JP2005174843A - Deposition mask and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To cope with high-precision patterning even in the case the in-plane temperature distribution of a deposition mask is uneven, by removing adverse effects due to the unevenness of the temperature distribution as much as possible. <P>SOLUTION: The deposition mask is provided with a thin-plate mask body formed as a pass-through hole in a pattern-forming area 4 for a deposition pattern to pass through to a deposited substrate, and a frame body 3 where parts other than the pattern-forming area 4 in the mask main body are laid down. The mask body is composed of a plurality of mask sheets 6 formed in a belt shape. The mask sheets 6 are arrayed in parallel, and the vicinity 7 of both short sides is firmly fixed to the frame body 3 by a tensile force added in a direction along long sides for each belt-shape sheet. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a vapor deposition mask used for depositing a predetermined pattern on a vapor deposition substrate and a method for manufacturing the same.

  In general, in the manufacturing process of an organic electroluminescent device (organic electroluminescent device; hereinafter referred to as “organic EL device”), the organic material forming the organic layer is low in water resistance and cannot use a wet process. An organic layer (thin film) is formed on the substrate. Further, in the manufacturing process of the organic EL element, in order to perform patterning film formation (for example, film formation corresponding to each color component of R, G, B) on the substrate, the shape corresponding to the vapor deposition pattern is usually used. A vapor deposition mask having an opening (passage hole for organic material) is used.

  Conventionally, as a mask for vapor deposition, a mask main body in which an opening having a shape corresponding to a vapor deposition pattern is formed in a pattern formation region, and a portion other than the pattern formation region of the mask main body (for example, a region near the outer periphery of the mask main body) And a frame body to which is attached). The mask main body is made of a thin plate member such as a copper plate, a nickel plate, a rolled stainless steel plate or the like, and an opening is provided in the pattern formation region by etching or laser processing. On the other hand, the frame has a sufficient thickness and high rigidity made of a material having a thermal linear expansion coefficient equivalent to that of the deposition target substrate (for example, a glass substrate). And the mask for vapor deposition which consists of these mask main bodies and a frame is fixed to the frame in the state where tension was given to the mask main body so that slack may not arise in the mask main body (for example, patent) Reference 1).

  When patterning film formation on a substrate is performed using such an evaporation mask, a crucible 12 containing an organic material 11 and a heat source 13 for heating the crucible 12 are usually provided as shown in FIG. In recent years, a so-called “line type vapor deposition method” is often employed in which a plurality of openings 14 through which an organic material evaporating from the crucible 12 passes are arranged in a line. In the line-type vapor deposition method, as shown in FIG. 7A, with respect to the vapor deposition source 10 having a plurality of openings 14 arranged in a row, in a direction orthogonal to the direction in which these openings 14 are arranged (see arrows in the figure). ), The deposition mask and the deposition target substrate 20 are moved to form an organic layer on the deposition target substrate. This facilitates the formation of an organic layer over a large area, and enables efficient film formation with a small amount of material consumption even when the organic layer is formed over a plurality of layers, for example. This is because it becomes possible (see, for example, Patent Document 2).

Registered Utility Model No. 3082805 JP 2003-157773 A

  By the way, in the line type vapor deposition method, the vapor deposition mask passes above the vapor deposition source 10 in which the openings 14 are arranged in a row in a direction orthogonal to the direction in which the openings 14 are arranged. At this time, the vapor deposition source 10 is heated to a high temperature. For this reason, when the vapor deposition mask passes over the vapor deposition source 10, it receives radiant heat from the vapor deposition source and changes in temperature distribution in the plane. Specifically, for example, as shown in FIG. 8, as the vapor deposition mask 20a and the vapor deposition substrate 20b pass over the vapor deposition source 10, the temperature starts from the head portion in the traveling direction of the vapor deposition mask 20a. As the temperature begins to rise, the temperature rise range moves downstream in the traveling direction. Then, as the distance from the vapor deposition source 10 increases, the once raised temperature is released by the heat radiation to the surroundings and falls.

