JP7095227B2 - 異方性導電フィルム - Google Patents

異方性導電フィルム Download PDF

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Publication number
JP7095227B2
JP7095227B2 JP2017084914A JP2017084914A JP7095227B2 JP 7095227 B2 JP7095227 B2 JP 7095227B2 JP 2017084914 A JP2017084914 A JP 2017084914A JP 2017084914 A JP2017084914 A JP 2017084914A JP 7095227 B2 JP7095227 B2 JP 7095227B2
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Japan
Prior art keywords
anisotropic conductive
conductive particles
conductive film
film
region
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JP2017084914A
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English (en)
Japanese (ja)
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JP2017204461A (ja
Inventor
恭志 阿久津
怜司 塚尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to JP2017084914A priority Critical patent/JP7095227B2/ja
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to KR1020207024477A priority patent/KR102308962B1/ko
Priority to KR1020237005740A priority patent/KR102621211B1/ko
Priority to CN201780025075.7A priority patent/CN109075471B/zh
Priority to PCT/JP2017/016245 priority patent/WO2017191774A1/ja
Priority to US16/096,255 priority patent/US10553554B2/en
Priority to KR1020187021397A priority patent/KR102149964B1/ko
Priority to KR1020217031177A priority patent/KR102502795B1/ko
Priority to TW106114400A priority patent/TWI740934B/zh
Priority to TW110132350A priority patent/TWI764821B/zh
Publication of JP2017204461A publication Critical patent/JP2017204461A/ja
Priority to US16/728,554 priority patent/US10714444B2/en
Priority to JP2022099633A priority patent/JP7788950B2/ja
Application granted granted Critical
Publication of JP7095227B2 publication Critical patent/JP7095227B2/ja
Priority to JP2025184149A priority patent/JP2026009264A/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01304—Manufacture or treatment of die-attach connectors using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01315—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01325—Manufacture or treatment of die-attach connectors using local deposition in solid form
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H10W72/01333—Manufacture or treatment of die-attach connectors using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01351—Changing the shapes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/232—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/324—Die-attach connectors having multiple side-by-side cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP2017084914A 2016-05-05 2017-04-23 異方性導電フィルム Active JP7095227B2 (ja)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP2017084914A JP7095227B2 (ja) 2016-05-05 2017-04-23 異方性導電フィルム
KR1020217031177A KR102502795B1 (ko) 2016-05-05 2017-04-24 이방성 도전 필름
CN201780025075.7A CN109075471B (zh) 2016-05-05 2017-04-24 各向异性导电膜
PCT/JP2017/016245 WO2017191774A1 (ja) 2016-05-05 2017-04-24 異方性導電フィルム
US16/096,255 US10553554B2 (en) 2016-05-05 2017-04-24 Anisotropic conductive film
KR1020187021397A KR102149964B1 (ko) 2016-05-05 2017-04-24 이방성 도전 필름
KR1020207024477A KR102308962B1 (ko) 2016-05-05 2017-04-24 이방성 도전 필름
KR1020237005740A KR102621211B1 (ko) 2016-05-05 2017-04-24 이방성 도전 필름
TW110132350A TWI764821B (zh) 2016-05-05 2017-05-01 異向性導電膜
TW106114400A TWI740934B (zh) 2016-05-05 2017-05-01 異向性導電膜
US16/728,554 US10714444B2 (en) 2016-05-05 2019-12-27 Anisotropic conductive film
JP2022099633A JP7788950B2 (ja) 2016-05-05 2022-06-21 異方性導電フィルム
JP2025184149A JP2026009264A (ja) 2016-05-05 2025-10-31 異方性導電フィルム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016092901 2016-05-05
JP2016092901 2016-05-05
JP2017084914A JP7095227B2 (ja) 2016-05-05 2017-04-23 異方性導電フィルム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022099633A Division JP7788950B2 (ja) 2016-05-05 2022-06-21 異方性導電フィルム

Publications (2)

Publication Number Publication Date
JP2017204461A JP2017204461A (ja) 2017-11-16
JP7095227B2 true JP7095227B2 (ja) 2022-07-05

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Family Applications (3)

Application Number Title Priority Date Filing Date
JP2017084914A Active JP7095227B2 (ja) 2016-05-05 2017-04-23 異方性導電フィルム
JP2022099633A Active JP7788950B2 (ja) 2016-05-05 2022-06-21 異方性導電フィルム
JP2025184149A Pending JP2026009264A (ja) 2016-05-05 2025-10-31 異方性導電フィルム

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JP2022099633A Active JP7788950B2 (ja) 2016-05-05 2022-06-21 異方性導電フィルム
JP2025184149A Pending JP2026009264A (ja) 2016-05-05 2025-10-31 異方性導電フィルム

Country Status (6)

Country Link
US (2) US10553554B2 (https=)
JP (3) JP7095227B2 (https=)
KR (4) KR102502795B1 (https=)
CN (1) CN109075471B (https=)
TW (2) TWI764821B (https=)
WO (1) WO2017191774A1 (https=)

Families Citing this family (10)

