CN108336063A - The device for preventing array substrate from sinking when array substrate and vapor deposition - Google Patents
The device for preventing array substrate from sinking when array substrate and vapor deposition Download PDFInfo
- Publication number
- CN108336063A CN108336063A CN201810054325.6A CN201810054325A CN108336063A CN 108336063 A CN108336063 A CN 108336063A CN 201810054325 A CN201810054325 A CN 201810054325A CN 108336063 A CN108336063 A CN 108336063A
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- Prior art keywords
- array substrate
- substrate
- magnetic
- sinking
- vapor deposition
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- 239000000758 substrate Substances 0.000 title claims abstract description 124
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 37
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 230000006698 induction Effects 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 abstract description 10
- 230000005484 gravity Effects 0.000 abstract description 9
- 239000010408 film Substances 0.000 description 26
- 230000000694 effects Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to the devices for preventing array substrate from sinking when a kind of array substrate and vapor deposition.Wherein, the array substrate, including：Substrate forms the magnetic film on substrate and the array being formed on magnetic film driving layer group.During vapor deposition, above-mentioned array substrate, magnetic film can make array substrate not sink due to gravity because of the magnetic-adsorption by upper magnetic plate.And then ensure that array substrate is smooth, contraposition deviation will not occur with lower section mask plate, it is not in color offset phenomenon to cause the display after the completion of vapor deposition.
Description
Technical field
The present invention relates to display manufacture fields, and array substrate is prevented when more particularly to a kind of array substrate and vapor deposition
The device of sinking.
Background technology
TFT thin film transistor monitor is because having the characteristics that small size, low power consumption, no radiation, in current flat-panel monitor city
Leading position is occupied in.Wherein, TFT thin film transistor monitor generally includes array substrate and display function device, is showing
It in device process, often selects mask method that array substrate is made to be aligned with mask plate, then again steams the raw material of display function device
It is plated on array substrate.
And during vapor deposition, contraposition deviation usually occurs with mask plate for array substrate, leads to the display being finally made
It will appear color offset phenomenon.
Invention content
Based on this, it is necessary in view of the above-mentioned problems, the present invention provides one kind, and contraposition deviation, system will not occurring with mask plate
At display be not in colour cast array substrate.
A kind of array substrate, including：
Substrate；
Magnetic film is formed on the substrate；
And array drives layer group, is formed on the magnetic film.
Above-mentioned array substrate, can since its magnetic film can form magnetic-adsorption between magnetic board during vapor deposition
So that array substrate will not sink due to gravity；And then ensure that array substrate is smooth, it will not be with lower section mask plate
There is contraposition deviation, it is not in color offset phenomenon to cause the display after the completion of vapor deposition.
The thickness of the magnetic film is 0.05nm-600nm in one of the embodiments,.
The substrate is glass substrate in one of the embodiments,.
The present invention also provides the devices for preventing array substrate from sinking when a kind of vapor deposition.
A kind of device for preventing array substrate from sinking when vapor deposition.
Array substrate is array substrate of the present invention；
Described device includes：
Baffle is overlaid in the array substrate；
And magnetic board, magnetic attraction can be generated with the magnetic film of the array substrate；The magnetic board is located at the gear
Side of the plate far from array substrate.
Preventing the device that array substrate is sunk from can make between substrate and mask plate when above-mentioned vapor deposition, contraposition is accurate, has been deposited
Display after is not in color offset phenomenon.
The material of the baffle is iron or stainless steel in one of the embodiments,.
The cooler for cooling down to the array substrate is equipped in the baffle in one of the embodiments,
Structure.
The magnetic force homogeneity of the magnetic board is less than or equal to 10% in one of the embodiments,.
The magnetic induction intensity of the magnetic board is -410 Gauss of 390 Gauss in one of the embodiments,.
The magnetic board is permanent magnet in one of the embodiments,.
The material of the permanent magnet is iron, cobalt, nickel or its alloy in one of the embodiments,.
Description of the drawings
Fig. 1 prevents the cooperation signal of the device of array substrate sinking when being the array substrate and vapor deposition of one embodiment of the invention
Figure.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, right below in conjunction with specific implementation mode
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are only used to explain the present invention,
It is not intended to limit the present invention.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant Listed Items.
Refering to fig. 1, the array substrate of one embodiment of the invention, including：Substrate 101, magnetic film 103 and array drive layer
Group 105.The device for preventing array substrate of the present invention from sinking when vapor deposition, including：Baffle 201 and magnetic board 203.
Wherein, the main function of substrate is to drive the processing of layer group to provide carrier for array thereon.
In a preferred embodiment, substrate is rigid substrates.Preferably, substrate is glass substrate.Of course, it is possible to manage
Solution, can also be the substrate or quartz base plate of rigid metal material.
Wherein, magnetic film is formed on substrate.It cooperates with magnetic board, forms magnetic-adsorption therebetween, it can be to prevent
Only array substrate is sunk due to gravity during vapor deposition.
In a preferred embodiment, magnetic film is the magnetic film of tool, such as：Iron, cobalt, nickel or its alloy.When
So, it is to be understood that the material of magnetic film is not limited to metal material, can also select other can adsorb by magnetic board its
His material.
