JP7112219B2 - ソフトモールド用組成物、これを利用して製造されたソフトモールド - Google Patents
ソフトモールド用組成物、これを利用して製造されたソフトモールド Download PDFInfo
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- JP7112219B2 JP7112219B2 JP2018048342A JP2018048342A JP7112219B2 JP 7112219 B2 JP7112219 B2 JP 7112219B2 JP 2018048342 A JP2018048342 A JP 2018048342A JP 2018048342 A JP2018048342 A JP 2018048342A JP 7112219 B2 JP7112219 B2 JP 7112219B2
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- Prior art keywords
- soft
- photoinitiator
- less
- soft mold
- composition
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- 239000000203 mixture Substances 0.000 title claims description 150
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 105
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- -1 siloxane compound Chemical class 0.000 claims description 89
- 239000000178 monomer Substances 0.000 claims description 78
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- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
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- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 3
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 claims description 3
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims description 3
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- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 4
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 4
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 4
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 4
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- 229910052731 fluorine Inorganic materials 0.000 description 3
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- PRBBFHSSJFGXJS-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxypropyl) prop-2-enoate;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O.C=CC(=O)OCC(C)(C)COC(=O)C=C PRBBFHSSJFGXJS-UHFFFAOYSA-N 0.000 description 2
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- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical group C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/40—Plastics, e.g. foam or rubber
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/022—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations
- C08F299/024—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations the unsaturation being in acrylic or methacrylic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/08—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F4/00—Polymerisation catalysts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/132—Phenols containing keto groups, e.g. benzophenones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2833/00—Use of polymers of unsaturated acids or derivatives thereof as mould material
- B29K2833/04—Polymers of esters
Description
ソフトモールドは、上述の図1A乃至図1Dの段階により製造した。すなわち、ソフトモールド用組成物をマスターモールドに提供し、提供されたソフトモールド用組成物を、紫外線光を利用して光硬化することで製造した。この光硬化のためには、提供されたソフトモールド用組成物に、345nmの中心波長を有する紫外線光と、365nmの中心波長を有する紫外線光とが提供された。
上述したソフトモールドの製造方法で製造されたソフトモールドについての離型力と耐久性とを評価した。離型力は、 製造されたソフトモールドの初期(1回目)の離型力と、使用回数に応じて変化する離型力とを各々評価した。
SM ソフトモールド
HM マスターモールド
RS 凹部(recess)
DD 表示装置
WGP ワイヤグリッド偏光層
Claims (10)
- 前記少なくとも1つの多官能アクリレートモノマーは、3つ以上のアクリレート基を有する第1アクリレートモノマーを含む請求項1に記載のソフトモールド用組成物。
- 前記少なくとも1つの多官能アクリレートモノマーは、2つ以上のアクリレート基を有する第2アクリレートモノマーを含む請求項1に記載のソフトモールド用組成物。
- 前記少なくとも1つの多官能アクリレートモノマーは、トリメチロールプロパントリアクリレート(Trimethylolpropane Triacrylate)、トリメチロールプロパンエトキシレートトリアクリレート(Trimethylolpropane ethoxylate triacrylate)、トリメチロールプロパンプロポキシレートトリアクリレート(Trimethylolpropane propoxylate triacrylate、エトキシル化グリセリントリアクリレート(Ethoxylated glycerine triacrylate)、グリセリン(PO)mトリアクリレート(Glycerine(PO)m Triacrylate、mは1以上4以下の整数である)、ペンタエリスリトールトリアクリレート(Pentaerythritol Triacrylate)、トリス(2-ヒドロキシエチル)イソシアヌレートトリアクリレート(Tris(2-hydroxyethyl)isocyanurate Triacrylate)、ペンタエリスリトール(EO)nテトラアクリレート(Pentaerythritol(EO)n Tetraacrylate)、nは1以上4以下の整数である)、ジトリメチロールプロパンテトラアクリレート(Ditrimethylolpropane Tetraacrylate)、ペンタエリスリトールテトラアクリレート(Pentaerythritol Tetraacrylate)、ジペンタエリスリトールペンタアクリレート(Dipentaerythritol Pentaacrylate)、及びジペンタエリスリトールヘキサアクリレート(Dipentaerythritol Hexaacrylate)の中から選択される少なくともいずれか1つを含む請求項1に記載のソフトモールド用組成物。
