JPS6382717A - Mold equipment of transfer molding tool - Google Patents

Abstract

PURPOSE:To contrive positioning and connection by exchanging only a chase block without exchanging the whole of mold equipment, by a method wherein the chase block is inserted into a fitting groove of the chase block provided on a master die set and the positioning is performed with either a stopper or a positioning pin. CONSTITUTION:Top force ejector pins 10, which are frequentable into and out of cavities (e) each provided on a chase block 9, are stuck to the bottom of a top force ejector plate 6 and pressed downward by springs 5 fitted to both sides of the top. The top force chase block 9 is fitted slidably into a T-shaped fitting groove 8a provided on a top force master die set 8 and a fitting depth is controlled by a stopper 8b provided on an end part of the fitting groove 8a. When the top force chase block 9 is fitted in an insertion groove 8a until the same abuts against the stopper 8b, a piston pin 28a of a cylinder 27 is fitted in a hole 9b, which is centered and connected with the top force master die set 8 of the top force.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mold device that allows the mold of a transfer mold to be easily replaced in an extremely short time.

[Conventional technology and problems]

In order to seal a semiconductor component with a resin, a method is used in which the semiconductor component is set in a cavity of a mold, a heated and softened resin is press-fitted into the cavity, and the resin is heated and hardened.

Generally, transfer molding is used for such molding, in which the resin is sent into the mold through a narrow gate.
．． The heating is uniform and the molded product cures uniformly, resulting in a product with good performance.The curing time is short and the dimensional accuracy is good.Since the softened and molten resin is injected, there is no possibility of damaging or deforming the inserted semiconductor parts. There's not much to do.

However, in the transfer molding method, as shown in FIGS. 6 and 7, the heated and pressurized resin material is pressed by a plunger a and is transferred from a supply bot b to a cavity via an auxiliary runner C and a gate d. Only the resin material press-fitted into the cavity e becomes a product.

Therefore, other residual materials cannot be reused, resulting in a low yield of resin materials.

In order to eliminate such drawbacks, recently, as shown in FIG.
A so-called multi-plunger type transfer molding mold has come to be used, in which a plunger corresponding to each supply bottle (b) and (b) is provided to reduce residual resin material.

A mold of this type is shown in FIG.

The mold is composed of a fixed upper mold l and a movable lower mold 2. On the upper mold side, an upper mold mounting plate 4 is attached to the lower surface of the cross-sectional plate 3, and a compression spring 5 is interposed on the lower surface of the upper mold mounting plate 4. The upper ejector plate 6 is arranged so as to be removable.

An upper mold master die set 8 and an upper mold chase block 9 fixed to the upper mold master die set 8 and having a cavity e are disposed below the ejector plate 6 with a gap 7 maintained therebetween.

10 passes through the upper mold master die set 8 and the upper mold chase block 9 and connects the base end to the upper ejector plate 6
The tip of each cavity e is a rainbow-shaped turpin fixed to the
The blade can move in and out of the supply pot b.

Also, the ejector plate 6 has a master die set 8.
An upper return pin 11 passing through is fixed.

Similar to the upper mold, the lower mold has a lower mold mounting plate 13 attached to the upper surface of the heat insulating plate 12, and a lower ejector plate 15 is disposed with a gap 14 in between.
A lower master die set 18 having a lower chase block 17 fixed to its upper surface via a spring 16 is disposed above the die set 5 .

The lower master die set 18 is provided with a guide bush 20 that fits into a guide pin 19 slidably provided on the upper master die set 8.

The second part is a plunger that passes through the lower master die set 18 and the lower chase block 17 and presses the resin supply post e of the lower chase block 17 using the equal pressure device 22.

An ejector pin 23 that passes through the lower chase block 17 and the lower master die set 18 and retracts from each cavity e, and a lower return pin 24 that abuts the upper return pin 11 are fixed to the lower ejector plate 15.

25 is an ejector bar that can press the lower ejector plate 15 upward.

In order to resin-seal a semiconductor component using the mold apparatus configured as described above, first open the upper and lower molds and fill the cavity e.
A semiconductor is set therein, a resin material is inserted into the supply pot e, and after the upper and lower molds are closed, the plunger 21 is pressed upward by the equal pressure device 22 to press fit the resin material into the cavity e.

Next, when the mold is opened, the ejector pins IO and 23 are pressed by the spring 5 and the ejector bar 25, respectively.
protrudes into the cavity e, and the product is ejected from the cavity e.

As described above, the same product can be produced one after another, but when switching to manufacturing another product, the chase block must be replaced with a chase block having a cavity of each product shape.

