PH12019000190A1

PH12019000190A1 - Resin modling apparatus and method for manufacturing resin molded product

Info

Publication number: PH12019000190A1
Application number: PH12019000190A
Authority: PH
Inventors: Takafumi Takahashi; Keisuke Ogawa; Hiroyuki Kanamaru; Hiroki Kumami
Original assignee: Towa Corp
Priority date: 2018-06-08
Filing date: 2019-05-16
Publication date: 2020-01-27
Also published as: JP2019209665A; JP7102238B2; CN110576567A; MY195116A; CN110576567B; TW202000417A; TWI730336B

Abstract

There is provided a resin molding apparatus and a method for manufacturing a resin molded product, capable of positioning an object to be molded on a mold chase with high precision. The resin molding apparatus is a resin molding apparatus which transfer-molds an object to be molded, the object including a metal portion, and includes: an upper mold chase; a lower mold chase facing the upper mold chase and including a cavity; a transport mechanism configured to transport the object between the upper mod chase and the lower mold chase; a first protrusion member provided at a position corresponding to the metal portion of the object, and protrusible from an upper surface of the lower mold chase; a second protrusion member protrusible from a bottom surface of the cavity; a drive mechanism capable of controlling independently an amount by which the first protrusion member protrudes from the upper surface of the lower mold chase and an amount by which the second protrusion member protrudes from the bottom surface of the cavity; and a heating mechanism capable of heating the lower mold chase.

Description

J1022: 9190136 oo with lower first plate 51 and lower second plate 52. When protrusion members 100 — and 110 move upward, protrusion member 100 protrudes from upper surface 20a of © lower mold chase 20, and protrusion member 110 protrudes from bottom surface 21a of ry cavity 21. Note that protrusion members 100 and 110 protrude from upper surface - 20a and bottom surface 21a, respectively, by equal amounts. =

Protrusion member 100 is vertically driven with respect to lower first plate 51 = and lower second plate 52 by a drive mechanism described later. In one example, the Pot drive mechanism comprises a cotter mechanism including an upper wedge member 71 and a lower wedge member 73 shown in Fig. 4. As upper wedge member 71 and lower wedge member 73 move relative to each other in the horizontal direction, upper wedge member 71 moves upward. Protrusion member 100 has flange 100a pushed by upper wedge member 71 and thus moved upward together with upper wedge member 71. Thus, protrusion member 100 can move upward while lower first plate 51 and lower second plate 52 are stationary (and protrusion member 110 is also stationary).

That is, the resin molding apparatus according to the present embodiment allows protrusion member 100 and protrusion member 110 to protrude from upper surface 20a of lower mold chase 20 and bottom surface 21a of cavity 21, respectively, each in an amount controlled independently of the other.

Lower first plate S1 is a flat plate-like member that accommodates flange 100a of protrusion member 100 and a resilient member 77. Lower first plate 51 is fixed to lower second plate 52 and moves upward and downward together with lower second plate 52. Resilient member 77 is accommodated in lower first plate 51 together with flange 100a, and biases flange 100a downward. In one example, resilient member 77 comprises a leaf spring. When protrusion member 100 is driven upward, resilient member 77 is flexed by flange 100a, and when protrusion member 100 is driven downward, resilient member 77 biases flange 100a downward. Thus, protrusion member 100 is prevented from protruding above upper surface 20a of lower mold chase 20 except when protrusion member 100 is driven upward. Resilient member 77 may be, for example, a coiled spring. Further, resilient member 77 may be made of metal,

J1022: 9190136 = po rubber, or a composite of a plurality of materials. i.

Lower second plate 52 is located below lower first plate S1. Lower second w plate 52 accommodates upper wedge member 71 and lower wedge member 73. That on is, lower second plate 52 accommodates at least a portion of the drive mechanism driving protrusion member 100 upward and downward. -

Fig. 5A is a top view of lower mold chase 20 shown in Fig. 4 and Fig. 5B is a = cross sectional view corresponding to Fig. SA. In Fig. SA, a dashed-two dotted line Lod represents an example in size of an object to be molded 1. Object to be molded 1 in the present invention has, for example, a width of about 60 mm or more and 100 mm or less, a length of about 200 mm or more and 300 mm or less, and a thickness of about 0.1 mm or more and 0.3 mm or less. Object to be molded 1 may be an object with an

IC chip mounted thereon. Pitches between IC chips are, for example, about 3.5 mm or more and about 10.0 mm or less in a first direction, and about 7 mm or more and 10 mm or less in a direction orthogonal to the first direction. Fig. 5A shows an example of an arrangement of a plurality of protrusion members 100. Figs. 5A and 5B show an example in which protrusion member 100 is provided in a region (a peripheral region) surrounding a portion (a center region) in which cavity 21 is formed. Protrusion member 100 is not limited in position or number to the example shown in Figs. 5A and 5B, as a matter of course.