- 前記少なくとも1つの多官能アクリレートモノマーは、トリメチロールプロパンエトキシレートトリアクリレート及びトリメチロールプロパントリアクリレートを含む請求項1に記載のソフトモールド用組成物。
- 前記少なくとも1つの光開始剤は、第1紫外線光で活性化される第1光開始剤と、
前記第1紫外線光より長波長である第2紫外線光で活性化される第2光開始剤と、を含む請求項1に記載のソフトモールド用組成物。 - 前記第1光開始剤と前記第2光開始剤との重量比率は、1:1乃至2:1である請求項6に記載のソフトモールド用組成物。
- 少なくとも1つの多官能アクリレートモノマー80wt%以上93wt%以下、
少なくとも1つの光開始剤5wt%以上15wt%以下、及び
前記シロキサン化合物2wt%以上10wt%以下、を含む請求項1に記載のソフトモールド用組成物。
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011136459A (ja) | 2009-12-28 | 2011-07-14 | Bridgestone Corp | 光硬化性転写シート、及びこれを用いた凹凸パターンの形成方法 |
WO2012018043A1 (ja) | 2010-08-06 | 2012-02-09 | 綜研化学株式会社 | ナノインプリント用樹脂製モールド |
JP2012148481A (ja) | 2011-01-19 | 2012-08-09 | Mitsubishi Rayon Co Ltd | レプリカモールド、および微細凹凸構造を表面に有する成形体とその製造方法 |
JP2013049841A (ja) | 2011-08-02 | 2013-03-14 | Dic Corp | 樹脂モールド用硬化性樹脂組成物、樹脂モールド及びそれを用いて作製されたレプリカモールド |
WO2014065149A1 (ja) | 2012-10-22 | 2014-05-01 | 綜研化学株式会社 | インプリント用光硬化性樹脂組成物、インプリント用モールドの製造方法およびインプリント用モールド |
WO2015064310A1 (ja) | 2013-10-30 | 2015-05-07 | 日産化学工業株式会社 | シルセスキオキサン化合物及び変性シリコーン化合物を含むインプリント材料 |
JP2017160295A (ja) | 2016-03-07 | 2017-09-14 | 三菱ケミカル株式会社 | 活性エネルギー線硬化性樹脂組成物、インプリント用原料、および成形品 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5888649A (en) | 1996-01-11 | 1999-03-30 | Avery Dennison Corporation | Radiation-curable release coating compositions |
JP5117002B2 (ja) | 2006-07-10 | 2013-01-09 | 富士フイルム株式会社 | 光硬化性組成物およびそれを用いたパターン形成方法 |
KR100902550B1 (ko) | 2007-07-31 | 2009-06-15 | 신화인터텍 주식회사 | 패턴 형성용 몰드 필름 조성물 및 이에 의해 제조된 패턴형성용 몰드 필름 |
KR100929381B1 (ko) | 2007-11-22 | 2009-12-02 | 주식회사 미뉴타텍 | 몰드 시트 조성물 및 이를 이용한 몰드 시트 제조방법 |
US20100109195A1 (en) | 2008-11-05 | 2010-05-06 | Molecular Imprints, Inc. | Release agent partition control in imprint lithography |
KR101132372B1 (ko) | 2009-09-18 | 2012-04-03 | 한국기계연구원 | 역 임프린트 몰드 제조용 수지 조성물, 및 이를 이용한 역 임프린트 방법 |
TWI428225B (zh) | 2010-03-10 | 2014-03-01 | Asahi Kasei E Materials Corp | Resin mold |
WO2011155499A1 (ja) * | 2010-06-07 | 2011-12-15 | 三菱レイヨン株式会社 | 微細凹凸構造を表面に有する物品の製造方法、金型の離型処理方法、および金型表面離型処理用活性エネルギー線硬化性樹脂組成物 |
JP5845597B2 (ja) | 2011-03-10 | 2016-01-20 | ダイキン工業株式会社 | 微細構造体の製造方法 |
US9533467B2 (en) | 2012-04-27 | 2017-01-03 | Nissan Chemical Industries, Ltd. | Imprint material having low mold release property |
WO2014104074A1 (ja) | 2012-12-28 | 2014-07-03 | 東洋合成工業株式会社 | 硬化性樹脂組成物、インプリント用樹脂モールド、光インプリント方法、半導体集積回路の製造方法及び微細光学素子の製造方法 |
-
2017
- 2017-04-14 KR KR1020170048742A patent/KR102452035B1/ko active IP Right Grant
- 2017-11-06 US US15/804,135 patent/US10752719B2/en active Active
-
2018
- 2018-01-12 EP EP18151528.9A patent/EP3388458B1/en active Active
- 2018-01-31 CN CN201810093680.4A patent/CN108727537B/zh active Active
- 2018-03-15 JP JP2018048342A patent/JP7112219B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011136459A (ja) | 2009-12-28 | 2011-07-14 | Bridgestone Corp | 光硬化性転写シート、及びこれを用いた凹凸パターンの形成方法 |
WO2012018043A1 (ja) | 2010-08-06 | 2012-02-09 | 綜研化学株式会社 | ナノインプリント用樹脂製モールド |
JP2012148481A (ja) | 2011-01-19 | 2012-08-09 | Mitsubishi Rayon Co Ltd | レプリカモールド、および微細凹凸構造を表面に有する成形体とその製造方法 |
JP2013049841A (ja) | 2011-08-02 | 2013-03-14 | Dic Corp | 樹脂モールド用硬化性樹脂組成物、樹脂モールド及びそれを用いて作製されたレプリカモールド |
WO2014065149A1 (ja) | 2012-10-22 | 2014-05-01 | 綜研化学株式会社 | インプリント用光硬化性樹脂組成物、インプリント用モールドの製造方法およびインプリント用モールド |
WO2015064310A1 (ja) | 2013-10-30 | 2015-05-07 | 日産化学工業株式会社 | シルセスキオキサン化合物及び変性シリコーン化合物を含むインプリント材料 |
JP2017160295A (ja) | 2016-03-07 | 2017-09-14 | 三菱ケミカル株式会社 | 活性エネルギー線硬化性樹脂組成物、インプリント用原料、および成形品 |
Non-Patent Citations (1)
Title |
---|
Siyuan Wang et al.,Synthesis, Characterization, and UV-Curing Properties of Silicon-Containing (Meth)acrylate Monomers,Journal of Applied Polymer Science,2013年,Vol.129,p.3325-3332 |
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