In a preferred embodiment, the thickness of magnetic film is 0.05nm-600nm.This thickness can make magnetic board with
The absorption of magnetic film is more firm.Preferably, the thickness of magnetic film is 0.1nm-200nm.It is highly preferred that the thickness of magnetic film is
0.1nm-100nm。
Wherein, array driving layer group is formed on magnetic film.Its main function is to provide electric current and control data input letter
Number.Specifically, array driving layer group includes thin film transistor (TFT), thin film transistor (TFT) includes grid, source electrode, drain electrode and semiconductor layer
Element necessary to layer group is driven etc. composition array known in the field, details are not described herein.
During vapor deposition, above-mentioned array substrate, magnetic film can make because of the magnetic-adsorption by upper magnetic plate
Array substrate will not sink due to gravity.And then ensure that array substrate is smooth, it will not be with the appearance pair of lower section mask plate
Position deviation, it is not in color offset phenomenon to cause the display after the completion of vapor deposition.
The present invention also provides the devices for preventing array substrate of the present invention from sinking when vapor deposition.
Wherein, baffle is overlaid in array substrate.It is smooth that the main function of baffle is to maintain array substrate.
Specifically, during vapor deposition, since the self gravitation effect of array substrate can sink, but usually have
Support component is supported substrate edges.Therefore, it will produce to sink in the middle part of array substrate during vapor deposition, array substrate
Edge there is a phenomenon where upwarping, baffle is pressed by the substrate of array substrate, can to avoid substrate edges occur on
It sticks up, baffle is also prevented from magnetic film because being led in the middle part of substrate protuberance upwards by upper magnetic plate magnetic-adsorption is excessive.And then it protects
Card substrate keeps smooth during vapor deposition.To make to align display screen accurate, after the completion of vapor deposition between substrate and mask plate
It is not in color offset phenomenon.
In a preferred embodiment, the material of baffle is rigid material, and rigid baffle has certain stiffness, from
And preferably realize the pressing to substrate.Preferably, the material of baffle is iron or stainless steel etc..
In a preferred embodiment, the cooling body to cool down for array substrate is equipped in baffle.In this way
It can prevent substrate from being expanded because heated during vapor deposition, cause the contraposition of substrate and pixel deviation occur, and then lead
Cause color offset phenomenon.
Wherein, magnetic board, magnetic board are located at side of the baffle far from array substrate.The main function of magnetic board is to be used for magnetic
Power adsorbs magnetic film.Specifically, during vapor deposition, sunk due to array substrate self gravitation effect.The application
Inventor one layer of magnetic film has been deposited in the lower surface of substrate, can be with because the film is by the magnetic-adsorption of the magnetic board of top
Prevent array substrate from being sunk by gravity, to make to align between substrate and mask plate accurate and then ensure that vapor deposition is completed
Display screen afterwards is not in color offset phenomenon.
In a preferred embodiment, magnetic board is permanent magnet.Magnetic size is controlled relative to using size of current
For electromagnet, magnetic force is more stablized, and not will produce excessive fluctuation, to ensure to be generated enough between magnetic board and magnetic film
Magnetic-adsorption, and then prevent substrate from being sunk by gravity.
Further, the material of permanent magnet is iron, cobalt, nickel or its alloy.
In a preferred embodiment, the magnetic induction intensity of magnetic board is -410 Gauss of 390 Gauss.To ensure magnetic board
Enough magnetic-adsorptions are generated between magnetic film, and then prevent array substrate from being sunk by gravity.
In a preferred embodiment, the magnetic force homogeneity of magnetic board is less than or equal to 10%.Magnetic force can be made to exist in this way
It is uniformly distributed on magnetic board, and then contributes to the uniform force of magnetic film.Prevent locally sinking for array substrate.This paper institutes
The magnetic force homogeneity stated is also referred to as Gauss homogeneity, and calculation formula is：Magnetic force homogeneity=(Gauss maximum value-on magnetic board
Gauss minimum value on magnetic board)/(Gauss minimum value on Gauss maximum value+magnetic board on magnetic board).
In addition, during vapor deposition, magnetic board can there are a fixed gaps to be close to therewith with the baffle of lower section.
It is carried out with the mutually matched operation principle of device for preventing array substrate from sinking when vapor deposition below in conjunction with array substrate
It illustrates.
During vapor deposition, since the self gravitation effect of array substrate can sink, but support component is usually had
Substrate edges are supported.Therefore, it will produce to sink in the middle part of array substrate during vapor deposition, the edge hair of array substrate
Raw the phenomenon that upwarping, causes the display after the completion of vapor deposition that can go out so that contraposition deviation occurs for mask plate and array substrate
Existing color offset phenomenon.