However, since the chase blocks for both the upper die and the lower die are bolted to the master die set, and the ejector pin passes through them, replacing only the chase block is extremely troublesome and requires a lot of replacement work. It takes time.

Furthermore, the chase blocks of the upper and lower molds are at high temperatures due to heating of the resin material, so the mounting bolts cannot be removed immediately.

Therefore, when replacing the mold, the entire upper and lower molds shown in FIG. 9 are replaced in their entirety, and there is a waste of having to prepare as many mold devices as there are types of each product.

Furthermore, if the positions or pitches of the plurality of plungers are different, the entire mold apparatus must be replaced regardless of the amount of setup time.

However, preparing the entire set of expensive mold equipment for each type of product is a heavy economic burden, requires a large amount of storage space for molds, and the equipment to be replaced is also heavy, making replacement work difficult. Become.

The present invention solves this problem, and completes the setup change of the mold by replacing a part of the mold equipment extremely easily and in a short time. The purpose of the present invention is to provide a mold device that is highly effective in molds having a similar structure.

[Means for solving problems]

In the present invention, upper and lower chase blocks, each of which accommodates an ejector plate to which an ejector pin and an ejector post are fixed in a vertically movable manner, are inserted into chase block insertion grooves provided in the upper and lower master die sets, respectively. They are removably positioned and locked to the upper and lower master die sets by positioning means such as stoppers or positioning pins.

[For production]

With the above configuration, the upper mold and lower mold chase blocks housing the ejector plate etc. can be made into a cassette type that can be inserted and removed from the upper mold and lower mold master die sets, respectively, and the molds can be replaced by the die set. This can be done by replacing only the upper mold and lower mold chase blocks housing the ejector plate etc. and positioning and locking them, without replacing the entire mold device.

〔Example〕

Embodiments of the present invention will be described with reference to the drawings.

Note that the same parts as in the conventional example are given the same reference numerals.

In the present invention, the plunger for pressurizing the material in the material supply pot is provided on the lower mold side, but the plunger may be provided on the upper mold side or on both sides of the upper mold and the lower mold.

In FIGS. 1 and 2, the upper mold ejector plate 6 has upper mold ejector posts 26 fixed to both sides of the lower surface thereof, which fit into the through holes of the upper mold chase block 9, and uses the upper mold ejector posts 26 as a guide for the upper mold chaser. It is housed in block 9 so that it can move up and down.

The upper ejector plate 6 has an upper ejector pin 10 fixed to its lower surface that can be retracted into each cavity e provided in the die block 9, and has springs 5 attached to both sides of the upper surface.
is pressed downward by.

The upper die chase block 9 is slidably fitted into a T-shaped fitting groove 8a provided in the upper die master die set 8.
The insertion depth is determined by the stopper 8 provided at the end of the insertion groove 8a.
regulated by b.

A recess 8c for positioning is provided at the center of the inner surface of the stopper 8b, and when the protrusion 9a provided at the center of the front end surface of the upper chase block 9 is fitted into the recess 8C, the front end of the upper chase block 9 (see Figure 4).

A hole 9b is bored at the rear of the upper chase block 9,
When the upper die chase block 9 is inserted into the insertion groove 8a until it contacts the stopper 8b, the piston pin 27a of the cylinder 27 attached to the upper die master die set 8 is fitted into the hole 9b, and the upper die chase block 9 is inserted into the insertion groove 8a. It is centered and locked to the upper master die set 8.

The upper die guide post 28 attached to the upper die master die set 8 fits with the lower die guide post 29 attached to the lower die master die set 18, and guides the core of the upper and lower die when the die is closed. (See Figure 1).

A handle 30 for pulling out and inserting is attached to the rear end surface of the upper chase block 9.

Similarly to the upper mold, the lower mold ejector plate 15 has an ejector pin 23 fixed thereto, and is biased downward by a spring 16.

A lower mold ejector post 25 lifts the lower mold ejector plate 15 upward.

The lower die chase block 17 is slidably fitted into the insertion groove 18a of the lower die master die set 18 mounted on the lower die mount 31, and the front portion is positioned by the convex portion 17a on the front end surface by the concave portion 18c of the stopper 18b. As in the case of the upper mold, the piston pin 32a of the cylinder 32 is fitted into the hole 17b drilled in the rear part, and the rear part is positioned and locked.

Further, a handle 33 for pulling out and inserting is attached to the rear end surface of the lower chase block 17.

The lower mold mount 31 and the lower mold master guisent 18 are provided with long holes 31a and 18d, respectively.
8d, the plunger 21 is inserted into the through hole provided in the lower die chase block 18 and the lower die ejector plate 15.