  FIG. 9 is an explanatory diagram showing a specific example of the in-plane temperature distribution of the vapor deposition mask immediately after passing through the vapor deposition source in the line-type vapor deposition method. As shown in the figure, the in-plane temperature distribution of the vapor deposition mask 20a when passing over the vapor deposition source 10 corresponding to the line vapor deposition method is determined based on the positional relationship between the vapor deposition source 10 and the vapor deposition mask 20a. Although it is relatively constant in the width direction of the vapor deposition source 10 (see XX in the figure) perpendicular to the direction of travel of the mask 20a, the temperature in the direction of travel of the vapor deposition mask 20a (see YY in the figure) is large. There is a difference. Thus, when a temperature difference occurs in the pattern formation region of the single mask body constituting the vapor deposition mask 20a, the material at the higher temperature expands more than the material at the lower temperature, so that the same pattern formation region Even within, a difference appears in the deformation movement state depending on each position in the mask surface. The arrows on the vapor deposition mask 20a in the figure indicate the direction and size of movement of each position on the mask surface.

  The difference in the deformation movement state at each position on the mask surface as described above causes a difference in the position change of each hole in the pattern formation region, so that the position accuracy of the vapor deposition pattern formed by each of these holes is maintained well. It leads to things that cannot be done. In other words, even if the vapor deposition mask 20a is configured by applying tension to the mask body and fixing it to the frame body, the position accuracy of the vapor deposition pattern can be maintained when the mask main body changes in temperature uniformly. When the in-plane temperature distribution of the vapor deposition mask 20a is not uniform as when passing over the vapor deposition source 10 corresponding to the line type vapor deposition method (when a temperature difference occurs in the pattern formation region of the mask body). However, the position accuracy of the vapor deposition pattern cannot always be maintained satisfactorily. Such a problem with respect to the pattern position accuracy results in a decrease in the formation accuracy of the organic layer by the vapor deposition mask 20a, and there is a possibility that the display image quality improvement may be hindered in the manufacturing process of the organic EL element. .

  Therefore, even if the in-plane temperature distribution of the evaporation mask is non-uniform, the present invention can eliminate the adverse effects due to the non-uniform temperature distribution as much as possible, and can cope with high-precision patterning. An object of the present invention is to provide an evaporation mask and a method for manufacturing the same.

  The present invention is a vapor deposition mask devised to achieve the above object. That is, for vapor deposition comprising a thin plate-like mask main body in which a vapor deposition pattern on a substrate to be vapor-deposited is formed as a through hole in a pattern formation region, and a frame to which a portion other than the pattern formation region in the mask main body is fixed. In the mask, the mask body is composed of a plurality of mask sheets formed in a strip shape, and the plurality of mask sheets are arranged in parallel, and each is given a tension in a direction along the long side of the strip shape. In this state, the belt-like portions near both short sides are fixed to the frame.

  Moreover, this invention is the manufacturing method of the mask for vapor deposition devised in order to achieve the said objective. That is, for vapor deposition comprising a thin plate-like mask main body in which a vapor deposition pattern on a substrate to be vapor-deposited is formed as a through hole in a pattern formation region, and a frame to which a portion other than the pattern formation region in the mask main body is fixed. In the mask manufacturing method, the mask main body is formed of a plurality of strip-shaped mask sheets, the mask sheets are arranged in parallel on the frame body, and the direction along the strip-shaped long side of each of the mask sheets is The belt-like portions near both short sides are fixed to the frame body in a state where the tension is applied.

  According to the vapor deposition mask having the above configuration and the vapor deposition mask manufacturing method according to the above procedure, since the mask body is divided into a plurality of strip-shaped mask sheets, for example, the vapor deposition mask corresponds to the line type vapor deposition method. Even when passing over the upper surface of the film, it is possible to make the longitudinal direction of the line-type deposition source coincide with the strip-like longitudinal direction of each mask sheet, and thereby the in-plane temperature in the traveling direction of the deposition mask. Even when the distribution is non-uniform, the temperature difference in the short band direction of each mask sheet can be reduced. In addition, since the belt-like mask sheet is fixed to the frame by applying a tension in the direction along the belt-like long side (one longitudinal direction), the stress and strain distribution in the mask sheet tends to be uniform.