Fig. 6 is a side cross sectional view of the resin molding apparatus shown in Fig, 4. Drive mechanism 70 includes upper wedge member 71, lower wedge member 73, and a drive unit 75. Upper wedge member 71 has a first inclined surface 72. Lower wedge member 73 has a second inclined surface 74 facing first inclined surface 72.

Drive unit 75 can move lower wedge member 73 in the horizontal direction in a state with first inclined surface 72 and second inclined surface 74 slidable relative to each other. Upper wedge member 71 moves in the vertical direction as lower wedge member 73 moves in a horizontal direction (a direction indicated by an arrow 76). As has been described above, protrusion member 100 is disposed on upper wedge member 71, and accordingly, as upper wedge member 71 moves in the vertical direction,

J1022: 9190136 on = fn. protrusion member 100 also moves in the vertical direction. Drive unit 75 is provided outside lower mold chase holder 40. This can suppress an effect of the heat from wo heater 44 on drive unit 75, and hence failure. While in the example of Fig. 6 drive Li unit 75 is composed of an air cylinder or the like capable of causing lower wedge - member 73 to reciprocate, a drive mechanism, such as a servomotor, capable of ol controlling speed more precisely may be used. Furthermore, a plurality of lower - wedge members 73 may be driven by a single actuator, or one actuator may be Ia disposed for each lower wedge member 73. Further, rather than the wedge mechanism shown in Fig. 6, a cam mechanism or the like may for example be used to move protrusion member 100 in the vertical direction.

Hereinafter, with reference to Figs. 7 to 11, a resin molded product manufacturing method according to the present embodiment, which is an example of a resin molded product manufacturing method using the resin molding apparatus according to the present embodiment, will be described. Fig. 7 is a flow chart showing a method for manufacturing a resin molded product according to one embodiment of the present embodiment. As shown in Fig. 7, the method for manufacturing a resin molded product according to the present embodiment comprises the steps of: transporting an object to be molded between upper mold chase 10 and lower mold chase 20 (S10); causing a protrusion member to protrude from the lower mold chase (S20); passing the object from a transport mechanism to the protrusion member (S30); driving the protrusion member downward to place the object on the lower mold chase (S40); clamping the upper and lower mold chases together (S50); and unclamping the upper and lower mold chases (S60). Hereinafter, each step will more specifically be described.

Initially, as shown in the schematic cross-sectional view of Fig. 8, a transport mechanism 60 is used to transport between upper mold chase 10 and lower mold chase 20 an object to be molded 1 including a metal portion 2 and a positioning hole 3.

Note that object 1 may be preheated by a preheater (not shown) that operates with transport mechanism 60.

J1022: 9190136 7

Subsequently, protrusion member 100 is caused to protrude from upper surface I 20a of lower mold chase 20. Protrusion member 100 is caused to protrude by using a w drive mechanism 70 comprising upper wedge member 71 having first inclined surface wn 72 and lower wedge member 73 having second inclined surface 74 facing first inclined - surface 72. While first inclined surface 72 and second inclined surface 74 are slid = relative to each other, lower wedge member 73 is moved in a horizontal direction (a = direction indicated in Fig. 6 by an arrow 76), which moves upper wedge member 71 1 upward, and hence drives protrusion member 100 that is disposed on upper wedge member 71 upward to thus cause protrusion member 100 to protrude from upper surface 20a of lower mold chase 20. Resilient member 77 accommodated in lower first plate 51 is pushed by flange 100a of protrusion member 100 and thus resiliently deformed.

