JP2016100506A - 電子装置 - Google Patents
電子装置 Download PDFInfo
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- JP2016100506A JP2016100506A JP2014237656A JP2014237656A JP2016100506A JP 2016100506 A JP2016100506 A JP 2016100506A JP 2014237656 A JP2014237656 A JP 2014237656A JP 2014237656 A JP2014237656 A JP 2014237656A JP 2016100506 A JP2016100506 A JP 2016100506A
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
- H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/4005—Shape
- H01L2224/4009—Loop shape
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
まず、図1〜図13を参照して第1実施形態のモータ制御装置の構成について説明する。なお、文中における上下方向及び左右方向は、参照する図中における方向を示す。
次に、第2実施形態のモータ制御装置について説明する。第2実施形態のモータ制御装置は、第1実施形態のモータ制御装置に対して、FETモジュールの構造を変更したものである。
Claims (9)
- 直方体状の本体部と、前記本体部の4つの側面のうち2つの側面から突出する端子部とを有する半導体モジュール(10、20)と、
接続部を除いて表面がソルダーレジストで覆われた配線パターンを有し、前記半導体モジュールの前記端子部が前記配線パターンの前記接続部に電気的に接続される配線基板(11、21)と、
前記半導体モジュールが電気的に接続された前記配線基板と対向し、距離を隔てて設けられる筐体部材(12、22)と、
を備えた電子装置において、
前記配線基板は、電気的に接続された前記半導体モジュールの前記本体部の4つの側面のうち、前記端子部が突出する2つの側面を除いた他の2つの側面の少なくともいずれかに面する表面に、表面の少なくともいずれかの部分が露出した熱伝導パターン(114、115、214、215)を有し、
前記筐体部材の配線基板側の表面であって、前記本体部の筐体部材側の表面より反配線基板側に位置する所定領域に、前記配線パターンの所定部分と前記熱伝導パターンを熱的に接続する熱伝導部材(13、23)を有することを特徴とする電子装置。 - 前記配線パターンの前記所定部分は、前記接続部を除いた表面の少なくともいずれかの部分が露出していることを特徴とする請求項1に記載の電子装置。
- 前記配線パターンの前記所定部分は、前記接続部に隣接した部分であって、前記接続部の間を除いた部分が露出していることを特徴とする請求項2に記載の電子装置。
- 前記熱伝導パターンは、前記本体部の側面に沿って設けられていることを特徴とする請求項1〜3のいずれか1項に記載の電子装置。
- 前記半導体モジュールは、前記端子部を形成する部材であって、前記端子部を除いた所定部分が前記本体部の配線基板側の表面に露出し、前記配線パターンの前記接続部に電気的に接続される第1端子部材(105、205)を有することを特徴とする請求項1〜4のいずれか1項に記載の電子装置。
- 前記熱伝導部材は、前記筐体部材の前記所定領域に、前記本体部と前記端子部を熱的に接続することを特徴する請求項1〜5のいずれか1項に記載の電子装置。
- 前記半導体モジュールは、前記端子部を形成する部材であって、前記端子部を除いた所定部分が前記本体部の筐体部材側の表面に露出する第2端子部材(206)を有することを特徴とする請求項6に記載の電子装置。
- 前記熱伝導パターンは、前記配線パターンと一体的に形成されていることを特徴とする請求項1〜7のいずれか1項に記載の電子装置。
- 前記半導体モジュールは、FETモジュールであることを特徴とする請求項1〜8のいずれか1項に記載の電子装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014237656A JP6201966B2 (ja) | 2014-11-25 | 2014-11-25 | 電子装置 |
DE102015222576.3A DE102015222576B4 (de) | 2014-11-25 | 2015-11-16 | Elektronikvorrichtung mit Wärmeleitteil |
US14/947,924 US9425123B2 (en) | 2014-11-25 | 2015-11-20 | Electronic device having heat conducting member |
CN201510816528.0A CN105633059B (zh) | 2014-11-25 | 2015-11-23 | 具有导热构件的电子装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014237656A JP6201966B2 (ja) | 2014-11-25 | 2014-11-25 | 電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016100506A true JP2016100506A (ja) | 2016-05-30 |
JP6201966B2 JP6201966B2 (ja) | 2017-09-27 |
Family
ID=55914427
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014237656A Active JP6201966B2 (ja) | 2014-11-25 | 2014-11-25 | 電子装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9425123B2 (ja) |
JP (1) | JP6201966B2 (ja) |
CN (1) | CN105633059B (ja) |
DE (1) | DE102015222576B4 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021060547A1 (ja) * | 2019-09-27 | 2021-04-01 | 株式会社デンソー | 電子装置 |
JP2021197509A (ja) * | 2020-06-17 | 2021-12-27 | Tdk株式会社 | 電子部品内蔵基板及びこれを備える電子機器 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022162695A (ja) * | 2021-04-13 | 2022-10-25 | キヤノン株式会社 | 撮像装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0547968A (ja) * | 1991-08-20 | 1993-02-26 | Fujitsu Ltd | 電子装置の冷却構造 |
JPH10233473A (ja) * | 1996-10-16 | 1998-09-02 | Nkk Corp | 半導体素子の放熱構造とその放熱方法 |
JP2002026176A (ja) * | 2001-05-16 | 2002-01-25 | Seiko Epson Corp | 半導体装置および半導体装置の製造方法 |