  In the present invention, even when the in-plane temperature distribution of the evaporation mask is not uniform, the mask main body is divided into a plurality of strip-shaped mask sheets, thereby reducing the temperature difference in the strip-shaped lateral direction of each mask sheet. Since the adverse effects due to the non-uniformity of the temperature distribution can be eliminated as much as possible, the pattern deformation due to the change in the temperature distribution can be suppressed and the deposition pattern can be highly accurate. Also, by applying tension in one longitudinal direction to the belt-shaped mask sheet and fixing it to the frame, the stress and strain distribution in the mask sheet tends to become uniform, so the mask sheet can be fixed to the frame accurately. It is possible to perform well, and it is possible to suppress a change in position when the temperature rises. Furthermore, by arranging the strip-shaped mask sheets in parallel, it becomes very easy to cope with a vapor deposition pattern with a large area, and even in that case, the area per mask sheet can be reduced, so that the pattern formation region It becomes easy to maintain high processing accuracy of the inner passage holes and the like.

  Hereinafter, the vapor deposition mask and the manufacturing method thereof according to the present invention will be described with reference to the drawings. 1 to 4 are schematic views showing an example of a schematic configuration of a vapor deposition mask according to the present invention.

  As shown in FIG. 1, the vapor deposition mask 1 described here includes a mask body 2 and a frame 3.

  The mask body 2 is made of a thin plate member such as a copper plate, a nickel plate, a rolled stainless steel plate or the like, and the region on the plane is roughly divided into a pattern formation region 4 and other portions. And in the pattern formation area 4, the opening 5 of the shape corresponding to a vapor deposition pattern is formed as an organic material passage hole by etching, laser processing, or the like. The pattern formation region 4 is not limited to a rectangular shape, and may have various arbitrary shapes. Further, the mask body 2 may be formed of a thin metal film such as nickel in which a large number of fine holes 5 are provided in the pattern formation region 4 by the “electroforming (plating) manufacturing method”. .

  On the other hand, the frame body 3 is formed in a shape corresponding to the outer peripheral edge of the mask main body 2 and is for supporting a portion other than the pattern formation region 4 of the mask main body 2. Here, the frame 3 has a linear thermal expansion coefficient, a heat capacity, a surface radiation emission rate, a heat transfer amount flowing in and out by the surrounding support and heat conduction, etc., and a temperature change at the time of vapor deposition. In order to synchronize and match the dimensional change in expansion and contraction due to the above, it is assumed that the optimal adjustment is set.

  By the way, in the vapor deposition mask 1 described here, as shown in FIG. 2, the mask main body 2 is composed of a plurality of mask sheets 6 formed in a strip shape. That is, the mask body 2 is divided into a plurality of strip-shaped mask sheets 6. Here, the “strip shape” means a rectangular shape composed of a long side and a short side. The number of divisions into the mask sheet 6 may be appropriately set in consideration of the size of the mask body 2, the size of the mask sheet 6 in the belt-like short direction, the vapor deposition pattern formed in the pattern formation region 4, and the like. It is done. In addition, the size of the mask sheet 6 in the short width direction, that is, the size of the short side in the belt shape, is determined by taking into consideration the thermal expansion coefficient of the forming material of the mask sheet 6 (mask main body 2), the radiation heat from the evaporation source, and the like. What is necessary is just to set so that the thermal expansion amount or thermal contraction amount in the short side direction may be a predetermined allowable value or less. In addition, although the size of the short side of each mask sheet 6 can be considered to be the same, it is also possible to make each different depending on the convenience of the shape of the vapor deposition pattern.