Thereafter, in a state in which positioning hole 3 of object to be molded | and positioning member 22 provided to lower mold chase 20 are positionally registered, object to be molded 1 is passed from transport mechanism 60 to protrusion member 100 protruding from upper surface 20a of lower mold chase 20. When transport mechanism 60 has a tab 61 released, object to be molded 1 is passed from transport mechanism 60 to protrusion member 100. In doing so, object to be molded 1 has positioning hole 3 receiving tapered portion 22a of positioning member 22 of lower mold chase 20. Further, object to be molded 1 has metal portion 2 supported by the tip of protrusion member 100. When transport mechanism 60 has tab 61 released, having object to be molded 1 and the tip of protrusion member 100 as close to each other in level as possible allows object 1 released from tab 61 to be immediately held by protrusion member 100 and thus positioned more precisely.

Subsequently, as shown in Fig. 9, with protrusion member 100 supporting metal portion 2 of object to be molded 1, protrusion member 100 is driven downward to place object to be molded 1 on lower mold chase 20.

Note that protrusion member 100 supports metal portion 2 of object to be molded 1 and heater 44 heats lower mold chase 20 and thus raises the temperature of

J1022: 9190136 7 = - bo lower mold chase 20. The heating temperature is, for example, 175°C. Object to be i. molded 1 receives radiant heat from lower mold chase 20 heated by heater 44. This 0 heats object to be molded 1 and thus maintains thermal expansion of object to be Lr molded 1 caused by preheating. -

Subsequently, protrusion member 100 is driven downward. Protrusion = member 100 is driven downward by moving upper wedge member 71 downward as - lower wedge member 73 is moved in a horizontal direction opposite to that indicated ion by arrow 76 (see Fig. 6). Lower wedge member 73 moves toward its initial position, and upper wedge member 71 moves downward. Resilient member 77 exerts resilient force to bias upper wedge member 71 downward to ensure that upper wedge member 71 moves downward and thus returns to its initial position. As upper wedge member 71 moves downward, protrusion member 100 disposed on upper wedge member 71 also moves downward.

Object to be molded 1 is placed on lower mold chase 20, as follows: linear portion 22b of positioning member 22 of lower mold chase 20 enters positioning hole 3 of object to be molded 1. When object to be molded 1 is accurately positioned on lower mold chase 20, object to be molded 1 has its electronic components such as an IC chip 4 accommodated in cavity 21 of lower mold chase 20. In this way, object to be molded 1 is positioned on lower mold chase 20.

Positioning member 22 has linear portion 22b provided to correspond to a position of positioning hole 3 in a state with object to be molded 1 sufficiently thermally expanded. When object to be molded 1 being passed from transport mechanism 60 to lower mold chase 20 separates from a preheater cooperating with transport mechanism 60, object to be molded 1 may have a reduced temperature and thus be deformed. In that case, object to be molded 1 may be thermally expanded insufficiently and thus no longer have positioning hole 3 of object to be molded 1 positionally accurately registered with positioning member 22 of lower mold chase 20.

If object to be molded 1 is placed on lower mold chase 20 in that condition, object to be molded 1 enters obliquely with respect to positioning member 22 or is caught by

J1022: 9190136 eT hod tapered portion 22a of positioning member 22, or the like, and object to be molded 1 is - thus registered with poor precision. As a result, object to be molded 1 may not be able w to be set at a prescribed position on lower mold chase 20. If object to be molded 1 Lr that cannot be set at the prescribed position on lower mold chase 20 is for example an - object with a small IC chip mounted thereon, the IC chip, a wire connecting the IC chip = to a lead frame, and/or the like may come into contact with a surface of the cavity of = lower mold chase 20. “d

The resin molding apparatus according to the present embodiment allows object to be molded 1 to receive radiant heat from lower mold chase 20 heated by heater 44, and thus be thermally expanded by a prescribed amount. As a result, positioning hole 3 of object to be molded 1 and positioning member 22 of lower mold chase 20 can be positionally precisely registered, and object to be molded 1 can be precisely positioned with respect to lower mold chase 20.

Further, when object to be molded 1 is moved downward at a smaller speed, that is, when object to be molded 1 is moved downward slowly, object to be molded 1 receives radiant heat for a relatively longer period of time from lower mold chase 20 heated by heater 44 and can thus be thermally expanded further sufficiently. Asa result, object to be molded 1 can be further precisely positioned with respect to lower mold chase 20.

When protrusion member 100 is thermally conductive, the heat from heater 44 is conducted via protrusion member 100 to metal portion 2 of object to be molded 1 supported by protrusion member 100. This allows object to be molded 1 to be further precisely positioned with respect to lower mold chase 20.

