In this embodiment, as the frame 2 used, a frame having an outer frame portion 2a, a vertical crosspiece portion 2b and a horizontal crosspiece portion 2c as shown in FIG. A plurality of small frame members 4 as shown in (d) are separately prepared, and the resin film material 200 having one metal mask 10 arranged is bonded to each opening corresponding to each mask. Incidentally, each metal mask 10 can be joined to each resin film material 200 either before or after each resin film material 200 is joined to the frame 2 .

The embodiment shown in FIGS. 7(b) to 7(d) shows an example of using one sheet of resin film material 200 that substantially covers the entire surface of the opening space in the frame.

In the embodiment of FIG. 7B, a plurality of metal masks 10 are arranged in the vertical and horizontal directions of the resin film material 200 .

It should be noted that the plurality of metal masks 10 do not necessarily need to be formed as separate members as shown in FIG. 7(b). It is also possible to use a plurality of metal mask assembly members integrally formed from all or part of one row in the vertical and horizontal arrangement. The embodiment shown in FIGS. 7(c) and 7(d) shows such an example, and in the embodiment of FIG. An integrally formed metal mask assembly member 300 is prepared, and a plurality of metal mask assembly members 300 are arranged in the horizontal direction in the figure. Also in the embodiment of FIG. 7(d), similarly to FIG. 7(c), a metal mask aggregate member 301 is formed by integrally forming a plurality of metal masks in the vertical direction of the drawing. However, unlike the metal mask assembly member 300 shown in FIG. 301 is formed with a slit 315 formed in the vertical direction in the drawing so as to be continuous over almost the entire length thereof. Even in the mode shown in FIG. 7(d), the shape of the frame 2 is suitable, that is, the outer frame portion 2a, the vertical crosspiece portion 2b, and the horizontal crosspiece portion shown in FIG. By using a frame having 2c, or a frame having outer frame portion 2a and lateral crosspiece portion 2c, or the like in combination, individual metal masks can be partitioned. In the embodiment shown in FIG. 7(d), the metal mask assembly member is attached to the resin film material 200 prior to joining the resin film material 200 to the frame 2 due to the positional relationship with the crosspiece of the frame 2. 301 must be placed.

In the embodiment shown in FIGS. 7(e) and 7(f), the resin film material 200 has a length corresponding to the dimension in either one of the vertical and horizontal directions of the opening space in the frame 2, and the other dimension. This shows an example of combining a plurality of sheets having a length shorter than the dimension of the opening space in the direction of . That is, in the embodiment shown in FIGS. 7(e) and 7(f), in the vertical direction of the drawing, the opening space has a length corresponding to the vertical dimension of the opening space in the frame 2 to be mounted. This is an example in which a plurality of the resin film materials 200 having a length shorter than the horizontal and vertical dimensions are combined.

The larger the area of the resin film material, the larger the dimensional change due to external stress, thermal expansion or contraction, etc. applied when it is attached to the frame 2. In this way, the resin film material tends to undergo relatively large changes. By shortening the length, it is possible to reduce these defects.

In the embodiment of FIG. 7(e), a plurality of metal masks 10 are arranged one by one in the longitudinal direction of each short-width resin film material 200 as described above. The bonding of the plurality of metal masks 10 to the resin film material 200 can be performed either before or after bonding each resin film material 200 to the frame 2 .

In the embodiment of FIG. 7(f), metal mask aggregate members 301 having the same shape as shown in FIG. 7(d) are arranged one by one. The shape of the frame 2 combined with the metal mask assembly member 301 is the same as that described in the embodiment of FIG. 7(d). In such an embodiment, it is necessary to arrange the metal mask assembly member 301 on the resin film material 200 before joining the resin film material 200 to the frame 2, as described above.

(Optional items in the manufacturing method of the present invention: slimming step)
In addition, in the manufacturing method of the present invention, a slimming step may be performed between the steps described above or after the steps. This step is an arbitrary step in the manufacturing method of the present invention, and is a step of optimizing the thickness of the metal mask 10 and the thickness of the resin mask 20 . A preferable thickness of the metal mask 10 or the resin mask 20 may be appropriately set within the preferable range described above, and detailed description thereof will be omitted here.