  These mask sheets 6 are arranged in parallel on the frame 3, thereby constituting one mask body 2. More specifically, the belt-like portions 7 near both short sides are fixed to the frame 3 in a state where each of the mask sheets 6 is given a tension in the direction along the belt-like long side (see the arrow in the figure). . By fixing in a state where such tension is applied, each mask sheet 6 expands and contracts in accordance with the substantially frame body 3 in the long side direction of the belt-like shape. The change can be expanded and contracted substantially in synchronization with each other. The “short-side vicinity portion” is a portion other than the pattern formation region 4 of the mask body 2 and a region portion in which an area necessary for fixing the mask sheet 6 is secured from the edge of the belt-like short side. Say. For fixing the mask sheet 6 to the frame 3, an adhesive having stable properties with respect to temperature changes such as welding such as spot welding or laser welding, or a heat-resistant ceramic adhesive or a heat-resistant epoxy resin adhesive was used. Although it can be performed by bonding, it may be performed using fasteners (screws) such as screws. The tension applied to each mask sheet 6 is set so that the amount of distortion generated in the mask sheet 6 due to thermal stress due to radiant heat during vapor deposition is offset by the amount of distortion generated in the mask sheet 6 due to the tension. And Furthermore, it is desirable that the magnitude of the tension is set so that the stress distribution generated in the mask sheet 6 by the tension becomes uniform.

  It is conceivable that the vapor deposition mask 1 having such a configuration is manufactured by the following procedure. First, on the basis of the shape of the vapor deposition pattern, the conditions at the time of vapor deposition, etc., the band-like short side size of the mask sheet 6 (or the number of divisions into the mask sheet 6) is set, and the mask body 2 is formed by a plurality of belt-like mask sheets 6. Form. And, for example, both short sides of one mask sheet 6 are formed on the upper surface of a pair of frame portions facing in parallel of the frame 3 configured in a square shape according to the outer peripheral edge of the mask body 2. The vicinity portion 7 is fixed. At this time, the mask sheet 6 is in a state in which tension in the direction along the belt-like long side is applied, that is, in a state of being stretched by being pulled in the belt-like long side direction. After fixing the vicinity of both ends of the mask sheet 6 on the frame 3 in this way, subsequently, the portions 7 near both short sides of the next mask sheet 6 are arranged so as to be aligned in parallel with the mask sheet 6. 3 is fixed in the same manner. By repeating this until each mask sheet 6 constitutes one mask main body 2 on the frame 3, the vapor deposition mask 1 having the above-described configuration can be manufactured.

  In the case of performing patterning film formation on a glass substrate by, for example, a line-type vapor deposition method using the vapor deposition mask 1 manufactured by the above procedure, that is, the vapor deposition mask 1 having the above-described configuration, FIG. As shown in the figure, the longitudinal direction of the vapor deposition source 10 and the strip-like length of each mask sheet 6 in the vapor deposition mask 1 are arranged above the vapor deposition source 10 corresponding to the line vapor deposition method in which a plurality of openings 14 through which organic materials pass are arranged. The vapor deposition mask 1 and a glass substrate (not shown) as a deposition substrate are moved in a direction perpendicular to the longitudinal direction of the vapor deposition source 10 while matching the direction. Note that the movement of the evaporation mask 1 and the setting of the glass substrate on the evaporation mask 1 may be performed in the same manner as in the prior art, and thus detailed description thereof is omitted here.

  If patterning film formation is performed on the glass substrate in this way, as shown in FIG. 4, even if the in-plane temperature distribution in the advancing direction of the evaporation mask 1 becomes nonuniform (see YY in the figure). ), The mask body 2 is divided into a plurality of strip-shaped mask sheets 6, and the longitudinal direction of the vapor deposition source 10 and the strip-shaped longitudinal direction of each mask sheet 6 coincide with each other. The temperature difference in the belt-like short direction is reduced. Moreover, since each mask sheet 6 is a separate body, even if there is a difference in the degree of expansion and contraction in each, the difference between the mask sheets 6 is different from the case where the entire mask body 2 is integrated. There is little influence between each other. Therefore, even if a temperature difference occurs in the pattern formation region 4 due to the correspondence to the line type vapor deposition method, it is possible to suppress the occurrence of a difference in the deformation movement state at each position on the same mask sheet 6 as much as possible. . In addition, the arrow on the mask sheet | seat 6 in FIG. 4 has shown the direction and magnitude | size to which each position moves.

