CN106960920B - Evaporation coating device - Google Patents
Evaporation coating device Download PDFInfo
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- CN106960920B CN106960920B CN201710126429.9A CN201710126429A CN106960920B CN 106960920 B CN106960920 B CN 106960920B CN 201710126429 A CN201710126429 A CN 201710126429A CN 106960920 B CN106960920 B CN 106960920B
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- fixed plate
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- evaporation coating
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Abstract
The present invention relates to a kind of evaporation coating devices for being used to prepare organic light emitting display, comprising: vapor deposition chamber；It is set to the indoor evaporation source of the vapor deposition chamber, for the surface vapor deposition to the substrate to be deposited；It is right against the magnetic fixed plate of the evaporation source setting, the magnetism fixed plate has the first surface in convex；Can magnetic absorption make substrate clamping to be deposited between the mask plate and the magnetic fixed plate to cooperate the magnetic fixed plate in the mask plate of the first surface of the magnetic fixed plate.The magnetic fixed plate of above-mentioned evaporation coating device can have and above-mentioned mask plate firmly can be adsorbed on its surface in the first surface of convex configuration, and then make flexible material substrate clamping between the magnetism fixed plate and mask plate, above-mentioned first surface is in convex configuration, prevents the ectocentral position that connects of above-mentioned mask plate from sagging generation occurring because of self gravity.
Description
Technical field
The present invention relates to organic light emitting display fields, more particularly to a kind of evaporation coating device.
Background technique
Organic Light Emitting Diode (Organic Light Emitting Diode, abbreviation OLED) is a kind of organic film electricity
It is wide to have many advantages, such as easily to be formed flexible structure, visual angle for electroluminescence device；Therefore, the display skill of Organic Light Emitting Diode is utilized
Art has become a kind of important display technology.
The full-color display of OLED generally comprises R (red) G (green) B (indigo plant) sub-pixel, and independently luminous or white light OLED combines coloured silk
The modes such as color filter coating.Wherein, it is to use most color modes at present that RGB sub-pixel, which independently shines, is to utilize sub-pixel
Luminous organic material in unit independently shines.
Currently, organic light emitting material is typically all the shape in such a way that the surface to substrate to be deposited carries out vacuum evaporation
At.During actual job, for position the mask plate of substrate to be deposited often because it is self-possessed the reason of occur it is certain
It is sagging, and then keep evaporation coating device lower in the yield of band vapor deposition substrate vapor deposition.
Summary of the invention
Based on this, it is necessary under occurring centainly due to being self-possessed the reason of relative to substrate to be deposited for above-mentioned mask plate
It hangs down, and then the problem for keeping evaporation coating device low to substrate yield to be deposited, one kind is provided, substrate to be deposited is firmly positioned
Evaporation coating device.
A kind of evaporation coating device being used to prepare organic light emitting display, comprising:
Chamber is deposited；
It is set to the indoor evaporation source of the vapor deposition chamber, for the surface vapor deposition to the substrate to be deposited；
It is right against the magnetic fixed plate of the evaporation source setting, the magnetism fixed plate has the first table in convex
Face；
Can magnetic absorption in the mask plate of the first surface of the magnetic fixed plate, it is described magnetic fixed to cooperate
Plate makes substrate clamping to be deposited between the mask plate and the magnetic fixed plate.
The magnetic fixed plate of above-mentioned evaporation coating device can have can firmly will be above-mentioned in the first surface of convex configuration
Mask plate is adsorbed on the side of magnetic fixed plate, so make flexible material substrate clamping the magnetism fixed plate and mask plate it
Between, above-mentioned first surface be in convex configuration, prevent above-mentioned mask plate connect ectocentral position occur because of self gravity it is sagging
Generation.
In a wherein embodiment, the curvature of the first surface and the mask plate fix in marginal position,
And it is matched with the bending degree of the mask plate under horizontal vacant state.
In a wherein embodiment, the first surface of the magnetism fixed plate it is magnetic from center to margin location
It sets and is gradually reduced.
The magnetic attraction of above-mentioned magnetism fixed plate gradually weakens from its center to edge direction, just prevents in this way
The center for being adsorbed on the mask plate of magnetic fixed plate sinks, realize above-mentioned mask plate and be clamped in magnetic fixed plate and
Flexible material substrate between mask plate accurately, securely positions.
In a wherein embodiment, the first surface of the magnetism fixed plate it is magnetic from center to margin location
Gradient is set to successively decrease.
In a wherein embodiment, the magnetic field of the first surface center of the magnetism fixed plate is most strong and is in
Rectangular distribution.
In a wherein embodiment, the first surface of the magnetism fixed plate it is magnetic from center to margin location
Set linear decrease.