The magnetic board of the device of array substrate sinking and the magnetic film separation substrate two of array substrate are prevented when above-mentioned vapor deposition
First at the substrate edges with thimble pressing array substrate, thimble is then removed in vapor deposition in side.Such benefit is to pass through use
Thimble pressing substrate edges are to slightly be aligned.Before formally contraposition, it can prevent substrate from occurring a wide range of mobile, thus into
One step prevents contraposition deviation.The device for preventing array substrate from sinking is covered on the substrate of array substrate again, makes magnetic force
Magnetic-adsorption is formed between plate and magnetic film, prevents array substrate from sinking due to gravity during vapor deposition.In addition, again
In addition pressing of the baffle of the device of array substrate sinking to substrate is prevented, can be upwarped to avoid substrate edges, baffle is also
It can prevent magnetic film from causing to swell upwards in the middle part of substrate because magnetic-adsorption is excessive.And then it is always ensured that substrate during vapor deposition
Keep smooth.
In conclusion the above-mentioned device for preventing array substrate from sinking can prevent array substrate during vapor deposition because of gravity
Effect is sunk, and then ensures that it is not in colour cast that display accurate, after the completion of vapor deposition is aligned between substrate and mask plate
Phenomenon.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of array substrate, which is characterized in that including：
Substrate；
Magnetic film is formed on the substrate；
And array drives layer group, is formed on the magnetic film.
2. array substrate according to claim 1, which is characterized in that the thickness of the magnetic film is 0.05nm-600nm.
3. array substrate according to claim 1, which is characterized in that the substrate is glass substrate.
4. the device for preventing array substrate from sinking when a kind of vapor deposition, which is characterized in that array substrate is any one of claim 1-3
The array substrate；
Described device includes：
Baffle is overlaid in the array substrate；
And magnetic board, magnetic attraction can be generated with the magnetic film of the array substrate；It is remote that the magnetic board is located at the baffle
Side from array substrate.
5. the device according to claim 4 for preventing substrate from sinking, which is characterized in that the material of the baffle is for iron or not
Become rusty steel.
6. the device according to claim 4 for preventing substrate from sinking, which is characterized in that be equipped with for institute in the baffle
State the cooling body that array substrate cools down.
7. the device according to claim 4 for preventing substrate from sinking, which is characterized in that the magnetic force homogeneity of the magnetic board
Less than or equal to 10%.
8. the device according to claim 4 for preventing substrate from sinking, which is characterized in that the magnetic induction intensity of the magnetic board
For -410 Gauss of 390 Gauss.
9. the device according to claim 4 for preventing substrate from sinking, which is characterized in that the magnetic board is permanent magnet.
10. it is according to claim 9 prevent substrate sink device, which is characterized in that the material of the permanent magnet be iron,
Cobalt, nickel or its alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810054325.6A CN108336063A (en) | 2018-01-19 | 2018-01-19 | The device for preventing array substrate from sinking when array substrate and vapor deposition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810054325.6A CN108336063A (en) | 2018-01-19 | 2018-01-19 | The device for preventing array substrate from sinking when array substrate and vapor deposition |
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| Publication Number | Publication Date |
|---|---|
| CN108336063A true CN108336063A (en) | 2018-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810054325.6A Pending CN108336063A (en) | 2018-01-19 | 2018-01-19 | The device for preventing array substrate from sinking when array substrate and vapor deposition |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110172673A (en) * | 2019-07-03 | 2019-08-27 | 京东方科技集团股份有限公司 | Substrate and evaporated device is deposited |
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| CN106571371A (en) * | 2015-10-09 | 2017-04-19 | 群创光电股份有限公司 | Array substrate, application device of array substrate, and assembling method of array substrate |
| CN106847741A (en) * | 2016-12-30 | 2017-06-13 | 深圳市华星光电技术有限公司 | A kind of method for manufacturing thin film transistor array substrate, vacuum gas-phase evaporator and its control method |
| CN106835026A (en) * | 2017-02-24 | 2017-06-13 | 武汉华星光电技术有限公司 | Evaporation substrate and its evaporation coating method |
| CN106960920A (en) * | 2017-02-28 | 2017-07-18 | 昆山国显光电有限公司 | Evaporation coating device |
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2018
- 2018-01-19 CN CN201810054325.6A patent/CN108336063A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105154830A (en) * | 2015-09-06 | 2015-12-16 | 京东方科技集团股份有限公司 | Fixing method and vapor deposition method |
| CN106571371A (en) * | 2015-10-09 | 2017-04-19 | 群创光电股份有限公司 | Array substrate, application device of array substrate, and assembling method of array substrate |
| CN106847741A (en) * | 2016-12-30 | 2017-06-13 | 深圳市华星光电技术有限公司 | A kind of method for manufacturing thin film transistor array substrate, vacuum gas-phase evaporator and its control method |
| CN106835026A (en) * | 2017-02-24 | 2017-06-13 | 武汉华星光电技术有限公司 | Evaporation substrate and its evaporation coating method |
| CN106960920A (en) * | 2017-02-28 | 2017-07-18 | 昆山国显光电有限公司 | Evaporation coating device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110172673A (en) * | 2019-07-03 | 2019-08-27 | 京东方科技集团股份有限公司 | Substrate and evaporated device is deposited |
| CN110172673B (en) * | 2019-07-03 | 2021-01-26 | 京东方科技集团股份有限公司 | Evaporation substrate and evaporation equipment |
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Application publication date: 20180727 |