Furthermore, the state in which metal portion 2 of object to be molded 1 is supported by the tip of protrusion member 100 may be maintained for a determined period of time. This allows object to be molded 1 to be thermally expanded more sufficiently. As a result, object to be molded 1 can be further precisely positioned with respect to lower mold chase 20. The determined period of time is a period of time required for object to be molded 1 to have a shape so that there is no problem

71022: 9190136 - pos when object to be molded 1 thermally expanded is transfer-molded, and one example - thereof can be several seconds to several minutes. =

Furthermore, when causing protrusion member 100 protruding from upper i surface 20a of lower mold chase 20 to receive object to be molded 1 released from i transport mechanism 60 is compared with releasing object to be molded 1 from - transport mechanism 60 and placing object to be molded 1 directly on upper surface = 20a of lower mold chase 20, the former allows object to be molded 1 to fall from o transport mechanism 60 by a smaller distance than the latter. This also contributes to more precisely positioning object to be molded 1.

After object to be molded 1 is placed on lower mold chase 20, upper mold chase 10 and lower mold chase 20 are clamped together to transfer-mold object to be molded 1, as shown in Fig. 10. Initially, movable platen 300 and lower mold chase 20 are moved upward by press drive mechanism 600 to clamp upper mold chase 10 and lower mold chase 20 together. Subsequently, a resin material 6 supplied into a pot (not shown) provided in lower mold chase 20 is injected by using a plunger (not shown), and thus through a resin path 23 and cull 11 resin material 6 is transferred to cavity 21 of lower mold chase 20.

Subsequently, as shown in Fig. 11, upper mold chase 10 and lower mold chase are unclamped. In this step, initially, press drive mechanism 600 is moved 20 downward to drive lower mold chase 20 downward and thus unclamp upper mold chase 10 and lower mold chase 20. In doing so, clamper rod 46 is brought into contact with clamper positioning rod 47, and thus positionally fixed. Subsequently, when lower mold chase 20 is further moved downward, lower second plate 52 sandwiched by clamper head 45 is moved upward relative to lower mold chase holder 40. Thereby, protrusion members 100 and 110 fixed on lower second plate 52 protrude from upper surface 20a of lower mold chase 20 and bottom surface 21a of cavity 21, respectively, to thus release a resin molded product 5 from the mold. In doing so, protrusion members 100 and 110 function as ejector pins. Resin material 6 solidified at cull 11 is separated from resin molded product 5 and discarded.

J1022: 9190136 =

Subsequently, the resin material remaining in cavity 21 is removed, and the wi above-described manufacturing process is repeated to manufacture a new resin-molded ow product. 7

However, a portion of the resin material, dust and the like may not be removed i. 5 and thus remain in cavity 21. @

When protrusion member 110 protrudes from bottom surface 21a of cavity 21 = with the resin material or the like remaining in cavity 21, the resin material may adhere = to the vicinity of the tip of protrusion member 110 or intrude into a gap formed between bottom surface 21a of cavity 21 and protrusion member 110. When a resin molding apparatus having ejector pins all simultaneously driven in the vertical direction have protrusion members caused to protrude in a step other than a mold releasing step, the above-described problem may arise in the vicinity of protrusion members protruding from the bottom surface of the cavity.

In the present embodiment, in contrast, drive mechanism 70 allows protrusion member 100 and protrusion member 110 to each protrude in an amount controlled independently of the other, and thus allows protrusion member 100 to protrude without causing protrusion member 110 that is a package ejector pin to protrude. As a result, - when transport mechanism 60 passes object to be molded 1 protrusion member 100 alone protrudes so that adhesion of resin material 6 that is not removed from cavity 21 in previous resin molding and thus remains therein to protrusion member 110, intrusion thereof into a gap, and the like can be suppressed.

While the method for manufacturing a resin molded product described above is a die-down type method for which cavity 21 is provided in lower mold chase 20, the method for manufacturing a resin molded product according to the present invention is also applicable to a die-up type method for which a cavity is provided in an upper mold chase.

In the die-up type resin molded product manufacturing method, after mold chases are unclamped, a resin molded product is released by an ejector pin provided at the upper mold chase separately from a protrusion member provided to the lower mold

71022: 9190136 - = os fod chase. Therefore, the die-up type resin molded product manufacturing method is —- different from the die-down type resin molded product manufacturing method in that a © protrusion member for holding a product received from a transport mechanism to be Lr molded with resin does not function as an ejector pin when a resin molded product is - released from the mold. The other steps of the die-up method are substantially the - same as those of the die-down method, and will not be described specifically. =

The resin molding apparatus and method for manufacturing a resin molded © product according to the present embodiment allow object to be molded 1 ina sufficiently thermally expanded state to be placed on a mold chase and thus positioned on the mold chase with better precision.