In a wherein embodiment, the range of the curvature on the convex surface is 2.5mm-2.7mm.
In a wherein embodiment, several openings are offered on the mask plate.
In a wherein embodiment, the mask plate uses doped magnetic powder, iron, cobalt, nickel, iron oxide, four oxidations three
Any one of iron or several materials.
In a wherein embodiment, the magnetism fixed plate is permanent magnet or electromagnet.
Detailed description of the invention
Fig. 1 is the evaporation coating device first structure diagram of a preferred embodiment of the invention；
Fig. 2 is the magnetic distribution schematic diagram of the magnetic fixed plate of the evaporation coating device of a preferred embodiment of the invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It should be noted that it can directly on the other element when element is referred to as " being set to " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
As shown in Figure 1, present embodiment discloses a kind of evaporation coating device 100, which is used in organic light emission
In display device manufacturing process, the surface of substrate to be deposited is carried out that required material layer is deposited, to form organic light emitting display
Device, the evaporation coating device 100 include vapor deposition chamber 110, evaporation source 120, magnetic fixed plate 130 and mask plate 140, above-mentioned vapor deposition
Source 120 is set to the vapor deposition chamber 110, for the corresponding required material layer of surface vapor deposition to substrate 10 to be deposited.Above-mentioned magnetic
Property fixed plate 130 be right against above-mentioned evaporation source 120 and be arranged, the magnetism fixed plate 130 with first surface, the first surface with it is upper
It states evaporation source 120 to be oppositely arranged, which passes through above-mentioned mask plate 140 to contact with above-mentioned substrate 10 to be deposited
Substrate 10 to be deposited is fixed on to the first surface of above-mentioned magnetic fixed plate 130.
Generally, the top of above-mentioned vapor deposition chamber 110, and the of the magnetism fixed plate 130 is arranged in magnetic fixed plate 130
One surface is right against the underface of vapor deposition chamber 110.Above-mentioned evaporation source 120 is located at the first surface of above-mentioned magnetic fixed plate 130
Side.
Above-mentioned mask plate 140 can magnetic absorption in above-mentioned magnetic fixed plate 130, which utilizes and magnetic
Property fixed plate 130 between magnetic field adsorption capacity, above-mentioned flexible material substrate 10 is clamped and is attached to above-mentioned magnetic fixed plate 130
First surface on.
Wherein, the first surface of above-mentioned magnetic fixed plate 130 is in convex structure, and in detail, which is in ball
Planar outwardly convex, in other words, the first surface is in the distance maximum of its center protrusion and to first surface marginal position
The arc surface being gradually reduced.
Above-mentioned mask plate 140 is adsorbed on magnetic fixed plate using itself generated magnetic field force by the magnetism fixed plate 130
130 first surface, and the mask plate 140 in first surface with its convex free bend so that the mask plate 140 completely paste
It is attached to the surface of magnetic fixed plate 130.
When the marginal position of above-mentioned mask plate 140 fixes, close to the center of mask plate 140 due in vacant state
Downwards when bending, the curvature of the first surface of above-mentioned magnetism fixed plate 130 with should be in mask plate 140 under above-mentioned state
Bending degree match.In detail, if the marginal position of above-mentioned mask plate 140 is fixed, and it is horizontal hanging
Under state, due to itself flexible structure of mask plate 140 and self weight, the position of the centre of mask plate 140 can occur
Downward offset causes above-mentioned mask plate 140 is whole to bend downwards, and above-mentioned magnetic fixed plate 130 is in that convex surface is tied
The curvature of the first surface of structure and the curvature of the mask plate to have bent 140 match.Generally, the convex surface
The range of curvature is 2.5mm-2.7mm.
The magnetic fixed plate 130 of above-mentioned evaporation coating device 100 can have can be firm in the first surface of convex configuration
Above-mentioned mask plate 140 is adsorbed on its surface, and then flexible material substrate 10 is made to be clamped in the magnetism fixed plate 130 and mask plate
Between 140, above-mentioned first surface is in convex configuration, and prevent above-mentioned mask plate 140 connects ectocentral position due to self gravity
Sagging generation occurs.
As shown in connection with fig. 2, further, the first surface of above-mentioned magnetic fixed plate 130 is magnetic from center to side
Edge position is gradually reduced.Specifically, the magnetism of the center of the first surface of above-mentioned magnetic fixed plate 130 is most strong, and is distributed
It is square to form the first field region 131.
The periphery of first field region magnetic field by close to the first field region position to close to this first surface
Marginal position, magnetic gradual gradient are successively decreased.
In detail, the above-mentioned magnetic fixed plate 130 in present embodiment further includes the second field region 132, third magnetic
Field areas 133 and the 4th field region 134 etc..