For example, when a metal plate with a resin film having a certain thickness is used as the metal plate with a resin film, the metal plate with a resin film and the metal mask 10 with a resin film are transported in the manufacturing process by the above manufacturing method. It is possible to impart excellent durability and transportability when transporting the multifaceted vapor deposition mask 1 . On the other hand, in order to prevent the generation of shadows and the like, the thickness of each vapor deposition mask 100 incorporated in the multifaceted vapor deposition mask 1 obtained by the manufacturing method of the present invention is preferably an optimum thickness. The slimming process is a useful process for optimizing the thickness of the vapor deposition mask 100 while satisfying durability and transportability during or after the manufacturing process.

Slimming of the metal plate to be the metal mask 10 and the metal mask 10, that is, optimization of the thickness of the metal mask, is performed by removing the surface of the metal plate that is not in contact with the resin film 200 or the surface of the metal plate between or after the above-described steps. This can be realized by etching the surface of the mask 10 that is not in contact with the resin film 200 or the resin mask 20 using an etchant capable of etching the metal plate or the metal mask 10 .

The same applies to slimming of the resin film 200 and the resin mask 20 to be the resin mask 20, that is, optimization of the thickness of the resin film 200 and the resin mask 20. The surface of the film 200 that is not in contact with the metal plate or the metal mask 10 or the surface of the resin mask 20 that is not in contact with the metal mask 10 is etched using an etching material capable of etching the material of the resin film 200 or the resin mask 20. It can be realized by etching. Also, by etching both the metal mask 10 and the resin mask 20 after forming the multifaceted vapor deposition mask 1, the thicknesses of both can be optimized.

In the slimming process, the etching material for etching the resin film 200 or the resin mask 20 may be appropriately set according to the resin material of the resin film 200 or the resin mask 20, and is not particularly limited. For example, when polyimide resin is used as the resin material for the resin film 200 and the resin mask 20, an alkaline aqueous solution in which sodium hydroxide or potassium hydroxide is dissolved, hydrazine, or the like can be used as the etching material. A commercially available etching material can be used as it is, and TPE3000 manufactured by Toray Engineering Co., Ltd. can be used as an etching material for polyimide resin.

(Method for producing organic semiconductor element)
The method of manufacturing an organic semiconductor element of the present invention is characterized by forming an organic semiconductor element using the multifaceted vapor deposition mask 1 manufactured by the manufacturing method of the present invention described above. As for the multifaceted vapor deposition mask 1, the multifaceted vapor deposition mask 1 manufactured by the manufacturing method of the present invention described above can be used as it is, and detailed description thereof will be omitted here. According to the multi-surface deposition mask of the present invention described above, the organic semiconductor element having a high-definition pattern is formed by the highly precise openings 25 of the respective deposition masks 100 arranged in the multi-surface deposition mask 1. can be formed. Examples of the organic semiconductor device manufactured by the manufacturing method of the present invention include an organic layer, a light-emitting layer, a cathode electrode, and the like of an organic EL device. In particular, the method for manufacturing an organic semiconductor element of the present invention can be suitably used for manufacturing R, G, and B light-emitting layers of an organic EL element that requires high-definition pattern accuracy.

Although the present invention has been specifically described above based on its embodiments, the present invention is not limited to the above-described embodiments, and various forms can be adopted within the scope of the claims. It is possible.

REFERENCE SIGNS LIST 1 multifaceted vapor deposition mask 2 frame 3 open space in frame 100 vapor deposition mask 10 metal mask 15 slit 18 bridge 20 resin mask 25 opening 200 resin film material

Claims (2)

A method for manufacturing a multi-faceted vapor deposition mask preparation, comprising:
A step of attaching a plurality of resin plates before the openings are formed to a frame having an opening space;
and a step of attaching a metal mask having through holes to the resin plate attached to the frame. A method for manufacturing a multi-faceted vapor deposition mask preparation, comprising:
A step of attaching a plurality of resin plates before the openings are formed to a frame having an opening space;
a step of attaching a metal plate before the through holes are formed to the resin plate attached to the frame;
and forming through holes in the metal plate attached to the frame.

Images