CN106960920A - Evaporation coating device - Google Patents
Evaporation coating device Download PDFInfo
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- CN106960920A CN106960920A CN201710126429.9A CN201710126429A CN106960920A CN 106960920 A CN106960920 A CN 106960920A CN 201710126429 A CN201710126429 A CN 201710126429A CN 106960920 A CN106960920 A CN 106960920A
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- magnetic
- fixed plate
- coating device
- light emitting
- organic light
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to a kind of evaporation coating device for being used to prepare organic light emitting display, including：It is deposited with chamber；The vapor deposition source in the evaporation chamber is arranged at, for the surface evaporation to the substrate to be deposited；The magnetic fixed plate that the vapor deposition source is set is right against, the magnetic fixed plate has the first surface in convex；Can magnetic absorption in the mask plate of the first surface of the magnetic fixed plate, to coordinate the magnetic fixed plate, make substrate clamping to be deposited between the mask plate and the magnetic fixed plate.The magnetic fixed plate of above-mentioned evaporation coating device can have firmly can adsorb above-mentioned mask plate on its surface in the first surface of convex configuration, and then make flexible material substrate clamping between the magnetic fixed plate and mask plate, above-mentioned first surface is in convex configuration, prevents that the ectocentral position that connects of above-mentioned mask plate from sagging generation occurring because of self gravitation.
Description
Technical field
The present invention relates to organic light emitting display field, more particularly to a kind of evaporation coating device.
Background technology
Organic Light Emitting Diode (Organic Light Emitting Diode, abbreviation OLED) is a kind of organic film electricity
Electroluminescence device, it is wide that it has the advantages that easily to be formed flexible structure, visual angle；Therefore, the display skill of Organic Light Emitting Diode is utilized
Art turns into a kind of important Display Technique.
OLED full-color display generally comprises R (red) G (green) B (indigo plant) sub-pixel and independently lighted or white light OLED combination coloured silk
The modes such as color filter coating.Wherein, it is to use most color modes at present that RGB sub-pixels, which independently light, and it is to utilize sub-pixel
Luminous organic material in unit independently lights.
At present, organic light emitting material is typically all the shape by way of carrying out vacuum evaporation to the surface of substrate to be deposited
Into.During actual job, for position substrate to be deposited mask plate often occur because of the reason for it is conducted oneself with dignity it is certain
It is sagging, and then make evaporation coating device relatively low in the yield that the band is deposited with substrate evaporation.
The content of the invention
Based on this, it is necessary to the reason for for above-mentioned mask plate because of deadweight and relative to substrate to be deposited occur it is certain under
Hang down, and then make firmly to position substrate to be deposited there is provided one kind the problem of evaporation coating device is low to substrate yield to be deposited
Evaporation coating device.
A kind of evaporation coating device for being used to prepare organic light emitting display, including：
It is deposited with chamber；
The vapor deposition source in the evaporation chamber is arranged at, for the surface evaporation to the substrate to be deposited；
The magnetic fixed plate that the vapor deposition source is set is right against, the magnetic fixed plate has the first table in convex
Face；
Can magnetic absorption in the mask plate of the first surface of the magnetic fixed plate, to coordinate the magnetic to fix
Plate, makes substrate clamping to be deposited between the mask plate and the magnetic fixed plate.
The magnetic fixed plate of above-mentioned evaporation coating device can have can firmly will be above-mentioned in the first surface of convex configuration
Mask plate is adsorbed in the side of magnetic fixed plate, so make flexible material substrate clamping the magnetic fixed plate and mask plate it
Between, above-mentioned first surface be in convex configuration, prevent above-mentioned mask plate connect ectocentral position occur because of self gravitation it is sagging
Generation.
In wherein one embodiment, the flexibility of the first surface and the mask plate fixed in marginal position,
And matched with the degree of crook of the mask plate under horizontal vacant state.
In wherein one embodiment, the magnetic of the first surface of the magnetic fixed plate is from center to margin location
Put and be gradually reduced.