Wherein, which is located at the periphery of above-mentioned first field region 131,132 region of the second magnetic field
First field region 131 is surrounded in " returning " shape, the corresponding magnetic field force of second field region 132 is less than the first field region 131
Corresponding magnetic field force.
Above-mentioned third field region 133 is located at the periphery of above-mentioned second field region 132, the third field region 133
Second field region is surrounded in " returning " shape, the corresponding magnetic field force of the third field region 133 is corresponding less than the second field region 132
Magnetic field force.
Above-mentioned 4th field region 134 is located at the periphery of above-mentioned third field region 133, and the 4th field region 134 is same
Sample surrounds the 4th field region 134 in " returning " shape, and the corresponding magnetic field force of the 4th field region 134 is less than third field region
133 corresponding magnetic field forces.
The magnetic field force of different positions is equal in above-mentioned every same field region, above-mentioned magnetic fixed plate of the invention
130 can also include more field regions, successively be located at above-mentioned 4th magnetic according to the distribution mode of above-mentioned 4th field region
The periphery of field areas, this is not limited by the present invention.
The magnetic field force of above-mentioned magnetism fixed plate 130 is by above-mentioned first field region, the second field region, third field regions
Magnetic field caused by domain, the 4th field region etc. is constituted, and then is center of the magnetic formation of fixed plate 130 by first surface
The magnetic field force gradually to successively decrease to marginal position.
The magnetic field force of above-mentioned magnetism fixed plate 130 can also linearly be passed from the center of first surface to marginal position
Subtract, so that mask plate 140 is bonded securely with the surface of the magnetism fixed plate 130.
Several openings are offered on above-mentioned mask plate 140, and opening is prepared on above-mentioned mask plate 140 in present embodiment
Technique can choose laser-induced thermal etching, can guarantee in this way opening required precision, the size and shape of above-mentioned opening is according to reality
Demand when border is deposited determines, can be the opening of circular open, square aperture, rectangular aperture or other figures.Generally
Ground, the shape of above-mentioned opening are the squares of 10 μm of 10 μ m, or the rectangular shape of 10 20 μm of μ ms.
Above-mentioned mask plate 140 can also include contraposition mark, and generally, contraposition mark can be 3 to 4, and these
Above-mentioned mask plate 140 is arranged in close to the position at edge, to guarantee above-mentioned mask plate 140 and be clamped in mask plate in contraposition mark
Flexible material substrate 10 between 140 and magnetic fixed plate 130, which is realized, to be accurately positioned.
Above-mentioned mask plate 140 can be metal mask plate, be also possible to using doped magnetic powder, iron, cobalt, nickel, iron oxide, four
Any one of Fe 3 O or several materials are constituted, and are fixed as long as can be realized above-mentioned mask plate 140 with above-mentioned magnetism
The mutual magnetic attracting of plate 130, this is not limited by the present invention.
And above-mentioned magnetic fixed plate 130 can may be electromagnet for permanent magnet, when above-mentioned magnetic fixed plate 130 is electricity
When magnet, after being powered to the electromagnet, the above-mentioned electromagnet can generate the magnetic absorption for adsorbing above-mentioned mask plate 140
Power.
Above-mentioned magnetism fixed plate 130 gradually weakens from its center to edge direction, is convenient for preventing from being adsorbed in this way
The center of the mask plate 140 of magnetic fixed plate 130 sinks, and realizes above-mentioned mask plate 140 and is clamped in magnetic fixation
Flexible material substrate 10 between plate 130 and mask plate 140 accurately, securely positions.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (9)
1. a kind of evaporation coating device for being used to prepare organic light emitting display characterized by comprising
Chamber is deposited；
It is set to the indoor evaporation source of the vapor deposition chamber, for the surface vapor deposition to substrate to be deposited；
It is right against the magnetic fixed plate of the evaporation source setting, the magnetism fixed plate has the first surface in convex；
Can magnetic absorption in the mask plate of the magnetic fixed plate make substrate to be deposited to cooperate the magnetic fixed plate
It is held between the mask plate and the magnetic fixed plate；
The substrate clamping to be deposited simultaneously attaches on the first surface；
The magnetic of first surface of the magnetism fixed plate is reduced from center to marginal position.
2. the evaporation coating device according to claim 1 for being used to prepare organic light emitting display, which is characterized in that described
The curvature on one surface and the mask plate are in the fixation of marginal position level and bending with the mask plate under horizontal vacant state
Degree matching.
3. the evaporation coating device according to claim 1 for being used to prepare organic light emitting display, which is characterized in that the magnetic
Property fixed plate first surface magnetism successively decreased from center to marginal position gradient.