JP2010103368A (ja) * | 2008-10-24 | 2010-05-06 | Keihin Corp | 電子制御装置 |
JP2010206073A (ja) * | 2009-03-05 | 2010-09-16 | Fujitsu General Ltd | 半導体素子の放熱構造およびこれを備えた電子機器 |
JP2012079741A (ja) * | 2010-09-30 | 2012-04-19 | Denso Corp | 電子制御ユニット |
JP2013254810A (ja) * | 2012-06-06 | 2013-12-19 | Nec Schott Components Corp | 貫通端子付き金属基板およびそれを用いた表面実装デバイス |
US20140238729A1 (en) * | 2013-02-26 | 2014-08-28 | Mediatek Inc. | Printed circuit board structure with heat dissipation function |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19624475A1 (de) | 1996-06-19 | 1998-01-02 | Kontron Elektronik | Vorrichtung zum Temperieren elektronischer Bauteile |
BRPI0100051B1 (pt) | 2001-01-11 | 2016-11-29 | Brasil Compressores Sa | gabinete de dispositivo eletrônico |
JP4016271B2 (ja) * | 2003-03-26 | 2007-12-05 | 株式会社デンソー | 両面冷却型半導体モジュール |
US7576429B2 (en) | 2005-12-30 | 2009-08-18 | Fairchild Semiconductor Corporation | Packaged semiconductor device with dual exposed surfaces and method of manufacturing |
DE102009029260A1 (de) | 2009-09-08 | 2011-03-10 | Robert Bosch Gmbh | Elektronikeinheit und Verfahren zum Herstellen derselben |
JP5387620B2 (ja) * | 2011-05-31 | 2014-01-15 | 株式会社安川電機 | 電力変換装置、半導体装置および電力変換装置の製造方法 |
US20130049079A1 (en) | 2011-08-22 | 2013-02-28 | International Rectifier Corporation | Small-Outline Package for a Power Transistor |
JP5725055B2 (ja) | 2013-02-12 | 2015-05-27 | 株式会社デンソー | 電子制御ユニット |
JP6112077B2 (ja) * | 2014-07-03 | 2017-04-12 | トヨタ自動車株式会社 | 半導体装置 |
-
2014
- 2014-11-25 JP JP2014237656A patent/JP6201966B2/ja active Active
-
2015
- 2015-11-16 DE DE102015222576.3A patent/DE102015222576B4/de active Active
- 2015-11-20 US US14/947,924 patent/US9425123B2/en active Active
- 2015-11-23 CN CN201510816528.0A patent/CN105633059B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0547968A (ja) * | 1991-08-20 | 1993-02-26 | Fujitsu Ltd | 電子装置の冷却構造 |
JPH10233473A (ja) * | 1996-10-16 | 1998-09-02 | Nkk Corp | 半導体素子の放熱構造とその放熱方法 |
JP2002026176A (ja) * | 2001-05-16 | 2002-01-25 | Seiko Epson Corp | 半導体装置および半導体装置の製造方法 |
JP2010103368A (ja) * | 2008-10-24 | 2010-05-06 | Keihin Corp | 電子制御装置 |
JP2010206073A (ja) * | 2009-03-05 | 2010-09-16 | Fujitsu General Ltd | 半導体素子の放熱構造およびこれを備えた電子機器 |
JP2012079741A (ja) * | 2010-09-30 | 2012-04-19 | Denso Corp | 電子制御ユニット |
JP2013254810A (ja) * | 2012-06-06 | 2013-12-19 | Nec Schott Components Corp | 貫通端子付き金属基板およびそれを用いた表面実装デバイス |
US20140238729A1 (en) * | 2013-02-26 | 2014-08-28 | Mediatek Inc. | Printed circuit board structure with heat dissipation function |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021060547A1 (ja) * | 2019-09-27 | 2021-04-01 | 株式会社デンソー | 電子装置 |
JP2021057373A (ja) * | 2019-09-27 | 2021-04-08 | 株式会社デンソー | 電子装置 |
JP7107295B2 (ja) | 2019-09-27 | 2022-07-27 | 株式会社デンソー | 電子装置 |
JP2021197509A (ja) * | 2020-06-17 | 2021-12-27 | Tdk株式会社 | 電子部品内蔵基板及びこれを備える電子機器 |
JP7342803B2 (ja) | 2020-06-17 | 2023-09-12 | Tdk株式会社 | 電子部品内蔵基板及びこれを備える電子機器 |
Also Published As
Publication number | Publication date |
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DE102015222576B4 (de) | 2022-04-21 |
US9425123B2 (en) | 2016-08-23 |
CN105633059A (zh) | 2016-06-01 |
JP6201966B2 (ja) | 2017-09-27 |
DE102015222576A1 (de) | 2016-05-25 |
US20160148856A1 (en) | 2016-05-26 |
CN105633059B (zh) | 2019-05-14 |
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