JP7107295B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP7107295B2
JP7107295B2 JP2019176914A JP2019176914A JP7107295B2 JP 7107295 B2 JP7107295 B2 JP 7107295B2 JP 2019176914 A JP2019176914 A JP 2019176914A JP 2019176914 A JP2019176914 A JP 2019176914A JP 7107295 B2 JP7107295 B2 JP 7107295B2
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Japan
Prior art keywords
heat dissipation
housing
semiconductor device
electronic device
resin mold
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JP2019176914A
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English (en)
Japanese (ja)
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JP2021057373A5 (https=
JP2021057373A (ja
Inventor
修平 宮地
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Denso Corp
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Denso Corp
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Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2019176914A priority Critical patent/JP7107295B2/ja
Priority to PCT/JP2020/036484 priority patent/WO2021060547A1/ja
Priority to CN202080066343.1A priority patent/CN114424335B/zh
Publication of JP2021057373A publication Critical patent/JP2021057373A/ja
Publication of JP2021057373A5 publication Critical patent/JP2021057373A5/ja
Priority to US17/656,158 priority patent/US12218025B2/en
Application granted granted Critical
Publication of JP7107295B2 publication Critical patent/JP7107295B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/886—Die-attach connectors and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
JP2019176914A 2019-09-27 2019-09-27 電子装置 Active JP7107295B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019176914A JP7107295B2 (ja) 2019-09-27 2019-09-27 電子装置
PCT/JP2020/036484 WO2021060547A1 (ja) 2019-09-27 2020-09-25 電子装置
CN202080066343.1A CN114424335B (zh) 2019-09-27 2020-09-25 电子装置
US17/656,158 US12218025B2 (en) 2019-09-27 2022-03-23 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019176914A JP7107295B2 (ja) 2019-09-27 2019-09-27 電子装置

Publications (3)

Publication Number Publication Date
JP2021057373A JP2021057373A (ja) 2021-04-08
JP2021057373A5 JP2021057373A5 (https=) 2021-09-09
JP7107295B2 true JP7107295B2 (ja) 2022-07-27

Family

ID=75165257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019176914A Active JP7107295B2 (ja) 2019-09-27 2019-09-27 電子装置

Country Status (4)

Country Link
US (1) US12218025B2 (https=)
JP (1) JP7107295B2 (https=)
CN (1) CN114424335B (https=)
WO (1) WO2021060547A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019051170A (ja) * 2017-09-15 2019-04-04 株式会社三洋物産 遊技機
JP7110566B2 (ja) * 2017-09-15 2022-08-02 株式会社三洋物産 遊技機
JP7130931B2 (ja) * 2017-09-15 2022-09-06 株式会社三洋物産 遊技機
JP7110567B2 (ja) * 2017-09-15 2022-08-02 株式会社三洋物産 遊技機
CN116075080A (zh) * 2021-11-04 2023-05-05 光宝科技新加坡私人有限公司 功率模块
US20260033328A1 (en) * 2022-07-28 2026-01-29 Hitachi Astemo, Ltd. Power conversion apparatus

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002118384A (ja) 2000-08-01 2002-04-19 Mitsubishi Electric Corp 電子機器
JP2010263080A (ja) 2009-05-07 2010-11-18 Denso Corp 半導体装置
JP2012191002A (ja) 2011-03-10 2012-10-04 Panasonic Corp 半導体装置
JP2016100506A (ja) 2014-11-25 2016-05-30 株式会社デンソー 電子装置
WO2017208802A1 (ja) 2016-06-01 2017-12-07 三菱電機株式会社 半導体装置
JP2018006765A (ja) 2017-08-28 2018-01-11 株式会社デンソー 電子装置
JP2019029395A (ja) 2017-07-26 2019-02-21 日本シイエムケイ株式会社 プリント配線板とその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4360577B2 (ja) * 2000-03-29 2009-11-11 京セラ株式会社 半導体装置
JP2005203633A (ja) * 2004-01-16 2005-07-28 Matsushita Electric Ind Co Ltd 半導体装置、半導体装置実装体、および半導体装置の製造方法
JP2007324330A (ja) * 2006-05-31 2007-12-13 Sanyo Electric Co Ltd 回路基板
JP2009016626A (ja) * 2007-07-06 2009-01-22 Panasonic Corp 半導体モジュール装置および半導体モジュール装置の製造方法ならびにフラットパネル型表示装置，プラズマディスプレイパネル
JP2009105366A (ja) * 2007-10-03 2009-05-14 Panasonic Corp 半導体装置及び半導体装置の製造方法ならびに半導体装置の実装体
WO2010053133A1 (ja) * 2008-11-07 2010-05-14 凸版印刷株式会社 リードフレーム及びその製造方法及びそれを用いた半導体発光装置
JP5716415B2 (ja) * 2011-01-26 2015-05-13 富士通株式会社 半導体装置の製造方法
JP6669586B2 (ja) * 2016-05-26 2020-03-18 新光電気工業株式会社 半導体装置、半導体装置の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002118384A (ja) 2000-08-01 2002-04-19 Mitsubishi Electric Corp 電子機器
JP2010263080A (ja) 2009-05-07 2010-11-18 Denso Corp 半導体装置
JP2012191002A (ja) 2011-03-10 2012-10-04 Panasonic Corp 半導体装置
JP2016100506A (ja) 2014-11-25 2016-05-30 株式会社デンソー 電子装置
WO2017208802A1 (ja) 2016-06-01 2017-12-07 三菱電機株式会社 半導体装置
JP2019029395A (ja) 2017-07-26 2019-02-21 日本シイエムケイ株式会社 プリント配線板とその製造方法
JP2018006765A (ja) 2017-08-28 2018-01-11 株式会社デンソー 電子装置

Also Published As

Publication number Publication date
CN114424335B (zh) 2025-09-30
CN114424335A (zh) 2022-04-29
US20220216122A1 (en) 2022-07-07
WO2021060547A1 (ja) 2021-04-01
JP2021057373A (ja) 2021-04-08
US12218025B2 (en) 2025-02-04

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