The magnetic attraction of above-mentioned magnetic fixed plate gradually weakens from its center to edge direction, so just prevents
Absorption sink in the center of the mask plate of magnetic fixed plate, realize above-mentioned mask plate be clamped in magnetic fixed plate and
Flexible material substrate between mask plate accurately, is securely positioned.
In wherein one embodiment, the magnetic of the first surface of the magnetic fixed plate is from center to margin location
Gradient is put to successively decrease.
In wherein one embodiment, the magnetic field of the first surface center of the magnetic fixed plate is most strong and is in
Square distribution.
In wherein one embodiment, the magnetic of the first surface of the magnetic fixed plate is from center to margin location
Put linear decrease.
In wherein one embodiment, the scope of the flexibility on the convex surface is 2.5mm-2.7mm.
In wherein one embodiment, several openings are offered on the mask plate.
In wherein one embodiment, the mask plate uses doped magnetic powder, iron, cobalt, nickel, iron oxide, four oxidations three
Any of iron or several materials.
In wherein one embodiment, the magnetic fixed plate is permanent magnet or electromagnet.
Brief description of the drawings
Fig. 1 is the evaporation coating device first structure schematic diagram of a preferred embodiment of the invention；
Fig. 2 is the magnetic distribution schematic diagram of the magnetic fixed plate of the evaporation coating device of a preferred embodiment of the invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It should be noted that when element is referred to as " being arranged at " another element, it can be directly on another element
Or can also have element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " level ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases
The arbitrary and all combination of the Listed Items of pass.
As shown in figure 1, present embodiment discloses a kind of evaporation coating device 100, the evaporation coating device 100 is used in organic light emission
In display device manufacturing process, the material layer needed for being deposited with to the surface of substrate to be deposited, to form organic light emitting display
Device, the evaporation coating device 100 includes evaporation chamber 110, vapor deposition source 120, magnetic fixed plate 130 and mask plate 140, above-mentioned evaporation
Source 120 is arranged at the evaporation chamber 110, and corresponding required material layer is deposited with for the surface to substrate 10 to be deposited.Above-mentioned magnetic
Property fixed plate 130 be right against above-mentioned vapor deposition source 120 and set, the magnetic fixed plate 130 has a first surface, the first surface with it is upper
State vapor deposition source 120 to be oppositely arranged, the first surface passes through above-mentioned mask plate 140 to contact with above-mentioned substrate 10 to be deposited
Substrate 10 to be deposited is fixed on to the first surface of above-mentioned magnetic fixed plate 130.
Usually, magnetic fixed plate 130 is arranged on the top of above-mentioned evaporation chamber 110, and the of the magnetic fixed plate 130
One surface is right against the underface of evaporation chamber 110.Above-mentioned vapor deposition source 120 is located at the first surface of above-mentioned magnetic fixed plate 130
Side.
Above-mentioned mask plate 140 can magnetic absorption in above-mentioned magnetic fixed plate 130, first mask plate 140 is utilized and magnetic
Magnetic field absorption affinity between property fixed plate 130, above-mentioned flexible material substrate 10 is clamped and above-mentioned magnetic fixed plate 130 is attached to
First surface on.
Wherein, the first surface of above-mentioned magnetic fixed plate 130 is in convex structure, in detail, and the first surface is in ball
Planar outwardly convex, in other words, the distance that the first surface rises in its center position male are maximum and to first surface marginal position
The arc surface being gradually reduced.
The magnetic fixed plate 130 is adsorbed above-mentioned mask plate 140 in magnetic fixed plate using the magnetic field force produced by itself
130 first surface, and the mask plate 140 in first surface with its convex free bend so that the mask plate 140 completely paste
It is attached to the surface of magnetic fixed plate 130.