The plunger 21 is the lower transfer cylinder 34
The air is raised and lowered via the equal pressure device 22.

The lower transfer cylinder 34 may be of a screw type or an electric jack type as long as it moves the equal pressure device up and down.

To exchange molds based on product change using the mold device configured as above, first open the upper and lower molds,
The lower transfer cylinder 34 is shortened to lower the plunger 21, and then the piston pins 27a and 32a of the cylinders 27 and 32 are shortened to allow holes 9b and 1, respectively.
7b and release the upper die chase block 9 and lower die chase block 17.

Next, as shown in FIG. 3, grasp the handle 30 and pull out the upper chase block 9 along the insertion groove 8a.Similarly, the lower chase block is also pulled out along the insertion groove 18a, and the Insert the upper chase block 9 into the groove 8a
Insert it until it touches the stopper 8b.

The front portion of the upper chase block 9 is positioned by the projection 9a fitting into the recess 8C of the stopper Bb.

Next, the rear part of the upper chase block 9 is positioned and locked by extending the cylinder 27 and fitting the piston pin 27a into the hole 9b.

The lower die chase block 17 is also positioned and locked in the same manner.

The mold exchange is thus completed.

Next, in order to mold the product, as in the conventional example, the lower transfer cylinder 34 is extended and the plunger 2 is
1 is raised, the supply pot b formed on the upper end surface of the plunger 21 is filled with resin material, and a semiconductor is set in the cavity e, and the plunger 21 is further raised to fill the heated resin material into the cavity. The semiconductor is sealed with resin by press-fitting it into the hole e.

FIG. 4 shows another embodiment of the present invention, in which the fitting groove 8a
, 18a are inserted into the upper and lower chase blocks 9.
, 17 is performed using only the cylinder without using a stopper.

That is, the head of the piston 35a of the cylinder 35 fixed to the upper mold and lower mold master daicera) 8.18 side is tapered, and the same tapered shape is provided on the side surfaces of the upper mold and lower mold chase blocks 9 and 17. Piston head 35 in the recess
A is inserted to position and lock the upper pond and lower chase block.

〔effect〕

In the present invention, the ejector plate and the like for both the upper mold and the lower mold are compactly housed in the chase block, and the chase block is removably housed in the master die set, so that it can be positioned and locked in the master die set with a single touch. Mold replacement can now be completed extremely easily and in a short time, and the time-consuming and heavy labor required to replace the entire mold device as in the past is no longer necessary.

In addition, in the past, the entire mold equipment was expensive for the number of types of products to be molded, which placed a heavy economic burden (and required a large amount of mold storage space), but with the present invention, replacement can be done quickly and easily. This problem has been solved because it only needs to be a part of the mold device.

[Brief explanation of the drawing]

1 to 5 show embodiments of the present invention, FIG. 1 is a side view (cross-sectional view of main parts) of the mold device, FIG. 2 is a vertical cross-sectional view of the same,
Figure 3 is a longitudinal sectional view of the mold device in the mold open state;
The figure is a plan view of the master die set and chase block, FIG. 5 is a plan view of the same as above in another embodiment, FIG. 6 is a plan view showing a part of the mold surface of the lower mold, and FIG. 7 is a top view of the upper mold. 8 is a plan view showing a part of the mold surface of the lower mold, and FIG. 9 is a vertical sectional view of a conventional multi-plunger type mold device. be. 5... Spring, 6... Upper ejector plate, 8
...Upper master die set, 8a...Insertion groove, 8
b... Stopper, 8C... Concave portion, 9... Upper chase block, 9a... Convex portion, 9b... Hole, 10
... Upper ejector pin, 15... Lower ejector plate, 16... Spring, 17... Lower chase block, 17a... Convex portion, 17b... Hole, 18
... Lower master die set, 18a ... Insertion groove,
18b...stopper, 18c...recess, 18d...
... Long hole, 21 ... Plunger 122 ... Equal pressure mounting surface, 23 ... Lower ejector pin, 25 ... Lower ejector post, 26 ... Upper ejector post, 27.32 ...Cylinder 27a, 32a...
Piston pin, 28... Upper guide post, 29...
・Lower guide post, 30.33...Handle, 31...
・Lower mold frame, 34...Lower transfer cylinder, b...Supply post, e...Cavity.

Claims (1)

[Claims] A chase block that accommodates an ejector pin and an ejector plate to which an ejector post is fixed in a vertically movable manner is inserted into the chase block insertion groove provided in the master die set, and is attached to the master die set using positioning means such as a stopper or positioning pin. A mold device for a transfer molding mold characterized by being removably positioned and locked.