JPH05124069A - Molding die for electronic part - Google Patents

Abstract

PURPOSE:To decrease the number of units exchanged by composing a molding die of upper and lower die set sections and upper and lower chase sections when a plurality of kinds of electronic part packages are molded with a resin in the same die set section and exchanging the kinds only by exchanging the chase sections. CONSTITUTION:A pot section 16 and a plunger 11 vertically moved by a transfer mechanism 10 are incorporated into a bottom-force die set section 23. A lower chase section 27 has the pot section 16, a bottom-force cavity 14 communicated with a runner 13, an ejector pin 21 mold-releasing a molded form in the cavity 14 and a guide mechanism 22 for the ejector pin 21. An upper chase section 28 has an ejector pin 21 mold-releasing the molded form from a top-force cavity 19, a guide mechanism 22 for the ejector pin 21 and the runner 13. Upper and lower die set sections 23, 24 and the chase sections 27, 28 are dovetail-fitted, and positioned by a hold-down block. An electric heater 15 is fitted to the upper and lower die sets 23, 24 or further to the upper and lower chase sections 27, 28.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to exchange of molds for electronic component molds and exchange of chase.

[0002]

2. Description of the Related Art Next, a conventional electronic part molding die will be described with reference to the drawings. FIG. 5 shows a schematic view of an electronic component molding apparatus equipped with a conventional electronic component molding die.

The base bolster 1 and the fixed bolster 2 are connected by a plurality of guide posts 4, and the movable bolster 3 is slidably fitted and mounted on the guide post 4. Between the movable bolster 3 and the fixed bolster 2, an electronic component molding die according to a conventional technique described below,
The lower mold 5 and the upper mold 6 are mounted.

FIG. 6 is a cross-sectional explanatory view of a conventional electronic component molding die, and FIG. 8 is an explanatory diagram of an electronic component lead frame before molding. Electric heater 15,
Lower mold 5, and upper mold 6, which have already been heated to a predetermined temperature by
A plurality of electronic component substrates 34 are arranged at predetermined positions between the strip-shaped lead frames 7 and a thermosetting molding resin tablet 8 obtained by compressing and hardening thermosetting molding resin powder. After being placed in the pot 16, the movable bolster 3 having the lower mold 5 placed thereon is moved and abutted by the movable bolster transfer mechanism 9 in the direction of the fixed bolster 2 having the upper mold 6 placed thereon. Perform mold clamping.

Next, the transfer mechanism 10 raises the plunger 11, and the thermosetting molded resin tablet 8, which has been charged into the pot 16 and already heated and melted by the electric heater 15, the cull 12, the runner 13, After being injected and pressurized into the through lower mold cavity 14 and the upper mold cavity 19, they are thermally cured after a predetermined thermal curing time.

After a predetermined heat curing time, the movable bolster 3 is lowered to open the upper and lower molds. By the mold opening, the ejector pins 21 and the electronic component package after the thermosetting are released from the lower mold cavity 14 and the upper mold cavity 19, respectively.

FIG. 3 shows an electronic component lead frame taken out from the mold through the above steps. After the cull resin 30 and the runner resin 31 are removed, they are sent to respective steps such as cutting, molding, mark imprinting, and electrical characteristic inspection, which are post-steps. The completed electronic component is shown in FIG.

Next, a product type exchanging operation in the electronic component molding die according to the prior art will be described with reference to FIG. 7 which is a structural diagram and FIG. 6 which is a sectional explanatory diagram. Since resin molding is performed on multiple types of electronic component packages using the same die set section,
Units other than the upper and lower die set parts 32 and 33 are replaced. Specifically, the pot 16, the pot 16, through which the lower mold cavity 14, the ejector pin 21 for releasing the molded and cured electronic component from the mold, the guide mechanism 22 thereof, and the plunger 11 penetrate to form a cylinder shape,
And a runner 13, and a lower mold cavity 14 for communicating with the lower mold cavity 14 for molding an electronic component package.
7. Plunger 11 for penetrating the lower chase portion 17 and the pot portion 16 for transferring and pressing the thermosetting molding resin that has been melted by heating, and the plunger mechanism for connecting the plurality of plungers 11 with the transfer mechanism 10 as a drive source. 1
8, upper mold cavity 19, upper mold cavity 19, ejector pin 21 for separating mold component from mold, and guide mechanism 22, upper chase portion 20 including runner 13, and each of the above units and upper and lower die set portions 32 , 33, and exchange for each sampled product.

