JP2019209665A - 樹脂成形装置および樹脂成形品の製造方法 - Google Patents
樹脂成形装置および樹脂成形品の製造方法 Download PDFInfo
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- JP2019209665A JP2019209665A JP2018110281A JP2018110281A JP2019209665A JP 2019209665 A JP2019209665 A JP 2019209665A JP 2018110281 A JP2018110281 A JP 2018110281A JP 2018110281 A JP2018110281 A JP 2018110281A JP 2019209665 A JP2019209665 A JP 2019209665A
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- 238000000465 moulding Methods 0.000 title claims abstract description 182
- 239000011347 resin Substances 0.000 title claims abstract description 84
- 229920005989 resin Polymers 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 230000007246 mechanism Effects 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 238000001721 transfer moulding Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 18
- 230000007723 transport mechanism Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 description 15
- 210000000078 claw Anatomy 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14122—Positioning or centering articles in the mould using fixed mould wall projections for centering the insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
たとえば、特許6094781号公報(特許文献1)には、被搬送物であるリードフレームの位置を所要位置に決める位置決めピンを有する搬送機構と、搬送機構の位置決めピンの先端と当接可能な案内部材を有する下金型とが開示されている(段落[0017]、[0018]、[0022]等)。
Claims (6)
- 金属部分を含む成形対象物をトランスファー成形する樹脂成形装置であって、
上成形型と、
前記上成形型に対向し、キャビティを含む下成形型と、
前記成形対象物を前記上成形型と前記下成形型との間に搬送する搬送機構と、
前記成形対象物の前記金属部分に対応する位置に設けられ、前記下成形型の上面から突出可能な第1の突出部材と、
前記キャビティの底面から突出可能な第2の突出部材と、
前記下成形型の上面からの前記第1の突出部材の突出量と前記キャビティの底面からの前記第2の突出部材の突出量とを独立して制御可能な駆動機構と、
前記下成形型を加熱可能な加熱機構とを備えた、樹脂成形装置。 - 前記駆動機構は、
第1の傾斜面を有する上楔部材と、
前記第1の傾斜面と対向する第2の傾斜面を有する下楔部材と、
前記第1の傾斜面と前記第2の傾斜面とが互いに摺動可能な状態で前記下楔部材を水平方向に移動させることが可能な駆動部とを含み、
前記下楔部材の水平方向の移動に伴なって前記上楔部材が鉛直方向に移動し、
前記第1の突出部材は前記上楔部材上に配置される、請求項1に記載の樹脂成形装置。 - 搬送機構を用いて金属部分および位置決め穴を含む成形対象物を上成形型と下成形型の間に搬送する工程と、
前記下成形型の上面から突出部材を突出させる工程と、
前記成形対象物の前記位置決め穴の位置と前記下成形型に設けられた位置決め部材の位置とを合わせた状態で、前記下成形型の上面から突出した前記突出部材に前記搬送機構から前記成形対象物を受け渡す工程と、
前記突出部材で前記成形対象物の前記金属部分を支持した状態で、前記突出部材を下方に駆動して前記成形対象物を前記下成形型に載置する工程と、
前記上成形型と前記下成形型とを型締めして前記成形対象物をトランスファー成形する工程と、
前記上成形型と前記下成形型とを型開きする工程とを含む、樹脂成形品の製造方法。 - 前記成形対象物を前記載置する工程は、前記突出部材で前記成形対象物の前記金属部分を支持した状態を一定時間維持してから、前記突出部材を下方に駆動して前記成形対象物を前記下成形型に載置する、請求項3に記載の樹脂成形品の製造方法。
- 前記下成形型の上面から前記突出部材を突出させる工程は、第1の傾斜面を有する上楔部材と、前記第1の傾斜面と対向する第2の傾斜面を有する下楔部材とを含む機構を用いて、前記第1の傾斜面と前記第2の傾斜面とを互いに摺動させながら前記下楔部材を第1の水平方向に移動させることに伴なって前記上楔部材を上昇させ、前記上楔部材上に配置された前記突出部材を上方に駆動することを含む、請求項3または請求項4に記載の樹脂成形品の製造方法。
- 前記突出部材を下方に駆動して前記成形対象物を前記下成形型に載置する工程は、前記下楔部材を前記第1の水平方向とは反対の第2の水平方向に移動させることに伴なって前記上楔部材を下降させ、前記上楔部材上に配置された前記突出部材を下方に駆動することを含む、請求項5に記載の樹脂成形品の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018110281A JP7102238B2 (ja) | 2018-06-08 | 2018-06-08 | 樹脂成形装置および樹脂成形品の製造方法 |
PH12019000190A PH12019000190A1 (en) | 2018-06-08 | 2019-05-16 | Resin modling apparatus and method for manufacturing resin molded product |
MYPI2019002819A MY195116A (en) | 2018-06-08 | 2019-05-17 | Resin Molding Apparatus And Method For Manufacturing Resin Molded Product |
CN201910487033.6A CN110576567B (zh) | 2018-06-08 | 2019-06-05 | 树脂成形装置及树脂成形品的制造方法 |
TW108119624A TWI730336B (zh) | 2018-06-08 | 2019-06-06 | 樹脂成形裝置及樹脂成形品的製造方法 |
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JP2018110281A JP7102238B2 (ja) | 2018-06-08 | 2018-06-08 | 樹脂成形装置および樹脂成形品の製造方法 |