Although the present invention has been described and illustrated in detail, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, the scope of the present invention being interpreted by the terms of the appended claims.

REFERENCE SIGNS LIST

1 object to be molded, 2 metal portion, 3 positioning hole, 4 IC chip, 5 resin molded product, 6 resin material, 10 upper mold chase, 11 cull, 12 recess, 20 lower mold chase, 20a upper surface, 21 cavity, 21a bottom surface, 22 positioning member, 22a tapered portion, 22b linear portion, 23 resin path, 30 upper mold chase holder, 31 upper heater plate, 32 upper heat insulating plate, 33 upper spacer plate, 34 heater, 40 lower mold chase holder, 41 lower heater plate, 42 lower heat insulating plate, 43 lower third plate, 44 heater, 45 clamper head, 46 clamper rod, 47 clamper positioning rod, 51 lower first plate, 52 lower second plate, 60 transport mechanism, 61 tab, 70 drive mechanism, 71 upper wedge member, 72 inclined surface, 73 lower wedge member, 74 inclined surface, 75 drive unit, 76 arrow, 77 resilient member, 100, 110 protrusion member, 100a flange, 200 upper fixed platen, 300 movable platen, 400 lower fixed platen, 500 support, 600 press drive mechanism, 1000 molding mechanism section, 2000 inloader, 3000 outloader, A molding unit, B inloader unit, C outloader unit.

J1022: 9190136 oo no

TITLE OF THE INVENTION ~

Resin Molding Apparatus and Method for Manufacturing Resin Molded -

Product .

BACKGROUND OF THE INVENTION Field of the Invention =

The present invention relates to a resin molding apparatus and a method for & manufacturing a resin molded product. .

Description of the Background Art

A transport mechanism which transports an object that is transported to a prescribed position of a mold of a resin molding apparatus is known.

For example, Japanese Patent No. 6094781 discloses a transport mechanism having a positioning pin which positionally determines an object that is transported, or a lead frame, to assume a prescribed position, and a lower mold chase having a guide member capable of abutting against a tip of the positioning pin of the transport mechanism (see paragraphs [0017], [0018] and [0022] etc.).

Furthermore, Japanese Patent Laying-Open No. 2012-044139 discloses that a semiconductor wafer to be molded is placed on a protruding pin which provides a force, which assists releasing the semiconductor wafer from a cavity of a molding portion, and subsequently, the semiconductor wafer is disposed in the cavity (see paragraphs

[0026] and [0027], etc.).

SUMMARY OF THE INVENTION

When performing transfer-molding using thermosetting resin, an object placed on a mold chase to be molded is heated to a prescribed temperature. The mold chase and the object to be molded are each provided with a positioning means, which is provided at a position predicated on a state in which the mold chase and the object are both thermally expanded. If the object thermally expands insufficiently in the step of placing the object on the mold chase, they are registered poorly in precision and the object may be unable to be disposed at a prescribed position of the mold chase. Asa result, for example, an IC chip, a wire connecting the IC chip to a lead frame, and/or

J1022: 9190136 - the like may come into contact with a surface of the cavity of the mold chase. ~

An object of the present invention is to provide a resin molding apparatus he capable of positioning an object to be molded on a mold chase with high precision, and . a method for manufacturing a resin molded product.

According to the present invention, a resin molding apparatus is a resin molding = apparatus which transfer-molds an object to be molded, the object including a metal & portion, and comprises: an upper mold chase; a lower mold chase facing the upper o mold chase and including a cavity; a transport mechanism configured to transport the object between the upper mold chase and the lower mold chase; a first protrusion member provided at a position corresponding to the metal portion of the object, and protrusible from an upper surface of the lower mold chase; a second protrusion member protrusible from a bottom surface of the cavity; a drive mechanism capable of controlling independently an amount by which the first protrusion member protrudes from the upper surface of the lower mold chase and an amount by which the second protrusion member protrudes from the bottom surface of the cavity; and a heating mechanism capable of heating the lower mold chase.