The upper and lower chase parts 17, 20 are respectively provided with a pressing block 29, and the die set parts 32, 33,
Positioned and fastened. Upper and lower die set parts 32, 3
3, the chase portions 17, 20, the plunger holder 18, and the transfer mechanism 10 are dovetail groove-fitted, respectively.

The electric heater 15, which is a heat source for heating, melting and curing the thermosetting molding resin, includes upper and lower die set parts 3
It is inserted and installed in 2, 33.

The above-described conventional electronic component mold dies and method for exchanging products have a drawback that many units need to be exchanged, and each unit is heavy, complicated and dangerous.

[0012]

SUMMARY OF THE INVENTION The problem to be solved is that the conventional electronic parts mold die replacement work involves many parts and weights, which is complicated and dangerous. ..

[0013]

As a method for solving the above problems, in the present invention, a thermosetting molding resin, which has been previously melted by being put into a pot heated by a heat source, is pressure-transferred by a plunger. It has at least one or more transfer, arranges the lower die chase portion in a freely fitable manner, and communicates with the lower die die set portion that is fastened to the press device main body, and the pot of the lower die die set portion. The lower mold has a lower cavity into which the thermosetting molding resin that has been transferred under pressure flows and molds and cures the electronic component package, and an ejector pin that separates the molded and cured electronic component package from the lower cavity and a guide mechanism for the ejector pin. Separate the lower chase part that can be fitted to the die set part, the upper cavity, and the molded electronic component package from the upper cavity. An upper die chase portion which has an ejector pin to be swung and a guide mechanism for the upper die chase portion and which can be fitted to the upper die die set portion, and the upper die chase portion which can be fitted to each other are fastened and fastened to the press device main body In the electronic part mold including the above four parts of the upper die set part, the electronic part mold for the target electronic part package is replaced by replacing only the upper and lower chase parts. Use a mold.

[0014]

Embodiment 1 Next, the present invention will be described with reference to the drawings. FIG. 1 is a schematic view of an electronic component molding apparatus equipped with an electronic component molding die according to the present invention. The base bolster 1 and the fixed bolster 2 are connected by a plurality of guide posts 4, and the movable bolster 3 is slidably fitted and mounted on the guide post 4. Between the movable bolster 3 and the fixed bolster 2, an electronic component molding die according to an embodiment of the present invention described below, a lower mold 25, and an upper mold 26 are mounted.

FIG. 2 is a cross-sectional explanatory view of an electronic component molding die according to an embodiment of the present invention, and FIG. 8 is an explanatory diagram of an electronic component lead frame before molding. Electric heater 1
5, a plurality of electronic component boards 34 are provided at predetermined positions between the lower mold 25 and the upper mold 26 which are already heated to a predetermined temperature by
After arranging the strip-shaped lead frame 7 and the thermosetting molding resin tablet 8 obtained by compressing and hardening the thermosetting molding resin powder in the pot 16, the lower mold 25 is placed. The movable bolster 3 mounted on the upper die 26 is transferred, abutted, and clamped in the direction of the fixed bolster 2 mounted on the upper die 26 by the movable bolster transfer mechanism 9.

Next, the transfer mechanism 10 raises the plunger 11, and the thermosetting molded resin tablet 8, which has been put into the pot 16 and already heated and melted by the electric heater 15, the cull 12, the runner 13, After being injected and pressurized into the through lower mold cavity 14 and the upper mold cavity 19, they are thermally cured after a predetermined thermal curing time.

After a predetermined heat curing time, the movable bolster 3 is lowered to open the upper and lower molds. Each of the upper and lower molds has an ejector mechanism for releasing the thermosetting molding resin from the mold. FIG. 3 shows an electronic component lead frame taken out from the mold through the above steps. After the cull resin 30 and the runner resin 31 are removed, they are sent to respective processes such as cutting, molding, marking of a mark, and inspection of electric characteristics, which are post-processes. The completed electronic component is shown in FIG.

Next, an electronic part molding die according to the present invention will be described with reference to a structural drawing FIG. 4 and a sectional explanatory drawing FIG.
Since a plurality of types of electronic component packages are resin-molded using the same die set portion, units other than the upper and lower die set portions 23 and 24 are replaced. Specifically, the lower mold cavity 14, the ejector pin 21 for separating the molded and cured electronic component from the lower mold cavity, and the guide mechanism 2 thereof.
2, a lower chase portion 27 including a lower mold cavity 14 that communicates with the pot 16 and the runner 13 to mold an electronic component package, and an ejector that separates the molded and cured electronic component from the upper mold cavity 19 The upper chase portion 28 including the pin 21, the guide mechanism 22 thereof, and the runner 13, and the above two units, the upper and lower die set portions 2
3, 24, exchange for each product type.