Fix when the marginal position of above-mentioned mask plate 140, close to the center of mask plate 140 because in vacant state and
When bending downwards, the flexibility of the first surface of above-mentioned magnetic fixed plate 130 was with that should be in mask plate 140 under above-mentioned state
Degree of crook match.In detail, if the marginal position of above-mentioned mask plate 140 is fixed, and its level is hanging
Under state, due to itself flexible structure of mask plate 140 and deadweight, the position of the centre of its mask plate 140 can occur
Downward offset, causes the above-mentioned entirety of mask plate 140 to bend downwards, and above-mentioned magnetic fixed plate 130 is in convex surface knot
The flexibility for the mask plate 140 that the flexibility of the first surface of structure has bent with this matches.Usually, the convex surface
The scope of flexibility is 2.5mm-2.7mm.
The magnetic fixed plate 130 of above-mentioned evaporation coating device 100 can have can be firm in the first surface of convex configuration
Above-mentioned mask plate 140 is adsorbed on its surface, and then flexible material substrate 10 is clamped in the magnetic fixed plate 130 and mask plate
Between 140, above-mentioned first surface is in convex configuration, and prevent above-mentioned mask plate 140 connects ectocentral position because of self gravitation
Occurs sagging generation.
With reference to shown in Fig. 2, further, the magnetic of the first surface of above-mentioned magnetic fixed plate 130 is from center to side
Edge position is gradually reduced.Specifically, the magnetic of the center of the first surface of above-mentioned magnetic fixed plate 130 is most strong, and distribution
It is square to form the first field region 131.
In the peripheral magnetic field of first field region by close to the first field region position to close to this first surface
The gradual gradient of marginal position, magnetic is successively decreased.
In detail, the above-mentioned magnetic fixed plate 130 in present embodiment also includes the second field region 132, the 3rd magnetic
Field region 134 of field areas 133 and the 4th etc..
Wherein, second field region 132 is located at the periphery of above-mentioned first field region 131, the region of the second magnetic field 132
First field region 131 is surrounded in " returning " shape, second field region 132 correspondence magnetic field force is less than the first field region 131
Corresponding magnetic field force.
Above-mentioned 3rd field region 133 is located at the periphery of above-mentioned second field region 132, the 3rd field region 133
Second field region is surrounded in " returning " shape, the 3rd field region 133 correspondence magnetic field force is less than the correspondence of the second field region 132
Magnetic field force.
Above-mentioned 4th field region 134 is located at the periphery of above-mentioned 3rd field region 133, and the 4th field region 134 is same
Sample surrounds the 4th field region 134 in " returning " shape, and the 4th field region 134 correspondence magnetic field force is less than the 3rd field region
133 corresponding magnetic field forces.
Equal, the of the invention above-mentioned magnetic fixed plate of the magnetic field force of different positions in above-mentioned every same field region
130 can also include more field regions, be located at above-mentioned 4th magnetic according to the distribution mode of above-mentioned 4th field region successively
The periphery of field areas, this is not limited by the present invention.
The magnetic field force of above-mentioned magnetic fixed plate 130 is by above-mentioned first field region, the second field region, the 3rd field regions
Magnetic field produced by domain, the 4th field region etc. is constituted, and is entered but magnetic fixed plate 130 forms center by first surface
The magnetic field force gradually successively decreased to marginal position.
The magnetic field force of above-mentioned magnetic fixed plate 130 can also linearly be passed from the center of first surface to marginal position
Subtract, so that mask plate 140 is fitted securely with the surface of the magnetic fixed plate 130.
Offered on above-mentioned mask plate 140 in several openings, present embodiment and opening is prepared on above-mentioned mask plate 140
Technique can select laser-induced thermal etching, can so ensure opening required precision, the size and shape of above-mentioned opening is according to reality
Demand when border is deposited with determines that it can be the opening of circular open, square aperture, rectangular aperture or other figures.Typically
Ground, the shape of above-mentioned opening is the square of 10 μm of 10 μ m, or the rectangular shape of 10 20 μm of μ ms.
Above-mentioned mask plate 140 can also include contraposition mark, usually, and contraposition mark can be 3 to 4, and these
Contraposition mark is arranged on above-mentioned mask plate 140 close to the position at edge, to ensure above-mentioned mask plate 140 and be clamped in mask plate
Flexible material substrate 10 between 140 and magnetic fixed plate 130, which is realized, to be accurately positioned.