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JP2019209665A true JP2019209665A (ja) | 2019-12-12 |
JP2019209665A5 JP2019209665A5 (ja) | 2021-07-26 |
JP7102238B2 JP7102238B2 (ja) | 2022-07-19 |
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JP2018110281A Active JP7102238B2 (ja) | 2018-06-08 | 2018-06-08 | 樹脂成形装置および樹脂成形品の製造方法 |
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JP (1) | JP7102238B2 (ja) |
CN (1) | CN110576567B (ja) |
MY (1) | MY195116A (ja) |
PH (1) | PH12019000190A1 (ja) |
TW (1) | TWI730336B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7447050B2 (ja) | 2021-04-21 | 2024-03-11 | Towa株式会社 | 成形型、樹脂成形装置及び樹脂成形品の製造方法 |
Families Citing this family (1)
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JP7360369B2 (ja) * | 2020-08-28 | 2023-10-12 | Towa株式会社 | 樹脂成形装置、及び樹脂成形品の製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01201927A (ja) * | 1988-02-05 | 1989-08-14 | Mitsubishi Electric Corp | 半導体装置の樹脂封止成形装置 |
JPH03110845U (ja) * | 1990-02-27 | 1991-11-13 | ||
JPH06132336A (ja) * | 1992-10-16 | 1994-05-13 | Nippon Steel Corp | トランスファモールド装置 |
JP2004253412A (ja) * | 2003-02-18 | 2004-09-09 | Towa Corp | 電子部品の樹脂封止成形方法及び装置 |
JP2006049697A (ja) * | 2004-08-06 | 2006-02-16 | Renesas Technology Corp | 半導体装置の製造方法及び成形金型 |
Family Cites Families (8)
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JPS6382717A (ja) * | 1986-09-26 | 1988-04-13 | Yazaki Corp | トランスファー成形型の金型装置 |
JP2635193B2 (ja) * | 1990-01-23 | 1997-07-30 | 三菱電機株式会社 | 半導体装置の樹脂封止装置、樹脂封止方法及び樹脂封止型半導体装置 |
JP3611612B2 (ja) * | 1994-11-28 | 2005-01-19 | Towa株式会社 | 電子部品の樹脂封止成形用金型 |
WO2014192456A1 (ja) * | 2013-05-29 | 2014-12-04 | アピックヤマダ株式会社 | 樹脂モールド装置および樹脂モールド方法 |
JP6062810B2 (ja) * | 2013-06-14 | 2017-01-18 | アピックヤマダ株式会社 | 樹脂モールド金型及び樹脂モールド装置 |
JP5934156B2 (ja) * | 2013-08-20 | 2016-06-15 | Towa株式会社 | 基板の搬送供給方法及び基板の搬送供給装置 |
JP6321482B2 (ja) * | 2013-09-26 | 2018-05-09 | エイブリック株式会社 | 半導体製造装置 |
JP6067832B1 (ja) * | 2015-12-24 | 2017-01-25 | エムテックスマツムラ株式会社 | 樹脂成形金型及び樹脂成形装置 |
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- 2018-06-08 JP JP2018110281A patent/JP7102238B2/ja active Active
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- 2019-05-16 PH PH12019000190A patent/PH12019000190A1/en unknown
- 2019-05-17 MY MYPI2019002819A patent/MY195116A/en unknown
- 2019-06-05 CN CN201910487033.6A patent/CN110576567B/zh active Active
- 2019-06-06 TW TW108119624A patent/TWI730336B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01201927A (ja) * | 1988-02-05 | 1989-08-14 | Mitsubishi Electric Corp | 半導体装置の樹脂封止成形装置 |
JPH03110845U (ja) * | 1990-02-27 | 1991-11-13 | ||
JPH06132336A (ja) * | 1992-10-16 | 1994-05-13 | Nippon Steel Corp | トランスファモールド装置 |
JP2004253412A (ja) * | 2003-02-18 | 2004-09-09 | Towa Corp | 電子部品の樹脂封止成形方法及び装置 |
JP2006049697A (ja) * | 2004-08-06 | 2006-02-16 | Renesas Technology Corp | 半導体装置の製造方法及び成形金型 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7447050B2 (ja) | 2021-04-21 | 2024-03-11 | Towa株式会社 | 成形型、樹脂成形装置及び樹脂成形品の製造方法 |
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Publication number | Publication date |
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JP7102238B2 (ja) | 2022-07-19 |
TWI730336B (zh) | 2021-06-11 |
MY195116A (en) | 2023-01-11 |
PH12019000190A1 (en) | 2020-01-27 |
TW202000417A (zh) | 2020-01-01 |
CN110576567A (zh) | 2019-12-17 |
CN110576567B (zh) | 2021-08-03 |
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