JP7079727B2 - 導電トラックの形成方法および装置 - Google Patents

導電トラックの形成方法および装置 Download PDF

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Publication number
JP7079727B2
JP7079727B2 JP2018509591A JP2018509591A JP7079727B2 JP 7079727 B2 JP7079727 B2 JP 7079727B2 JP 2018509591 A JP2018509591 A JP 2018509591A JP 2018509591 A JP2018509591 A JP 2018509591A JP 7079727 B2 JP7079727 B2 JP 7079727B2
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Japan
Prior art keywords
laser beam
substrate
cross
energy distribution
path
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JP2018509591A
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English (en)
Japanese (ja)
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JP2018525838A (ja
JP2018525838A5 (enExample
Inventor
ノース ブルトン，アダム
ジョン ヘンリー，サイモン
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M Solv Ltd
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M Solv Ltd
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Publication of JP2018525838A5 publication Critical patent/JP2018525838A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2018509591A 2015-08-18 2016-08-03 導電トラックの形成方法および装置 Active JP7079727B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1514655.8 2015-08-18
GB1514655.8A GB2541412B (en) 2015-08-18 2015-08-18 Method and Apparatus for Forming a Conductive Track
PCT/GB2016/052387 WO2017029472A1 (en) 2015-08-18 2016-08-03 Method and apparatus for forming a conductive track

Publications (3)

Publication Number Publication Date
JP2018525838A JP2018525838A (ja) 2018-09-06
JP2018525838A5 JP2018525838A5 (enExample) 2019-09-12
JP7079727B2 true JP7079727B2 (ja) 2022-06-02

Family

ID=54258784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018509591A Active JP7079727B2 (ja) 2015-08-18 2016-08-03 導電トラックの形成方法および装置

Country Status (8)

Country Link
US (1) US10882136B2 (enExample)
EP (1) EP3337636B1 (enExample)
JP (1) JP7079727B2 (enExample)
KR (1) KR102563985B1 (enExample)
CN (1) CN107921582B (enExample)
GB (1) GB2541412B (enExample)
TW (1) TWI694881B (enExample)
WO (1) WO2017029472A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6955932B2 (ja) * 2017-08-25 2021-10-27 株式会社ディスコ レーザービームプロファイラユニット及びレーザー加工装置
EP3624571A1 (en) * 2018-09-14 2020-03-18 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A process for the manufacturing of printed conductive tracks on an object and 3d printed electronics
CN115361785B (zh) * 2022-08-23 2025-03-21 广东工业大学 一种精细线路的制备方法及系统
GB2629349A (en) * 2023-04-24 2024-10-30 M Solv Ltd Apparatus and method for directing laser radiation onto a target, laser drilling apparatus and method
CN118016737B (zh) * 2024-01-24 2025-05-30 天合光能股份有限公司 太阳能电池及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004020140A1 (ja) 2002-08-30 2004-03-11 Sumitomo Heavy Industries, Ltd. レーザ加工方法及び加工装置
JP2006032916A (ja) 2004-06-14 2006-02-02 Semiconductor Energy Lab Co Ltd 配線基板、及び半導体装置、並びにその作製方法
JP2010145562A (ja) 2008-12-17 2010-07-01 Panasonic Corp パターン形成方法
JP2011194413A (ja) 2010-03-17 2011-10-06 Sony Corp 表面超微細凹凸構造を有する成形品の製造方法
JP2011249357A (ja) 2010-05-21 2011-12-08 Panasonic Electric Works Co Ltd 回路基板および回路基板の製造方法
WO2016075822A1 (ja) 2014-11-14 2016-05-19 富士機械製造株式会社 配線基板作製方法および配線基板作製装置

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GB2220502A (en) * 1988-07-09 1990-01-10 Exitech Ltd Excimer laser beam homogenizer system
JP3149450B2 (ja) 1991-04-04 2001-03-26 セイコーエプソン株式会社 薄膜トランジスタの製造方法及び製造装置
US6331692B1 (en) 1996-10-12 2001-12-18 Volker Krause Diode laser, laser optics, device for laser treatment of a workpiece, process for a laser treatment of workpiece
JP3436858B2 (ja) * 1997-02-27 2003-08-18 シャープ株式会社 薄膜太陽電池の製造方法
JP4663047B2 (ja) 1998-07-13 2011-03-30 株式会社半導体エネルギー研究所 レーザー照射装置及び半導体装置の作製方法
US6750423B2 (en) * 2001-10-25 2004-06-15 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method, laser irradiation apparatus, and method of manufacturing a semiconductor device
US20060003262A1 (en) * 2004-06-30 2006-01-05 Eastman Kodak Company Forming electrical conductors on a substrate
JP2006038999A (ja) * 2004-07-23 2006-02-09 Sumitomo Electric Ind Ltd レーザ照射を用いた導電性回路形成方法と導電性回路
CN100565806C (zh) * 2004-07-30 2009-12-02 株式会社半导体能源研究所 激光辐照装置和激光辐照方法
US7722422B2 (en) 2007-05-21 2010-05-25 Global Oled Technology Llc Device and method for improved power distribution for a transparent electrode
JP4601679B2 (ja) * 2008-02-21 2010-12-22 三洋電機株式会社 太陽電池モジュール
DE102008019636A1 (de) * 2008-04-18 2009-10-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bauteil mit Schweißnaht und Verfahren zur Herstellung einer Schweißnaht
KR20100080120A (ko) * 2008-12-31 2010-07-08 한국생산기술연구원 인쇄회로 소결방법
GB0900036D0 (en) 2009-01-03 2009-02-11 M Solv Ltd Method and apparatus for forming grooves with complex shape in the surface of apolymer
GB2474665B (en) * 2009-10-22 2011-10-12 M Solv Ltd Method and apparatus for dividing thin film device into separate cells
KR101114256B1 (ko) * 2010-07-14 2012-03-05 한국과학기술원 패턴 제조 방법
KR101247619B1 (ko) * 2011-08-29 2013-04-01 한국과학기술원 금속 나노입자 극미세 레이저 소결 장치 및 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004020140A1 (ja) 2002-08-30 2004-03-11 Sumitomo Heavy Industries, Ltd. レーザ加工方法及び加工装置
JP2006032916A (ja) 2004-06-14 2006-02-02 Semiconductor Energy Lab Co Ltd 配線基板、及び半導体装置、並びにその作製方法
JP2010145562A (ja) 2008-12-17 2010-07-01 Panasonic Corp パターン形成方法
JP2011194413A (ja) 2010-03-17 2011-10-06 Sony Corp 表面超微細凹凸構造を有する成形品の製造方法
JP2011249357A (ja) 2010-05-21 2011-12-08 Panasonic Electric Works Co Ltd 回路基板および回路基板の製造方法
WO2016075822A1 (ja) 2014-11-14 2016-05-19 富士機械製造株式会社 配線基板作製方法および配線基板作製装置

Also Published As

Publication number Publication date
GB2541412A (en) 2017-02-22
WO2017029472A1 (en) 2017-02-23
KR102563985B1 (ko) 2023-08-04
TW201718151A (zh) 2017-06-01
US20180236601A1 (en) 2018-08-23
CN107921582A (zh) 2018-04-17
EP3337636B1 (en) 2023-06-07
KR20180040594A (ko) 2018-04-20
US10882136B2 (en) 2021-01-05
CN107921582B (zh) 2020-02-07
GB2541412B (en) 2018-08-01
JP2018525838A (ja) 2018-09-06
GB201514655D0 (en) 2015-09-30
EP3337636A1 (en) 2018-06-27
TWI694881B (zh) 2020-06-01

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