Above-mentioned mask plate 140 can be for metal mask plate or using doped magnetic powder, iron, cobalt, nickel, iron oxide, four
Any of Fe 3 O or several materials are constituted, as long as can realize that above-mentioned mask plate 140 is fixed with above-mentioned magnetic
The mutual magnetic attracting of plate 130, this is not limited by the present invention.
And it can also be electromagnet that above-mentioned magnetic fixed plate 130, which can be permanent magnet, when above-mentioned magnetic fixed plate 130 is electricity
During magnet, after being powered to the electromagnet, the above-mentioned electromagnet can produce the magnetic absorption for adsorbing above-mentioned mask plate 140
Power.
Above-mentioned magnetic fixed plate 130 gradually weakens from its center to edge direction, is so easy to prevent that absorption from existing
The center of the mask plate 140 of magnetic fixed plate 130 sinks, and realizes that above-mentioned mask plate 140 is fixed with being clamped in magnetic
Flexible material substrate 10 between plate 130 and mask plate 140 accurately, is securely positioned.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of evaporation coating device for being used to prepare organic light emitting display, it is characterised in that including：
It is deposited with chamber；
The vapor deposition source in the evaporation chamber is arranged at, for the surface evaporation to substrate to be deposited；
The magnetic fixed plate that the vapor deposition source is set is right against, the magnetic fixed plate has the first surface in convex；
Can magnetic absorption in the mask plate of the magnetic fixed plate, to coordinate the magnetic fixed plate, make substrate to be deposited
It is held between the mask plate and the magnetic fixed plate.
2. according to claim 1 be used to prepare the evaporation coating device of organic light emitting display, it is characterised in that described the
The flexibility on one surface and the mask plate marginal position level fix and with the bending of the mask plate under horizontal vacant state
Degree is matched.
3. the evaporation coating device according to claim 1 for being used to prepare organic light emitting display, it is characterised in that the magnetic
The magnetic of the first surface of property fixed plate is reduced from center to marginal position.
4. the evaporation coating device according to claim 3 for being used to prepare organic light emitting display, it is characterised in that the magnetic
The magnetic of the first surface of property fixed plate is successively decreased from center to marginal position gradient.
5. the evaporation coating device according to claim 4 for being used to prepare organic light emitting display, it is characterised in that the magnetic
Property fixed plate first surface center have magnetic field most strong and the distribution that is square the first field region.
6. the evaporation coating device according to claim 3 for being used to prepare organic light emitting display, it is characterised in that the magnetic
The magnetic of the first surface of property fixed plate is from center to marginal position linear decrease.
7. the evaporation coating device according to claim 1 for being used to prepare organic light emitting display, it is characterised in that described convex
The scope of the flexibility in face is 2.5mm-2.7mm.
8. the evaporation coating device according to claim 1 for being used to prepare organic light emitting display, it is characterised in that described to cover
Diaphragm plate is metal mask plate.
9. the evaporation coating device according to claim 1 for being used to prepare organic light emitting display, it is characterised in that described to cover
Diaphragm plate is using any of doped magnetic powder, iron, cobalt, nickel, iron oxide, ferroso-ferric oxide or several materials.