  That is, even in the case of the line-type vapor deposition method, that is, the case where the vapor deposition mask 1 passes above the vapor deposition source 10 in the direction orthogonal to the longitudinal direction, the longitudinal direction of the vapor deposition source 10 and each mask sheet 6. Therefore, the temperature difference in the strip width direction of each mask sheet 6 can be reduced to suppress the pattern deformation due to the change of the temperature distribution. As a result, the temperature within the mask surface can be reduced. The adverse effect due to the non-uniform distribution is eliminated as much as possible, and the position accuracy of the vapor deposition pattern can be maintained satisfactorily. Therefore, for example, even when an organic layer constituting an organic EL element is formed by a line-type vapor deposition method, the display accuracy of the organic EL element can be improved without lowering the formation accuracy of the organic layer. It becomes easy.

  Further, since each mask sheet 6 is fixed to the frame 3 in a state where a tension in a direction along the belt-like long side is applied, the distribution of stress and strain in the mask sheet 6 tends to be uniform. . Therefore, it is possible to fix each mask sheet 6 to the frame 3 with high accuracy, and to suppress a change in each position on the mask sheet 6 when the temperature rises.

  Furthermore, in recent years, it has been desired to cope with an increase in the size of the display screen of the organic EL element. Even in such a case, it is possible to deal with a vapor deposition pattern with a large area by arranging the strip-shaped mask sheets 6 in parallel. This makes it very easy to deposit an organic layer on a large glass substrate with high accuracy. Moreover, by dividing the mask body 2 into a plurality of mask sheets 6, the area per mask sheet 6 can be reduced, thereby making it easy to improve the formation accuracy of the openings 5 in the pattern formation region 4. It becomes feasible.

  Next, another embodiment of the vapor deposition mask and the manufacturing method thereof according to the present invention will be described. FIG. 5 is a schematic diagram showing another example of the schematic configuration of the evaporation mask according to the present invention. However, here, only differences from the above-described embodiment will be described.

  As shown in FIG. 5, in the vapor deposition mask 1 described here, the frame 3 includes a crosspiece 8 disposed along adjacent portions of a plurality of mask sheets 6. The crosspiece 8 is formed of the same forming material as the frame 3. Here, the “adjacent portion” refers to a portion between the strip-like long sides of the mask sheets 6 arranged in parallel.

  Each mask sheet 6 is arranged in parallel on the frame 3. At this time, each mask sheet 6 is provided with a belt-like both short side vicinity portion 7 fixed to the frame 3 in a state where a tension in a direction along the belt-like long side is applied, and a belt-like both long side vicinity portion. 9 is also fixed to either the frame 3 or the crosspiece 8. Here, the “long-side vicinity portion” is a portion other than the pattern formation region 4 of the mask body 2 and a region portion in which an area necessary for fixing the mask sheet 6 is secured from the edge of the strip-like long side. That means.

  In the vapor deposition mask 1 having such a configuration, the both short side vicinity portions 7 of the mask sheet 6 are fixed to the frame 3 and then the long side vicinity of the mask sheet 6 in the same manner as in the above-described embodiment. What is necessary is just to manufacture by fixing the part 9 to either the frame 3 or the crosspiece 8, and repeating this until each mask sheet 6 comprises one mask main body 2 on the frame 3. FIG.

  However, when arranging the mask sheets 6 in parallel on the frame 3, it is conceivable to arrange the mask sheets 6 so that the strip-shaped long sides are in contact with each other, but the strip-shaped long sides are spaced apart from each other. It is desirable to arrange each mask sheet 6 so as not to contact.