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Publication number Priority date Publication date Assignee Title
TWI862897B (zh) * 2014-11-17 2024-11-21 日商迪睿合股份有限公司 異向性導電膜及連接構造體
WO2017191772A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 フィラー配置フィルム
JP7095227B2 (ja) * 2016-05-05 2022-07-05 デクセリアルズ株式会社 異方性導電フィルム
KR102423362B1 (ko) * 2016-12-01 2022-07-20 데쿠세리아루즈 가부시키가이샤 접속 구조체
CN112823448B (zh) * 2018-10-31 2023-05-23 迪睿合株式会社 连接体的制备方法、各向异性接合薄膜、连接体
KR20210018700A (ko) * 2019-08-09 2021-02-18 삼성디스플레이 주식회사 접착 부재 및 이를 포함한 표시장치
KR102888155B1 (ko) * 2019-12-23 2025-11-19 엘지디스플레이 주식회사 표시 장치 및 상기 표시 장치를 제조하기 위한 방법
US12590194B2 (en) 2020-02-12 2026-03-31 Dexerials Corporation Anisotropic conductive film
JP7705020B2 (ja) * 2020-02-12 2025-07-09 デクセリアルズ株式会社 異方性導電フィルム
JP2023117329A (ja) 2022-02-10 2023-08-23 デクセリアルズ株式会社 導電フィルムの設計方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003286457A (ja) 2002-03-28 2003-10-10 Asahi Kasei Corp 異方導電性接着シートおよびその製造方法
JP2010251337A (ja) 2010-08-05 2010-11-04 Sony Chemical & Information Device Corp 異方性導電膜及びその製造方法並びに接続構造体
JP2010257983A (ja) 2005-08-04 2010-11-11 Hitachi Chem Co Ltd 異方導電フィルム巻重体
JP2015501506A (ja) 2011-09-15 2015-01-15 トリリオン サイエンス インコーポレイテッド マイクロキャビティキャリアベルト及びその製造方法
JP2015025104A (ja) 2013-07-29 2015-02-05 デクセリアルズ株式会社 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法
JP2016066573A (ja) 2013-11-19 2016-04-28 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1245824A (en) 1967-11-30 1971-09-08 Philips Electronic An Associat Improvements in or relating to optical deflection systems
JP2866573B2 (ja) * 1994-03-02 1999-03-08 雅弘 湯浅 クレー射撃用屋外表示盤
US6414397B1 (en) * 1998-12-02 2002-07-02 Seiko Epson Corporation Anisotropic conductive film, method of mounting semiconductor chip, and semiconductor device
KR20050070713A (ko) * 2003-12-30 2005-07-07 엘지.필립스 엘시디 주식회사 이방성 도전필름 절단장치 및 그 절단방법
CN105696138B (zh) * 2004-11-09 2019-02-01 得克萨斯大学体系董事会 纳米纤维纱线、带和板的制造和应用
KR100741956B1 (ko) * 2005-08-23 2007-07-23 주식회사 여의시스템 이방성도전 필름 본딩장치
JP4887700B2 (ja) 2005-09-09 2012-02-29 住友ベークライト株式会社 異方導電性フィルムおよび電子・電機機器
KR101240155B1 (ko) * 2006-04-27 2013-03-11 아사히 가세이 일렉트로닉스 가부시끼가이샤 도전 입자 배치 시트 및 이방성 도전 필름
JP5147048B2 (ja) 2007-07-25 2013-02-20 旭化成イーマテリアルズ株式会社 異方導電性フィルム
JP2009152160A (ja) * 2007-12-25 2009-07-09 Tokai Rubber Ind Ltd 粒子転写型およびその製造方法、粒子転写膜の製造方法ならびに異方性導電膜
JP2011029207A (ja) * 2010-11-02 2011-02-10 Sony Chemical & Information Device Corp フィルム積層体、フィルム積層体の貼付方法、フィルム積層体を用いた接続方法及び接続構造体
JP6185742B2 (ja) * 2013-04-19 2017-08-23 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP6151597B2 (ja) * 2013-07-29 2017-06-21 デクセリアルズ株式会社 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法
KR102697500B1 (ko) * 2013-11-19 2024-08-21 데쿠세리아루즈 가부시키가이샤 이방 도전성 필름 및 접속 구조체
JP6645730B2 (ja) * 2014-01-28 2020-02-14 デクセリアルズ株式会社 接続体及び接続体の製造方法
CN104698689B (zh) * 2015-04-07 2017-07-14 京东方科技集团股份有限公司 一种各向异性导电胶膜、显示装置及其返修方法
JP6859609B2 (ja) * 2015-05-27 2021-04-14 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
JP2017175093A (ja) * 2016-03-25 2017-09-28 デクセリアルズ株式会社 電子部品、接続体、電子部品の設計方法
JP7274811B2 (ja) * 2016-05-05 2023-05-17 デクセリアルズ株式会社 異方性導電フィルム
JP7095227B2 (ja) * 2016-05-05 2022-07-05 デクセリアルズ株式会社 異方性導電フィルム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003286457A (ja) 2002-03-28 2003-10-10 Asahi Kasei Corp 異方導電性接着シートおよびその製造方法
JP2010257983A (ja) 2005-08-04 2010-11-11 Hitachi Chem Co Ltd 異方導電フィルム巻重体
JP2010251337A (ja) 2010-08-05 2010-11-04 Sony Chemical & Information Device Corp 異方性導電膜及びその製造方法並びに接続構造体
JP2015501506A (ja) 2011-09-15 2015-01-15 トリリオン サイエンス インコーポレイテッド マイクロキャビティキャリアベルト及びその製造方法
JP2015025104A (ja) 2013-07-29 2015-02-05 デクセリアルズ株式会社 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法
JP2016066573A (ja) 2013-11-19 2016-04-28 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体

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