According to the present invention, a method for manufacturing a resin molded product comprises: transporting an object to be molded by a transport mechanism between an upper mold chase and a lower mold chase, the object including a metal portion and a positioning hole; causing a protrusion member to protrude from an upper surface of the lower mold chase; in a state in which the positioning hole of the object to be molded and a positioning member provided to the lower mold chase are positionally registered, passing the object from the transport mechanism to the protrusion member protruding from the upper surface of the lower mold chase; in a state with the protrusion member supporting the metal portion of the object, driving the protrusion member downward to place the object on the lower mold chase; clamping the upper mold chase and the lower mold chase together and transfer-molding the object; and unclamping the upper mold chase and the lower mold chase.

According to the present invention, the object to be molded can be placed on the

J1022: 9190136 = ed . mold chase with the object sufficiently thermally expanded. In addition, the i protrusion member protruding from the upper surface of the lower mold chase can be 0 driven downward at an appropriately controlled speed to place the object on the mold o chase while suppressing the object's positional displacement. As a result of the above, the object to be molded can be positioned on the mold chase with better precision. =

The foregoing and other objects, features, aspects and advantages of the present pt invention will become more apparent from the following detailed description of the = present invention when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a plan view generally showing a configuration of a resin molding apparatus according to an embodiment of the present invention.

Fig. 2 is a front view of a resin molding apparatus according to an embodiment of the present invention.

Fig. 3 is a partial cross-sectional view of the resin molding apparatus shown in

Fig. 2.

Fig. 4 is a partial cross-sectional view of the resin molding apparatus shown in

Fig. 2.

Fig. 5A is a top view of a lower mold chase shown in Fig. 4.

Fig. 5B is a cross sectional view corresponding to Fig. SA.

Fig. 6 is a side cross sectional view of the resin molding apparatus shown in Fig. 4.

Fig. 7 is a flow chart showing a method for manufacturing a resin molded product according to one embodiment of the present invention.

Fig. 8 is a diagram showing one step of the method for manufacturing a resin molded product according to one embodiment of the present invention.

Fig. 9 is a diagram showing one step of the method for manufacturing a resin molded product according to one embodiment of the present invention.

Fig. 10 is a diagram showing one step of the method for manufacturing a resin molded product according to one embodiment of the present invention.

71022: 9190136 o

Fig. 11 is a diagram showing one step of the method for manufacturing a resin wo molded product according to one embodiment of the present invention. v

DESCRIPTION OF THE PREFERRED EMBODIMENTS 0

Hereinafter, an embodiment of the present invention will be described. Note - that identical or equivalent components are identically denoted and may not be = described repeatedly. @

Note that in any embodiment described hereinafter, when numbers, amounts . and the like are referred to, the present invention is not necessarily limited in scope thereto unless otherwise specified. Furthermore, in the following embodiment(s), each component is not necessarily essential to the present invention unless otherwise specified.

Fig. 1 is a plan view generally showing a configuration of a resin molding apparatus according to an embodiment of the present invention. As shown in Fig. 1, resin sealing equipment according to the present embodiment includes, for example, a molding unit A including a molding mechanism section 1000 for resin-sealing a substrate on which a semiconductor chip is mounted, an inloader unit B including an inloader 2000 to supply a substrate to a mold chase of molding unit A, and an outloader unit C including an outloader 3000 to remove a molded product from the mold chase of molding unit A and an accommodating portion for accommodating the molded product.

Inloader 2000 and outloader 3000 move upward and downward as seen in Fig. 1.

Molding unit A, inloader unit B, and outloader unit C are detachably coupled to each other via a coupling mechanism such as a bolt or a pin. Although two molding units A are provided in the example of Fig. 1, the number of molding units A may be increased or decreased and thus adjusted depending on the amount of production.

There may be provided a single molding unit A or for example there may be provided an increased number of molding units A, e.g, four molding units A. That is, the resin sealing equipment of the present embodiment can be configured to be capable of increasing and decreasing the number of molding units.

Further, while the example of Fig. 1 shows molding unit A, inloader unit B and

J1022: 9190136 outloader unit C disposed in the stated order, for example a single master machine bea composed of molding unit A, inloader unit B and outloader unit C integrated together = and one or more slave machines including molding unit A alone may be placed side by - side to constitute the resin sealing equipment. ~

With reference to Figs. 2-4, a resin molding apparatus according to the present iy invention will be described. The resin molding apparatus is provided in molding = mechanism section 1000. -

Fig. 2 is a front view of the resin molding apparatus. The resin molding apparatus of the present embodiment is a resin molding apparatus for transfer-molding an object to be molded, which will be more specifically described hereinafter, including a metal portion such as a lead frame.