  Also in the vapor deposition mask 1 having the above-described configuration, since the mask body 2 is divided into the strip-shaped mask sheet 6, the adverse effect due to the non-uniform temperature distribution in the mask surface is eliminated as much as possible. Position accuracy can be maintained well. And if it arrange | positions in parallel so that the strip | belt-shaped long sides of each mask sheet | seat 6 may not contact | connect, it will prevent much more effectively that a difference affects the degree of expansion / contraction in each mask sheet | seat 6 between each. Can do. Accordingly, if the mask sheets 6 are spaced apart and arranged in parallel, it is more suitable for improving the position accuracy of the vapor deposition pattern. This can also be applied to the case where the frame 3 does not include the crosspieces 8, that is, in the case of the above-described embodiment.

  Further, in the vapor deposition mask 1, the frame 3 includes a crosspiece 8, and the crosspiece 8 supports a portion 9 in the vicinity of the belt-like long side of the mask sheet 6. That is, even if the mask body 2 is divided into strip-shaped mask sheets 6, the crosspieces 8 supplement the strength of the mask sheet 6 to prevent deformation, vibration, and the like of the mask sheet 6. Therefore, also by this point, it becomes possible to improve the formation accuracy of the openings 5 in the pattern formation region 4, and as a result, it is possible to improve the position accuracy of the vapor deposition pattern.

  Next, still another embodiment of the evaporation mask and the manufacturing method thereof according to the present invention will be described. FIG. 6 is a schematic view showing still another example of the schematic configuration of the vapor deposition mask according to the present invention. Here, however, only differences from the above-described embodiment will be described.

  As shown in FIG. 6, in the vapor deposition mask 1 described here, the vicinity of the band-shaped long side of the mask sheet 6 is not secured for fixing or the like, and the opening 5 extends to the edge 6a of the band-shaped long side. Is formed. That is, the pattern formation region 4 is arranged up to the edge 6 a of the long strip-like side of the mask sheet 6. However, the pattern formation region 4 does not have to be arranged up to the strip-shaped long side edge 6a for all the mask sheets 6. For example, for the mask sheets 6 positioned at both ends of the parallel arrangement, in the vicinity of the strip-shaped long side on the edge side A portion (fixed region) 9 may be secured. That is, the mask sheet 6 only needs to be provided with the pattern forming region 4 up to the edge 6a of at least one long side.

  The vapor deposition mask 1 having such a configuration is also manufactured in the same manner as in the above-described embodiment.

  Also in the vapor deposition mask 1 having the above-described configuration, since the mask body 2 is divided into the strip-shaped mask sheet 6, the adverse effect due to the non-uniform temperature distribution in the mask surface is eliminated as much as possible. Position accuracy can be maintained well.

  Further, in the vapor deposition mask 1, the pattern forming region 4 is arranged up to the edge 6 a of the strip-like long side of the mask sheet 6, and therefore, when the mask sheet 6 is fixed to the frame 3, that is, on the mask sheet 6. When tension in the direction along the belt-like long side is applied, the stress and strain distribution in the mask sheet 6 can be made more uniform. That is, when the mask sheet 6 is fixed to the frame 3, the mask sheet 6 can be uniformly extended in the longitudinal direction of the belt. Therefore, the formation accuracy of the openings 5 in the pattern formation region 4 is also obtained in this respect. Improvement can be achieved, and as a result, the positional accuracy of the vapor deposition pattern can be improved.

  In addition, since the pattern forming region 4 is arranged up to the edge 6a of the strip-like long side of the mask sheet 6, the degree of freedom (general versatility) of the corresponding pattern forming region 4 can be sufficiently secured. .

  In each of the above-described embodiments, the present invention has been described with reference to preferred specific examples of implementation of the present invention. However, the present invention is not limited to this, and various modifications can be made. That is, the materials, shapes, and the like of the series of constituent elements that constitute the vapor deposition mask described in the embodiments are not necessarily limited to those described in the embodiments, and the functions of the constituent elements are similarly secured. It can be freely changed as much as possible.