4. the evaporation coating device according to claim 3 for being used to prepare organic light emitting display, which is characterized in that the magnetic
Property fixed plate first surface center have magnetic field most strong and the first field region of the distribution that is square.
5. the evaporation coating device according to claim 1 for being used to prepare organic light emitting display, which is characterized in that the magnetic
Property fixed plate first surface it is magnetic from center to marginal position linear decrease.
6. the evaporation coating device according to claim 1 for being used to prepare organic light emitting display, which is characterized in that described convex
The range of the curvature in face is 2.5mm-2.7mm.
7. the evaporation coating device according to claim 1 for being used to prepare organic light emitting display, which is characterized in that described to cover
Diaphragm plate is metal mask plate.
8. the evaporation coating device according to claim 1 for being used to prepare organic light emitting display, which is characterized in that described to cover
Diaphragm plate uses any one of doped magnetic powder, iron, cobalt, nickel, iron oxide, ferroso-ferric oxide or several materials.
9. the evaporation coating device according to claim 1 for being used to prepare organic light emitting display, which is characterized in that the magnetic
Property fixed plate be permanent magnet or electromagnet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710126429.9A CN106960920B (en) | 2017-02-28 | 2017-02-28 | Evaporation coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710126429.9A CN106960920B (en) | 2017-02-28 | 2017-02-28 | Evaporation coating device |
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| Publication Number | Publication Date |
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| CN106960920A CN106960920A (en) | 2017-07-18 |
| CN106960920B true CN106960920B (en) | 2018-12-14 |
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| CN201710126429.9A Active CN106960920B (en) | 2017-02-28 | 2017-02-28 | Evaporation coating device |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107507915B (en) * | 2017-08-09 | 2019-09-13 | 武汉华星光电半导体显示技术有限公司 | A kind of substrate and evaporation coating device manufacturing organic light emitting display panel |
| KR102411538B1 (en) * | 2017-09-04 | 2022-06-22 | 삼성디스플레이 주식회사 | Apparatus and method for manufacturing a display apparatus |
| CN108336063A (en) * | 2018-01-19 | 2018-07-27 | 云谷（固安）科技有限公司 | The device for preventing array substrate from sinking when array substrate and vapor deposition |
| CN108333864A (en) * | 2018-02-28 | 2018-07-27 | 京东方科技集团股份有限公司 | The manufacturing method of mask plate, exposure sources and mask plate |
| CN109536886A (en) * | 2018-12-17 | 2019-03-29 | 福建华佳彩有限公司 | A kind of evaporation coating device and oled panel evaporation coating method |
| CN109609912A (en) * | 2019-01-21 | 2019-04-12 | 昆山国显光电有限公司 | Vacuum deposition apparatus and vacuum deposition method |
| JP7373104B2 (en) * | 2019-06-05 | 2023-11-02 | ＪＤＩ Ｄｅｓｉｇｎ ａｎｄ Ｄｅｖｅｌｏｐｍｅｎｔ 合同会社 | Display device manufacturing method |
| CN110512184B (en) * | 2019-09-29 | 2021-10-22 | 京东方科技集团股份有限公司 | Substrate clamping device and evaporation equipment |
| CN112376019A (en) * | 2020-10-19 | 2021-02-19 | 西安工程大学 | Magnetic adsorption local vacuum evaporation method |
| CN112510072B (en) * | 2020-12-11 | 2022-10-28 | 云谷（固安）科技有限公司 | Display panel, preparation method of display panel and display device |
| CN113005400A (en) * | 2021-02-23 | 2021-06-22 | 京东方科技集团股份有限公司 | Adsorption device and evaporation equipment |
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| CN101910448A (en) * | 2008-01-16 | 2010-12-08 | 特机株式会社 | Film-forming apparatus |
| CN105154830A (en) * | 2015-09-06 | 2015-12-16 | 京东方科技集团股份有限公司 | Fixing method and vapor deposition method |
| CN105695937A (en) * | 2014-11-28 | 2016-06-22 | 上海和辉光电有限公司 | Magnetic device, magnetic force adjusting device and magnetic force adjusting method of magnetic force adjusting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005174843A (en) * | 2003-12-15 | 2005-06-30 | Sony Corp | Deposition mask and its manufacturing method |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101910448A (en) * | 2008-01-16 | 2010-12-08 | 特机株式会社 | Film-forming apparatus |
| CN105695937A (en) * | 2014-11-28 | 2016-06-22 | 上海和辉光电有限公司 | Magnetic device, magnetic force adjusting device and magnetic force adjusting method of magnetic force adjusting device |
| CN105154830A (en) * | 2015-09-06 | 2015-12-16 | 京东方科技集团股份有限公司 | Fixing method and vapor deposition method |
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| CN106960920A (en) | 2017-07-18 |
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