The resin molding apparatus of the present embodiment includes an upper fixed platen 200, a movable platen 300, and a lower fixed platen 400. Upper fixed platen 200 and lower fixed platen 400 are fixed to each other by a support 500. Support 500 may be a cylindrical support or a flat plate. Movable platen 300 can be moved vertically upward and downward between upper fixed platen 200 and lower fixed platen 400 by a press drive mechanism 600. Press drive mechanism 600 is a motive power generation mechanism which is disposed on an upper surface of lower fixed platen 400, and moves movable platen 300 upward and downward and generates a molding pressure. In the present embodiment, upper fixed platen 200 is fixed, and accordingly, movable platen 300 is movable relative to upper fixed platen 200.

An upper mold chase 10 is attached to a vertically lower side of upper fixed platen 200. A lower mold chase 20 is attached to a vertically upper side of movable platen 300. Lower mold chase 20 faces upper mold chase 10. By clamping upper mold chase 10 and lower mold chase 20 together, an object to be molded is molded with resin. The object to be molded is transported between upper mold chase 10 and lower mold chase 20 by a transport mechanism, which will be described later.

Fig. 2, showing upper mold chase 10 and an upper mold chase holder 30. Upper mold

J1022: 9190136 oo

LE bs - chase 10 includes a cull 11 and a recess 12. Cull 11 is a reservoir for reserving a resin ~ material in transfer-molding before the resin material is transferred to objects to be = molded that are located on right and left sides as seen in Fig. 3. Recess 12 is a space . which prevents lower mold chase 20 from having a positioning member (e.g., a positioning pin) (see Fig. 4) interfering in clamping upper mold chase 10 and lower = mold chase 20 together. ©

Upper mold chase holder 30 is a member for holding upper mold chase 10 on a oo lower surface of upper fixed platen 200. Upper mold chase holder 30 includes an upper heater plate 31, an upper heat insulating plate 32, and an upper spacer plate 33.

Upper heater plate 31 is a plate that accommodates a heater 34 (or an upper heating mechanism). Heater 34 is a heat source capable of heating upper mold chase 10.

Heater 34 extends in a direction normal to the plane of the sheet of Fig. 3. Upper heat insulating plate 32 is a member in the form of a plate located between upper heater plate 31 and upper fixed platen 200. It is preferable that upper heat insulating plate 32 be made of a less thermally conductive material to suppress thermal deformation of upper fixed platen 200 caused by heat received from heater 34. Upper spacer plate 33 is a plate disposed between upper heater plate 31 and upper mold chase 10.

Fig. 4 is a partial cross-sectional view of the resin molding apparatus illustrated in Fig. 2, showing lower mold chase 20, a lower mold chase holder 40, a lower first plate 51 and a lower second plate 52.

Lower mold chase 20 includes a cavity 21 and a positioning member 22.

Cavity 21 is a recess having a molding shape provided in lower mold chase 20.

Positioning member 22 is a member for positioning an object to be molded on an upper surface 20a (or a molding surface) of lower mold chase 20. Positioning member 22 has a conical tapered portion 22a located closer to a tip of the member, and a cylindrical linear portion 22b located closer to a foot portion of the member.

Lower mold chase holder 40 is a member for holding lower mold chase 20 on an upper surface of movable platen 300. Lower mold chase holder 40 includes a lower heater plate 41, a lower heat insulating plate 42, a lower third plate 43, a clamper

11022: 9190136 oe fr. head 45, and a clamper rod 46. Lower heater plate 41 is a plate that accommodates a - heater 44 (or a lower heating mechanism). Heater 44 is a heat source capable of = heating lower mold chase 20. Heater 44 extends in a direction normal to the plane of i the sheet of Fig. 4. Lower heat insulating plate 42 is a member in the form of a plate od located between lower heater plate 41 and movable platen 300. It is preferable that o lower heat insulating plate 42 be made of a less thermally conductive material to = suppress thermal deformation of movable platen 300 caused by heat received from - heater 44. Lower third plate 43 is a flat plate-like member arranged between lower second plate 52 and lower heater plate 41. Clamper head 45 is a member having a

U-shape formed to allow lower second plate 52 to fit thereto. Clamper rod 46 is a rod member fixed to clamper head 45.