The upper and lower chase parts 27, 28 are respectively provided with a pressing block 29, and the die set parts 23, 24,
Positioned and fastened. Upper and lower die set parts 23, 2
4, and the chase portions 27, 28 are fitted with dovetail grooves, respectively.

The electric heater 15, which is a heat source for heating, melting and curing the thermosetting molding resin, includes upper and lower die set parts 2.
3, 24, or the upper and lower die set parts 23, 2
4 and upper and lower chase parts 27 and 28, respectively.

The pot part 16, the plunger 11 and the plunger holder 18 are always incorporated in the lower die set part 23, and no replacement is required even during the product type replacement work.

[0022]

The use of the electronic part mold according to the present invention reduces the number of units of the mold that need to be replaced at the time of product type replacement, which is complicated as compared with the conventional product type electronic part mold replacement work. Size and risk are reduced and work time is shortened.

[Brief description of drawings]

FIG. 1 is a schematic view of an electronic component molding apparatus equipped with an electronic component molding die according to the present invention.

FIG. 2 is an explanatory cross-sectional view of an electronic component molding die according to the present invention.

FIG. 3 is an explanatory diagram of an electronic component lead frame after molding.

FIG. 4 is a configuration diagram of an electronic component molding die according to the present invention.

FIG. 5 is a schematic view of an electronic component molding apparatus equipped with a conventional electronic component molding die.

FIG. 6 is an explanatory cross-sectional view of a conventional electronic component molding die.

FIG. 7 is a block diagram of an electronic component molding die according to a conventional technique.

FIG. 8 is an explanatory diagram of an electronic component lead frame before molding.

FIG. 9 Completed electronic component

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base bolster 2 Fixed bolster 3 Movable bolster 4 Guide post 5 Lower mold for electronic parts by conventional technology 6 Upper mold for electronic parts by conventional technology 7 Lead frame 8 Thermosetting molded resin tablet 9 Movable bolster transfer mechanism 10 Transfer mechanism 11 Plunger 12 Cull 13 Runner 14 Lower Mold Cavity 15 Electric Heater 16 Pot 17 Conventional Lower Chase 18 Plunger Holder 19 Upper Mold Cavity 20 Conventional Upper Chase 21 Ejector Pin 22 Ejector Pin Guide Mechanism 23 Lower Mold According to the Present Invention Die set part 24 Upper mold die set part according to the present invention 25 Electronic component mold lower mold according to the present invention 26 Electronic component mold upper mold according to the present invention 27 Lower chase part according to the present invention 28 Upper chase according to the present invention Part 29 Presser Block 30 Cull Resin 31 Runner Resin 32 Lower Die Set Part by Conventional Technology 33 Upper Die Set Part by Conventional Technology 34 Electronic Component Substrate

Claims (3)

[Claims] 1. A lower chase portion is arranged so that it can be fitted with at least one transfer for pressurizing and transferring a thermosetting molding resin, which is put into a pot heated in advance by a heat source and melted, with a plunger. Lower die set part that is tightened and fastened to the press body. The thermosetting molding resin, which communicates with the pot of the lower die set section and is pressure-transferred by the plunger, flows into the lower cavity for molding and curing the electronic component package and the electronic cavity package after molding and curing from the lower cavity. A lower die chase portion that has an ejector pin for releasing the die and a guide mechanism for the ejector pin and is arranged so as to be freely fitted into the lower die set portion. An upper die chase portion which has an ejector pin for separating the upper cavity and the molded electronic component package from the upper cavity and a guide mechanism for the ejector pin, and which is arranged so as to be freely fitted to the upper die set portion.
An upper die set portion in which the upper die chase portion is arranged so as to be fittable and is fastened to the press device main body. Above 4
In the electronic part molding die comprising parts, an electronic part molding die characterized in that the target electronic part package is exchanged by exchanging only the upper and lower chase parts. 2. The mold for an electronic component mold according to claim 1, wherein a heat source for melting and curing the thermosetting molding resin is arranged only in the die set portion. 3. A mold according to claim 1, wherein a heat source for melting and hardening the thermosetting molding resin is arranged in both the die set portion and the chase portion.