JP7102238B2 - 樹脂成形装置および樹脂成形品の製造方法 - Google Patents
樹脂成形装置および樹脂成形品の製造方法 Download PDFInfo
- Publication number
- JP7102238B2 JP7102238B2 JP2018110281A JP2018110281A JP7102238B2 JP 7102238 B2 JP7102238 B2 JP 7102238B2 JP 2018110281 A JP2018110281 A JP 2018110281A JP 2018110281 A JP2018110281 A JP 2018110281A JP 7102238 B2 JP7102238 B2 JP 7102238B2
- Authority
- JP
- Japan
- Prior art keywords
- molding die
- molding
- molded
- projecting
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000465 moulding Methods 0.000 title claims description 221
- 239000011347 resin Substances 0.000 title claims description 81
- 229920005989 resin Polymers 0.000 title claims description 81
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 230000007246 mechanism Effects 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 18
- 230000007723 transport mechanism Effects 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000001721 transfer moulding Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 15
- 210000000078 claw Anatomy 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14122—Positioning or centering articles in the mould using fixed mould wall projections for centering the insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018110281A JP7102238B2 (ja) | 2018-06-08 | 2018-06-08 | 樹脂成形装置および樹脂成形品の製造方法 |
PH12019000190A PH12019000190A1 (en) | 2018-06-08 | 2019-05-16 | Resin modling apparatus and method for manufacturing resin molded product |
MYPI2019002819A MY195116A (en) | 2018-06-08 | 2019-05-17 | Resin Molding Apparatus And Method For Manufacturing Resin Molded Product |
CN201910487033.6A CN110576567B (zh) | 2018-06-08 | 2019-06-05 | 树脂成形装置及树脂成形品的制造方法 |
TW108119624A TWI730336B (zh) | 2018-06-08 | 2019-06-06 | 樹脂成形裝置及樹脂成形品的製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018110281A JP7102238B2 (ja) | 2018-06-08 | 2018-06-08 | 樹脂成形装置および樹脂成形品の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019209665A JP2019209665A (ja) | 2019-12-12 |
JP2019209665A5 JP2019209665A5 (zh) | 2021-07-26 |
JP7102238B2 true JP7102238B2 (ja) | 2022-07-19 |
Family
ID=68810791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018110281A Active JP7102238B2 (ja) | 2018-06-08 | 2018-06-08 | 樹脂成形装置および樹脂成形品の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7102238B2 (zh) |
CN (1) | CN110576567B (zh) |
MY (1) | MY195116A (zh) |
PH (1) | PH12019000190A1 (zh) |
TW (1) | TWI730336B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7360369B2 (ja) * | 2020-08-28 | 2023-10-12 | Towa株式会社 | 樹脂成形装置、及び樹脂成形品の製造方法 |
JP7447050B2 (ja) | 2021-04-21 | 2024-03-11 | Towa株式会社 | 成形型、樹脂成形装置及び樹脂成形品の製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004253412A (ja) | 2003-02-18 | 2004-09-09 | Towa Corp | 電子部品の樹脂封止成形方法及び装置 |
JP2006049697A (ja) | 2004-08-06 | 2006-02-16 | Renesas Technology Corp | 半導体装置の製造方法及び成形金型 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6382717A (ja) * | 1986-09-26 | 1988-04-13 | Yazaki Corp | トランスファー成形型の金型装置 |
JPH0713985B2 (ja) * | 1988-02-05 | 1995-02-15 | 三菱電機株式会社 | 半導体装置の樹脂封止成形装置 |
JP2635193B2 (ja) * | 1990-01-23 | 1997-07-30 | 三菱電機株式会社 | 半導体装置の樹脂封止装置、樹脂封止方法及び樹脂封止型半導体装置 |
JPH03110845U (zh) * | 1990-02-27 | 1991-11-13 | ||
JPH06132336A (ja) * | 1992-10-16 | 1994-05-13 | Nippon Steel Corp | トランスファモールド装置 |
JP3611612B2 (ja) * | 1994-11-28 | 2005-01-19 | Towa株式会社 | 電子部品の樹脂封止成形用金型 |
SG11201508166RA (en) * | 2013-05-29 | 2015-12-30 | Apic Yamada Corp | Resin molding apparatus and resin molding method |
JP6062810B2 (ja) * | 2013-06-14 | 2017-01-18 | アピックヤマダ株式会社 | 樹脂モールド金型及び樹脂モールド装置 |
JP5934156B2 (ja) * | 2013-08-20 | 2016-06-15 | Towa株式会社 | 基板の搬送供給方法及び基板の搬送供給装置 |
JP6321482B2 (ja) * | 2013-09-26 | 2018-05-09 | エイブリック株式会社 | 半導体製造装置 |
JP6067832B1 (ja) * | 2015-12-24 | 2017-01-25 | エムテックスマツムラ株式会社 | 樹脂成形金型及び樹脂成形装置 |
-
2018
- 2018-06-08 JP JP2018110281A patent/JP7102238B2/ja active Active
-
2019
- 2019-05-16 PH PH12019000190A patent/PH12019000190A1/en unknown
- 2019-05-17 MY MYPI2019002819A patent/MY195116A/en unknown
- 2019-06-05 CN CN201910487033.6A patent/CN110576567B/zh active Active
- 2019-06-06 TW TW108119624A patent/TWI730336B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004253412A (ja) | 2003-02-18 | 2004-09-09 | Towa Corp | 電子部品の樹脂封止成形方法及び装置 |
JP2006049697A (ja) | 2004-08-06 | 2006-02-16 | Renesas Technology Corp | 半導体装置の製造方法及び成形金型 |
Also Published As
Publication number | Publication date |
---|---|
MY195116A (en) | 2023-01-11 |
PH12019000190A1 (en) | 2020-01-27 |
CN110576567A (zh) | 2019-12-17 |
JP2019209665A (ja) | 2019-12-12 |
TW202000417A (zh) | 2020-01-01 |
TWI730336B (zh) | 2021-06-11 |
CN110576567B (zh) | 2021-08-03 |
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