  Moreover, in each embodiment, although the case corresponding to a line type vapor deposition system was mentioned as an example, even if it is a case corresponding to another vapor deposition system, the mask main body was formed in a strip shape by applying the present invention. It is possible to configure a plurality of mask sheets. Furthermore, in each embodiment, although what was used in the manufacturing process of an organic EL element was mentioned as an example of the mask for vapor deposition, this invention is not limited to this, It is used in another film-forming process. It goes without saying that even a vapor deposition mask can be applied in exactly the same manner.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram (the 1) which shows an example of schematic structure of the vapor deposition mask which concerns on this invention, and is a figure which shows the whole structure. It is a schematic diagram (the 2) which shows an example of schematic structure of the vapor deposition mask which concerns on this invention, and is a figure which shows the principal part structure. It is a schematic diagram which shows an example of schematic structure of the vapor deposition mask which concerns on this invention (the 3), and is a figure which shows the outline | summary of the use condition by a line type vapor deposition system. FIG. 6 is a schematic diagram (part 4) illustrating an example of a schematic configuration of a vapor deposition mask according to the present invention, and is a diagram illustrating a mask in-plane temperature distribution state in a case corresponding to a line-type vapor deposition method. It is a schematic diagram which shows the other example of schematic structure of the mask for vapor deposition which concerns on this invention, and is a figure which shows the whole structure. It is a schematic diagram which shows the further another example of schematic structure of the vapor deposition mask which concerns on this invention, and is a figure which shows the principal part structure. It is explanatory drawing which shows an example of the vapor deposition source corresponding to a line type vapor deposition system, (a) is the perspective view, (b) is the sectional side view. It is explanatory drawing which shows a specific example of the temperature change in a mask surface in the case of respond | corresponding to a line type vapor deposition system. It is explanatory drawing which shows a specific example of the in-plane temperature distribution of the vapor deposition mask immediately after passing a vapor deposition source in a line type vapor deposition system.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Evaporation mask, 2 ... Mask main body, 3 ... Frame body, 4 ... Pattern formation area, 5 ... Opening, 6 ... Mask sheet, 7 ... Short side vicinity part, 8 ... Crosspiece part, 9 ... Long side vicinity part

Claims (6)

In a vapor deposition mask comprising a thin plate-like mask main body in which a vapor deposition pattern on a deposition target substrate is formed as a through hole in a pattern formation region, and a frame to which a portion other than the pattern formation region in the mask main body is fixed ,
The mask body is composed of a plurality of mask sheets formed in a band shape,
Each of the plurality of mask sheets is arranged in parallel, and the belt-like portions near both short sides are fixed to the frame body in a state in which tension is applied in a direction along the long side of the belt. A vapor deposition mask characterized by being a thing. The frame body is provided with a crosspiece arranged along an adjacent portion of the plurality of mask sheets,
The vapor deposition mask according to claim 1, wherein the plurality of mask sheets are formed by adhering portions in the vicinity of both long sides of the belt shape to the frame body or the crosspiece. The evaporation mask according to claim 1, wherein the plurality of mask sheets are provided with the pattern formation region up to an edge of at least one long side of the belt shape. A deposition mask comprising: a thin plate-like mask body in which a deposition pattern on a deposition target substrate is formed as a through hole in a pattern formation region; and a frame to which a portion other than the pattern formation region in the mask body is fixed. In the manufacturing method,
Forming the mask body with a plurality of strip-shaped mask sheets;
The mask sheets are arranged in parallel on the frame body, and the belt-like portions near both short sides are applied to the frame body in a state where tension is applied to each mask sheet in the direction along the long side of the band. A method for producing a vapor deposition mask, characterized by being fixed. In the frame body, a crosspiece arranged along an adjacent portion of the plurality of strip-shaped mask sheets is provided,
The method for manufacturing an evaporation mask according to claim 4, wherein both of the belt-like long side portions of each of the mask sheets are fixed to the frame or the crosspiece. The method of manufacturing a deposition mask according to claim 4, wherein the pattern forming region is formed up to an edge of at least one long side of the strip shape in the mask sheet.

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