JP7086324B2 - 電力用半導体装置 - Google Patents

電力用半導体装置 Download PDF

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Publication number
JP7086324B2
JP7086324B2 JP2022517357A JP2022517357A JP7086324B2 JP 7086324 B2 JP7086324 B2 JP 7086324B2 JP 2022517357 A JP2022517357 A JP 2022517357A JP 2022517357 A JP2022517357 A JP 2022517357A JP 7086324 B2 JP7086324 B2 JP 7086324B2
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Prior art keywords
coating layer
semiconductor device
conductive coating
power semiconductor
insulating substrate
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JP2022517357A
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Japanese (ja)
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JPWO2021229673A1 (fr
Inventor
麻緒 澤川
仁崇 宮路
裕基 塩田
大 吉井
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of JPWO2021229673A1 publication Critical patent/JPWO2021229673A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022517357A 2020-05-12 2020-05-12 電力用半導体装置 Active JP7086324B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/018923 WO2021229673A1 (fr) 2020-05-12 2020-05-12 Dispositif à semi-conducteur de puissance

Publications (2)

Publication Number Publication Date
JPWO2021229673A1 JPWO2021229673A1 (fr) 2021-11-18
JP7086324B2 true JP7086324B2 (ja) 2022-06-17

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ID=78525473

Family Applications (1)

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JP2022517357A Active JP7086324B2 (ja) 2020-05-12 2020-05-12 電力用半導体装置

Country Status (2)

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JP (1) JP7086324B2 (fr)
WO (1) WO2021229673A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011142366A (ja) 2008-10-20 2011-07-21 Denso Corp 電子制御装置
WO2018159152A1 (fr) 2017-03-03 2018-09-07 三菱電機株式会社 Dispositif semi-conducteur

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6540324B2 (ja) * 2015-07-23 2019-07-10 富士電機株式会社 半導体モジュール及び半導体モジュールの製造方法
JP2018006569A (ja) * 2016-07-01 2018-01-11 三菱電機株式会社 半導体装置およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011142366A (ja) 2008-10-20 2011-07-21 Denso Corp 電子制御装置
WO2018159152A1 (fr) 2017-03-03 2018-09-07 三菱電機株式会社 Dispositif semi-conducteur

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Publication number Publication date
JPWO2021229673A1 (fr) 2021-11-18
WO2021229673A1 (fr) 2021-11-18

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