10. the evaporation coating device according to claim 1 for being used to prepare organic light emitting display, it is characterised in that described
Magnetic fixed plate is permanent magnet or electromagnet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710126429.9A CN106960920B (en) | 2017-02-28 | 2017-02-28 | Evaporation coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710126429.9A CN106960920B (en) | 2017-02-28 | 2017-02-28 | Evaporation coating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106960920A true CN106960920A (en) | 2017-07-18 |
| CN106960920B CN106960920B (en) | 2018-12-14 |
Family
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|---|---|---|---|
| CN201710126429.9A Active CN106960920B (en) | 2017-02-28 | 2017-02-28 | Evaporation coating device |
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Cited By (11)
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| CN107507915A (en) * | 2017-08-09 | 2017-12-22 | 武汉华星光电半导体显示技术有限公司 | A kind of substrate and evaporation coating device for manufacturing organic electroluminescence display panel |
| CN108336063A (en) * | 2018-01-19 | 2018-07-27 | 云谷（固安）科技有限公司 | The device for preventing array substrate from sinking when array substrate and vapor deposition |
| CN108333864A (en) * | 2018-02-28 | 2018-07-27 | 京东方科技集团股份有限公司 | The manufacturing method of mask plate, exposure sources and mask plate |
| CN109428012A (en) * | 2017-09-04 | 2019-03-05 | 三星显示有限公司 | Equipment for manufacturing display device |
| CN109536886A (en) * | 2018-12-17 | 2019-03-29 | 福建华佳彩有限公司 | A kind of evaporation coating device and oled panel evaporation coating method |
| CN109609912A (en) * | 2019-01-21 | 2019-04-12 | 昆山国显光电有限公司 | Vacuum deposition apparatus and vacuum deposition method |
| CN110512184A (en) * | 2019-09-29 | 2019-11-29 | 京东方科技集团股份有限公司 | Substrate holding apparatus and evaporated device |
| CN112053629A (en) * | 2019-06-05 | 2020-12-08 | 株式会社日本有机雷特显示器 | Display device and method for manufacturing display device |
| CN112376019A (en) * | 2020-10-19 | 2021-02-19 | 西安工程大学 | Magnetic adsorption local vacuum evaporation method |
| CN112510072A (en) * | 2020-12-11 | 2021-03-16 | 云谷（固安）科技有限公司 | Display panel, preparation method of display panel and display device |
| CN113005400A (en) * | 2021-02-23 | 2021-06-22 | 京东方科技集团股份有限公司 | Adsorption device and evaporation equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107507915A (en) * | 2017-08-09 | 2017-12-22 | 武汉华星光电半导体显示技术有限公司 | A kind of substrate and evaporation coating device for manufacturing organic electroluminescence display panel |
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| CN109428012A (en) * | 2017-09-04 | 2019-03-05 | 三星显示有限公司 | Equipment for manufacturing display device |
| CN109428012B (en) * | 2017-09-04 | 2023-07-18 | 三星显示有限公司 | Apparatus for manufacturing display device |
| CN108336063A (en) * | 2018-01-19 | 2018-07-27 | 云谷（固安）科技有限公司 | The device for preventing array substrate from sinking when array substrate and vapor deposition |
| CN108333864A (en) * | 2018-02-28 | 2018-07-27 | 京东方科技集团股份有限公司 | The manufacturing method of mask plate, exposure sources and mask plate |
| CN109536886A (en) * | 2018-12-17 | 2019-03-29 | 福建华佳彩有限公司 | A kind of evaporation coating device and oled panel evaporation coating method |
| CN109536886B (en) * | 2018-12-17 | 2024-05-14 | 福建华佳彩有限公司 | Evaporation device and OLED panel evaporation method |
| CN109609912A (en) * | 2019-01-21 | 2019-04-12 | 昆山国显光电有限公司 | Vacuum deposition apparatus and vacuum deposition method |
| CN112053629A (en) * | 2019-06-05 | 2020-12-08 | 株式会社日本有机雷特显示器 | Display device and method for manufacturing display device |
| CN110512184A (en) * | 2019-09-29 | 2019-11-29 | 京东方科技集团股份有限公司 | Substrate holding apparatus and evaporated device |
| CN110512184B (en) * | 2019-09-29 | 2021-10-22 | 京东方科技集团股份有限公司 | Substrate clamping device and evaporation equipment |
| CN112376019A (en) * | 2020-10-19 | 2021-02-19 | 西安工程大学 | Magnetic adsorption local vacuum evaporation method |
| CN112510072A (en) * | 2020-12-11 | 2021-03-16 | 云谷（固安）科技有限公司 | Display panel, preparation method of display panel and display device |
| CN113005400A (en) * | 2021-02-23 | 2021-06-22 | 京东方科技集团股份有限公司 | Adsorption device and evaporation equipment |
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