Below clamper rod 46, a clamper positioning rod 47 is provided. Clamper positioning rod 47 is a rod member which abuts against clamper rod 46 to determine a position for a lowermost point of clamper head 45 and clamper rod 46.

The resin molding apparatus according to the present embodiment further comprises a protrusion member 100 (a first protrusion member) and a protrusion member 110 (a second protrusion member). Protrusion member 100 is drivable in the vertical direction and protrusible from upper surface 20a of lower mold chase 20.

Protrusion member 110 is protrusible from a bottom surface 21a of cavity 21.

Protrusion member 100 has a foot portion provided with a flange 100a. Protrusion member 100 may be formed of metal or ceramic, for example.

Protrusion member 100 is provided at a position corresponding to a metal portion (for example, a lead frame on which an IC chip is mounted) of the object to be molded. Protrusion member 110 is provided at a position corresponding to a resin molding portion of the object to be molded. Protrusion members 100 and 110 are pin members (ejector pins) which protrude upward after the object to be molded is molded with resin. By causing protrusion members 100, 110 to protrude, the resin molded product is released from lower mold chase 20.

Protrusion members 100 and 110 can be moved upward and downward together

Claims

71022: 9190136 ~ WHAT IS CLAIMED IS: -

1. A resin molding apparatus configured to transfer-mold an object to be molded, the object including a metal portion, the resin molding apparatus comprising: an upper mold chase; wo a lower mold chase facing the upper mold chase and including a cavity; - a transport mechanism configured to transport the object between the upper - mold chase and the lower mold chase; a first protrusion member provided at a position corresponding to the metal portion of the object, and protrusible from an upper surface of the lower mold chase; a second protrusion member protrusible from a bottom surface of the cavity; a drive mechanism capable of controlling independently an amount by which the first protrusion member protrudes from the upper surface of the lower mold chase and an amount by which the second protrusion member protrudes from the bottom surface of the cavity; and a heating mechanism capable of heating the lower mold chase.

2. The resin molding apparatus according to claim 1, wherein: the drive mechanism includes an upper wedge member having a first inclined surface, a lower wedge member having a second inclined surface facing the first 5 inclined surface, and a drive unit capable of moving the lower wedge member in a horizontal direction in a state with the first inclined surface and the second inclined surface slidable relative to each other; the upper wedge member moves in a vertical direction as the lower wedge 10 member moves in the horizontal direction; and the first protrusion member is disposed on the upper wedge member.

J1022; 9190136 oo Lr

3. A method for manufacturing a resin molded product, comprising: —- transporting an object to be molded by a transport mechanism between an upper 0 mold chase and a lower mold chase, the object including a metal portion and a LT positioning hole; - causing a protrusion member to protrude from an upper surface of the lower oO mold chase; = in a state in which the positioning hole of the object to be molded and a ped positioning member provided to the lower mold chase are positionally registered, passing the object from the transport mechanism to the protrusion member protruding from the upper surface of the lower mold chase; in a state with the protrusion member supporting the metal portion of the object, driving the protrusion member downward to place the object on the lower mold chase; clamping the upper mold chase and the lower mold chase together and transfer-molding the object; and unclamping the upper mold chase and the lower mold chase.

4. The method for manufacturing a resin molded product according to claim 3, wherein the step of driving the protrusion member downward to place the object on the lower mold chase includes maintaining the state with the protrusion member supporting the metal portion of the object for a period of time, and thereafter driving the protrusion 5 member downward to place the object on the lower mold chase.

5. The method for manufacturing a resin molded product according to claim 3 or 4, wherein the step of causing a protrusion member to protrude from the upper surface of the lower mold chase includes using a mechanism including an upper wedge member having a first inclined surface and a lower wedge member having a second 5 inclined surface facing the first inclined surface to slide the first inclined surface and the second inclined surface relative to each other, while moving the lower wedge member in a first horizontal direction to accordingly move the upper wedge member

71022: 9190136 i. Lr upward and hence drive upward the protrusion member disposed on the upper wedge B member - ~

6. The method for manufacturing a resin molded product according to claim 5, wherein the step of driving includes moving the lower wedge member in a second horizontal direction opposite to the first horizontal direction and thus moving the upper = wedge member downward to drive downward the protrusion member disposed on the ol upper wedge member.